David Y Chang

US Patent:

6409391, Jun 25, 2002

Filed:

Mar 22, 2000

Appl. No.:

09/532300

Inventors:

David D. Chang - Encino CA

Assignee:

Cogent Light Technologies, Inc. - Santa Clarita CA

International Classification:

G02B 636

US Classification:

385 53, 385 55, 385 56, 385 60, 385 76, 385 77, 385115, 385139, 385 78

Abstract:

An adaptor assembly for coupling light guide connectors of varying configurations to a structure housing a source of focused light includes an internal adaptor having an internal optic guide element, a coupling structure, a housing, and a connector locking mechanism. The coupling structure can be inserted into and releasably retained within the structure housing the focused light. A light guide connector is inserted into a light guide receiving channel formed in the housing and is releasably retained therein by the connector locking mechanism. An internal optic guide element extends through the coupling structure to transmit focused light from the source of focused light to the light guide connector inserted into the connector-receiving channel. The housing includes heat dissipating elements to facilitate dissipation of heat generated at the interface between the optic guide element and the light guide of the connector. The adaptor assembly also includes a external adaptor having a body portion and an elongated insertion member.

US Patent:

6535625, Mar 18, 2003

Filed:

Sep 24, 1999

Appl. No.:

09/405236

Inventors:

David B. Chang - Tustin CA
James E. Drummond - Lincoln City OR
Jane F. Emerson - Irvine CA

Assignee:

Magnetus LLC - Irvine CA

International Classification:

G06K 900

US Classification:

382128, 600407

Abstract:

An apparatus having a coil of wire, energized by a repetitively pulsed radio frequency (RF) power source to provide electromagnetic fields to a region within a body. A scanning, directional hydrophone acoustically connected to the body, samples ultrasonic radiation generated by the RF fields at the RF frequency or twice the RF frequency induced from conductive spots. Signals from the hydrophone are analyzed with regard to their time of arrival relative to the RF pulses and with respect to their direction of arrival. These collected data are recorded and displayed as images of the spots within the region.

US Patent:

6555404, Apr 29, 2003

Filed:

Aug 1, 2000

Appl. No.:

09/629679

Inventors:

Randall L. Kubena - Oak Park CA
David T. Chang - Covina CA

Assignee:

HRL Laboratories, LLC - Malibu CA

International Classification:

H01L 2100

US Classification:

438 22, 438 52, 438 53, 438 51, 257417, 257418

Abstract:

A method of making a micro electromechanical gyroscope. A cantilevered beam structure, first portions of side drive electrodes and a mating structure are defined on a first substrate or wafer; and at least one contact structure, second portions of the side drive electrodes and a mating structure are defined on a second substrate or wafer, the mating structure on the second substrate or wafer being of a complementary shape to the mating structure on the first substrate or wafer and the first and second portions of the side drive electrodes being of a complementary shape to each other. A bonding layer, preferably a eutectic bonding layer, is provided on at least one of the mating structures and one or the first and second portions of the side drive electrodes. The mating structure of the first substrate is moved into a confronting relationship with the mating structure of the second substrate or wafer. Pressure is applied between the two substrates so as to cause a bond to occur between the two mating structures at the bonding or eutectic layer and also between the first and second portions of the side drive electrodes to cause a bond to occur therebetween.

US Patent:

6563184, May 13, 2003

Filed:

Aug 1, 2000

Appl. No.:

09/629680

Inventors:

Randall L. Kubena - Oak Park CA
David T. Chang - Covina CA

Assignee:

HRL Laboratories, LLC - Malibu CA

International Classification:

H01L 2982

US Classification:

257419, 257254, 257415, 257418

Abstract:

A method of making a micro electro-mechanical switch or tunneling sensor. A cantilevered beam structure and a mating structure are defined on a first substrate or wafer; and at least one contact structure and a mating structure are defined on a second substrate or wafer, the mating structure on the second substrate or wafer being of a complementary shape to the mating structure on the first substrate or wafer. At least one of the mating structures includes a protrusion extending from a major surface of at least one of said substrates. A bonding layer, preferably a eutectic bonding layer, is provided on at least one of the mating structures. The mating structure of the first substrate is moved into a confronting relationship with the mating structure of the second substrate or wafer. Pressure is applied between the two substrates so as to cause a bond to occur between the two mating structures at the bonding or eutectic layer. Then the first substrate or wafer is removed to free the cantilevered beam structure for movement relative to the second substrate or wafer.

