David R Caplan

US Patent:

52301451, Jul 27, 1993

Filed:

Jul 15, 1992

Appl. No.:

7/914814

Inventors:

David I. Caplan - Madison NJ
Avishay Katz - Westfield NJ

Assignee:

AT&T Bell Laboratories - Murray Hill NJ

International Classification:

H05K 330

US Classification:

29835

Abstract:

A laser assembly including a diamond film submount is formed by anisotropically etching a localized indentation (recess) region in an originally completely planar face of the film. The region has one or pair of intersecting sidewalls preferably making the same angle between them as an angle made between a pair of sides of a laser device. After metallizing the remaining top face of the film, the bottom of the indentation region, and one or both of the sidewalls of the indentation region, the laser device is pushed into position in the recess with its above-mentioned pair of sides lying against one of the sidewalls and the metallization of the other sidewall, or lying against the metallization of both sidewalls; and the bottom of the laser device is quickly bonded by means of solder to the metallization on the bottom of the recess. Also, the metallization of the top face of the film is patterned using as a protective patterned mask a patterned electrically conducting layer having a prescribed resistivity, so that after further patterning it can serve as a resistor during normal electrical operation of the laser device.