David Wing Hong Chan

US Patent:

6506097, Jan 14, 2003

Filed:

Jan 16, 2001

Appl. No.:

09/764733

Inventors:

Bret W. Adams - Sunnyvale CA
Boguslaw A. Swedek - San Jose CA
Rajeev Bajaj - Fremont CA
Savitha Nanjangud - San Jose CA
Andreas Norbert Wiswesser - Mountain View CA
Stan D. Tsai - Fremont CA
David A. Chan - Sunnyvale CA
Fred C. Redeker - Fremont CA
Manoocher Birang - Los Gatos CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24B 100

US Classification:

451 5, 451 6, 451 9, 451 36, 451 57, 438692

Abstract:

An optical monitoring system for a two-step polishing process which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance traces indicate initial clearance of the metal layer, and polishing may halt when all of the reflectance traces indicate that oxide layer has been completely exposed.

US Patent:

6586814, Jul 1, 2003

Filed:

Dec 11, 2000

Appl. No.:

09/735084

Inventors:

Rajiv Patel - San Jose CA
David Chan - San Jose CA
Arvind Kamath - Mountain View CA
Ken Rafftesaeth - San Jose CA
Venkatesh P. Gopinath - Fremont CA

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

H01L 2900

US Classification:

257506, 257510, 438221, 438296, 438424

Abstract:

A shallow isolating trench is formed in a semiconductor wafer between active component areas to electrically isolate the active components from each other. The isolating trench is primarily formed of an insulating material, such as an oxide, in a recess formed into the wafer. An etch resistant material, such as BTBAS nitride, is placed over the insulating material in the recess. The etch resistant material protects the insulating material from erosion due to subsequent semiconductor fabrication process steps, so the integrity of the isolating trench and the planarity of the wafer are generally maintained.

US Patent:

6632124, Oct 14, 2003

Filed:

Jan 10, 2003

Appl. No.:

10/339959

Inventors:

Bret W. Adams - Sunnyvale CA
Boguslaw A. Swedek - San Jose CA
Rajeev Bajaj - Fremont CA
Savitha Nanjangud - San Jose CA
Andreas Norbert Wiswesser - Mountain View CA
Stan D. Tsai - Fremont CA
David A. Chan - Sunnyvale CA
Fred C. Redeker - Fremont CA
Manoocher Birang - Los Gatos CA

Assignee:

Applied Materials Inc. - Santa Clara CA

International Classification:

B24B 100

US Classification:

451 5, 451 6, 451 9, 451 36, 451 57, 438692

Abstract:

An optical monitoring system for a two-step polishing process which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance traces indicate initial clearance of the metal layer, and polishing may halt when all of the reflectance traces indicate that oxide layer has been completely exposed.

US Patent:

6939198, Sep 6, 2005

Filed:

Dec 27, 2002

Appl. No.:

10/330687

Inventors:

Boguslaw A. Swedek - San Jose CA, US
Bret W. Adams - Sunnyvale CA, US
Sanjay Rajaram - Sunnyvale CA, US
David A. Chan - Sunnyvale CA, US
Manoocher Birang - Los Gatos CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24B001/00
B24B049/00
B24B051/00

US Classification:

451 5, 451 6, 451 8, 451 41

Abstract:

A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.

US Patent:

7008875, Mar 7, 2006

Filed:

Nov 24, 2003

Appl. No.:

10/721769

Inventors:

Manoocher Birang - Los Gatos CA, US
Konstantin Y. Smekalin - Pleasanton CA, US
David A. Chan - Sunnyvale CA, US

Assignee:

Applied Materials Inc. - Santa Clara CA

International Classification:

H01L 21/302
H01L 21/461

US Classification:

438692, 438740

Abstract:

A CMP station can be closed loop controlled by using data obtained by an inline metrology station from a first polished wafer to affect the processing of subsequent polished wafers. The first wafer is polished and measured by the inline metrology station. The metrology station measures at various points the array dielectric thickness, field dielectric thickness, barrier residue thickness and metal residue thickness. The data is then inputted into an algorithm and polishing parameter outputs are calculated. The outputs are sent to the CMP station and used to supplement or replace the previous polishing parameters. Subsequent wafers are polished on the CMP station using the revised polishing parameters.

US Patent:

7069439, Jun 27, 2006

Filed:

Mar 3, 2000

Appl. No.:

09/936132

Inventors:

Liqun Chen - Bradley Stoke Bristol, GB
David Chan - Monte Sereno CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H04L 9/00

US Classification:

713172, 713159, 713185, 726 20, 726 26, 380251, 380255

Abstract:

Computing apparatus comprises a memory means storing the instructions of a secure process and an authentication process; a processing means arranged to control the operation of the computing apparatus including by executing the secure process and the authentication process; a user interface means arranged to receive user input and return to the user input; and an interface means for receiving a removable primary token and communication with the token. The token comprises a body supporting a token interface for communicating with the interface means, a token processor; and a token memory adapted to store token data including information for identifying the token and auxiliary token information identifying one or more authorized auxiliary tokens. The processing means is arranged to receive the identity information and the auxiliary token information from the primary token, to authenticate the toke using the authentication process and, if the token is successfully authenticated, permit a user to interact with the secure process via the user interface means. The processing means is arranged to repeatedly authenticate the primary toke and cause the computing platform to suspend interaction between the secure process and the user if authentication is not possible as a result of the removal of the primary token unless the primary token is replaced by an authorized auxiliary token.

US Patent:

7096204, Aug 22, 2006

Filed:

Oct 6, 2000

Appl. No.:

10/110280

Inventors:

Liqun Chen - Bristol, GB
Boris Balacheff - Bristol, GB
Roelf du Toit - Eldoraigne, ZA
Siani Lynne Pearson - Bristol, GB
David Chan - Monte Sereno CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

G06Q 99/00

US Classification:

705 74, 705 25, 705 65, 705 67, 705 41, 713150, 713155, 713156, 713159

Abstract:

A method of brokering a transaction between a consumer and a vendor by a broker, wherein the consumer, the broker and the vendor are all attached to a public network, the consumer having a secure token containing a true consumer identity. The method comprising the steps of: the consumer obtaining a temporary identity from the broker by using the true consumer identity from the secure token; the consumer selecting a purchase to be made from the vendor; the consumer requesting the purchase from the vendor and providing the temporary identity to the vendor; the vendor requesting transaction authorisation from the broker by forwarding the request and the temporary identity to the broker; the broker matching the temporary identity to a current list of temporary identities, and obtaining the true consumer identity; the broker providing authorisation for the transaction based on transaction details and true consumer identity.

US Patent:

7101251, Sep 5, 2006

Filed:

Jun 23, 2005

Appl. No.:

11/166022

Inventors:

Boguslaw A. Swedek - San Jose CA, US
Bret W. Adams - Sunnyvale CA, US
Sanjay Rajaram - Sunnyvale CA, US
David A. Chan - Sunnyvale CA, US
Manoocher Birang - Los Gatos CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24B 49/00
B24B 51/00
B24B 1/00

US Classification:

451 1, 451 6, 451 8, 451 41

Abstract:

A computer program product for process control in chemical mechanical polishing is described. The product includes instructions to cause a processor to receive a measurement of an initial pre-polishing thickness of a layer of a substrate from a metrology station, determine a value for a parameter of an endpoint algorithm from the initial thickness of the substrate, receive a monitoring signal generated from monitoring in-situ polishing of the substrate, process the monitoring signal to detect a signal feature indicating a final or intermediate endpoint and send instructions to stop polishing when an endpoint criterion is detected using the endpoint algorithm with the determined value for the parameter.