US Patent:

6580138, Jun 17, 2003

Filed:

Aug 1, 2000

Appl. No.:

09/629682

Inventors:

Randall L. Kubena - Oak Park CA
David T. Chang - Calabasas CA

Assignee:

HRL Laboratories, LLC - Malibu CA

International Classification:

H01L 2982

US Classification:

257415, 257254, 257417, 257419

Abstract:

A method of making a micro electro-mechanical switch or tunneling sensor. A cantilevered beam structure and a mating structure are defined on an etch stop layer on a first substrate or wafer; and at least one contact structure and a mating structure are defined on a second substrate or wafer, the mating structure on the second substrate or wafer being of a complementary shape to the mating structure on the first substrate or wafer. A bonding layer, preferably a eutectic bonding layer, is provided on at least one of the mating structures. The mating structure of the first substrate is moved into a confronting relationship with the mating structure of the second substrate or wafer. Pressure is applied between the two substrates so as to cause a bond to occur between the two mating structures at the bonding or eutectic layer. Then the first substrate or wafer and the etch stop layer are removed to free the cantilevered beam structure for movement relative to the second substrate or wafer.

US Patent:

6619475, Sep 16, 2003

Filed:

Mar 21, 2002

Appl. No.:

10/104687

Inventors:

David Chang - Encino CA 90436

International Classification:

A63B 5504

US Classification:

2063156, 2063153, 211 702

Abstract:

A golf bag having a club-separating staggered honeycomb-like cell structure and a method for manufacturing is disclosed. The golf bag includes a plurality of individual hollow fabric-lined plastic or soft fabric tubes coupled to a top opening or collar, and confined or anchored by a bottom or base. The full-length tubing separates and protects the shafts of the golf clubs and prevent them from becoming entangled. The collar comprises a plurality of openings arranged in a honeycomb cell configuration. The cell openings are elongated to maximize the separation between club heads and also allow easy access for club retrieval and replacement. The base as configured keeps the lower end of the tubes in line with cell openings at the other end of the golf bag. The method of manufacturing consists of shaping, positioning and attaching a plurality of tubing to the collar and the base to form the honeycomb cell structure.

US Patent:

6674141, Jan 6, 2004

Filed:

Aug 1, 2000

Appl. No.:

09/629683

Inventors:

Randall L. Kubena - Oak Park CA
David T. Chang - Covina CA

Assignee:

HRL Laboratories, LLC - Malibu CA

International Classification:

H01L 2982

US Classification:

257417, 257587, 250234, 216 11

Abstract:

A three axis MEM tunneling/capacitive sensor and method of making same. Cantilevered beam structures for at least two orthogonally arranged sensors and associated mating structures are defined on a first substrate or wafer, the at least two orthogonally arranged sensors having orthogonal directions of sensor sensitivity. A resonator structure of at least a third sensor is also defined, the third sensor being sensitive in a third direction orthogonal to the orthogonal directions of sensor sensitivity of the two orthogonally arranged sensors and the resonator structure having a mating structure thereon. Contact structures for at least two orthogonally arranged sensors are formed together with mating structures on a second substrate or wafer, the mating structures on the second substrate or wafer being of a complementary shape to the mating structures on the first substrate or wafer. The mating structures of the first substrate are disposed in a confronting relationship with the mating structures of the second substrate or wafer. A eutectic bonding layer associated with one of the mating structures facilitates bonding between the respective mating structures.

US Patent:

6835587, Dec 28, 2004

Filed:

Aug 11, 2003

Appl. No.:

10/639289

Inventors:

Randall L. Kubena - Oak Park CA
David T. Chang - Covina CA

Assignee:

HRL Laboratories, LLC - Malibu CA

International Classification:

H01L 2100

US Classification:

438 48, 257414

Abstract:

A first axis MEM tunneling/capacitive sensor and method of making same. Cantilever beam structures for at least two orthogonally arranged sensors and associated mating structures are defined on a first substrate or wafer, the at least two orthogonally arrange sensors having orthogonal directions of sensor sensitivity. A resonator structure of at least a third sensor is also defined, the third sensor being sensitive in a third direction orthogonal to the orthogonal directions of sensor sensitivity of the two orthogonally arranged sensors and the resonator structure having a mating structure thereon. Contact structures for at least two orthogonally arranged sensors are formed together with mating structures on a second substrate or wafer, the mating structures on the second substrate or wafer being of a complementary shape to the mating structures on the first substrate or wafer.