David A Carlson

US Patent:

20180336722, Nov 22, 2018

Filed:

Feb 16, 2018

Appl. No.:

15/898399

Inventors:

- Bothell WA, US
David P. Carlson - Bothell WA, US

International Classification:

G06T 17/10
G06Q 30/02
G06F 17/50
G06T 17/20
G06Q 10/06
G06T 19/20
G06T 11/60
G06T 7/32
G06T 7/33

Abstract:

Methods and systems for roof estimation are described. Example embodiments include a roof estimation system, which generates and provides roof estimate reports annotated with indications of the size, geometry, pitch and/or orientation of the roof sections of a building. Generating a roof estimate report may be based on one or more aerial images of a building. In some embodiments, generating a roof estimate report of a specified building roof may include generating a three-dimensional model of the roof, and generating a report that includes one or more views of the three-dimensional model, the views annotated with indications of the dimensions, area, and/or slope of sections of the roof. This abstract is provided to comply with rules requiring an abstract, and it is submitted with the intention that it will not be used to interpret or limit the scope or meaning of the claims.

US Patent:

20140254292, Sep 11, 2014

Filed:

May 27, 2014

Appl. No.:

14/287890

Inventors:

- Coppell TX, US
David V. Carlson - Woodinville WA, US

Assignee:

STMicroelectronics, Inc. - Coppell TX

International Classification:

G11C 7/02
H01L 21/82

US Classification:

36518915, 438128

Abstract:

Described herein are various principles for designing, manufacturing, and operating integrated circuits having functional components and one or more metal interconnect layers, where the dimensions of signal lines of the metal interconnect layers are larger than dimensions of the functional components. In some embodiments, a signal line may have a width greater than a width of a terminal of a functional component to which the signal line is connected. In some embodiments, two functional components formed in a same functional layer of the integrated circuit may be connected to metal signal lines in different metal interconnect layers. Further, the metal signal lines of the different metal interconnect layers may overlap some distance.