David Edward Copeland

US Patent:

D509521, Sep 13, 2005

Filed:

Mar 31, 2004

Appl. No.:

29/202629

Inventors:

Alison C. Swift - San Jose CA, US
David John Copeland - Milton MA, US
Daniel J. Nelsen - Providence RI, US
Aidan John Petrie - Jamestown RI, US
Ryan Patrick White - Georgetown MA, US
Robert J. Garay - San Jose CA, US
Jacques Valiquette - San Jose CA, US

Assignee:

Swift Instruments, Inc. - San Jose CA

International Classification:

1606

US Classification:

D16131

US Patent:

D521037, May 16, 2006

Filed:

Jan 9, 2004

Appl. No.:

29/197068

Inventors:

Alison C. Swift - San Jose CA, US
David John Copeland - Milton MA, US
Bryan Brownlee Robertson - South Dartmouth MA, US
Aidan John Petrie - Jamestown RI, US
Michael E. Twist - Newport RI, US
Blaine Matthew Adams - Providence RI, US
Bruce Keith Mercer - Westwood MA, US

Assignee:

Swift Instruments, Inc. - San Jose CA

International Classification:

1606

US Classification:

D16133

US Patent:

D523047, Jun 13, 2006

Filed:

Jan 9, 2004

Appl. No.:

29/197105

Inventors:

Alison C. Swift - San Jose CA, US
David John Copeland - Milton MA, US
Aidan John Petrie - Jamestown RI, US
Blaine Matthews Adams - Providence RI, US
Michael E. Twist - Newport RI, US
Bruce Keith Mercer - Westwood MA, US
Bryan Brownlee Robertson - South Dartmouth MA, US

Assignee:

Swift Instruments, Inc. - San Jose CA

International Classification:

1606

US Classification:

D16133

US Patent:

7315414, Jan 1, 2008

Filed:

Mar 31, 2004

Appl. No.:

10/815967

Inventors:

Alison C. Swift - San Jose CA, US
David John Copeland - Milton MA, US
Daniel J. Nelsen - Providence RI, US
Aidan John Petrie - Jamestown RI, US
Ryan Patrick White - Georgetown MA, US
Robert J. Garay - San Jose CA, US
Jacques Valiquette - San Jose CA, US

Assignee:

Swift Instruments, Inc. - San Jose CA

International Classification:

G02B 21/26

US Classification:

359392, 359368

Abstract:

Systems and techniques relating to a microscope with an adjustable stage are described. A microscope includes a base, a support arm attached to and extending upwardly from the base, a head attached to the support arm, the head including a lens, and an eyepiece attached to the head. A stage is releasably attachable to the support arm between the head and the base at multiple locations, providing multiple working distances between a lower surface of the head and an upper surface of the stage. When the stage is attached to the support arm at a location, a working distance between the lower surface of the head and the upper surface of the stage is further adjustable to an either greater or lesser working distance. In another embodiment, microscopic and macroscopic viewing can both be provided using a lens changer with multiple lens positioned radially about an axis of rotation.

US Patent:

7619308, Nov 17, 2009

Filed:

May 2, 2008

Appl. No.:

12/114376

Inventors:

Vadim Gektin - San Jose CA, US
David W. Copeland - Mountain View CA, US

Assignee:

Sun Microsystems, Inc. - Santa Clara CA

International Classification:

H01L 23/12

US Classification:

257704, 257710, 257723, 257724, 257711, 257712, 257E23181

Abstract:

A multi-lid semiconductor package includes one or more die disposed on a substrate, an interconnect disposed on the substrate, one or more die lids, a die thermal interface between the one or more die and the corresponding die lid or lids, one or more substrate lids, and a substrate interface between the substrate and the corresponding substrate lid or lids. The multi-lid semiconductor package may include one or more discrete surface mount components disposed on the substrate. The multi-lid semiconductor package may include a sealant between the one or more die lids and the one or more substrate lids and the substrate. The one or more die lids and the one or more substrate lids may differ in construction, design, placement, and/or thermal performance.

US Patent:

7667967, Feb 23, 2010

Filed:

Aug 6, 2008

Appl. No.:

12/187190

Inventors:

David W. Copeland - Mountain View CA, US
Marlin R. Vogel - Fremont CA, US
Andrew R. Masto - San Jose CA, US

Assignee:

Sun Microsystems, Inc. - Santa Clara CA

International Classification:

H05K 7/20
G06F 1/20

US Classification:

361696, 36167947, 36167948, 3616795, 36167953, 361694, 361695, 361698, 361699, 361701, 16510433

Abstract:

A cooling system for a rack-mount server including at least one blade and a system enclosure includes a liquid cooling line, at least one heat exchanger connected to the liquid cooling line and including a plurality of fins divided into one or more sections of the plurality of fins, wherein the fin density of the plurality of fins varies over the one or more sections, and a plurality of fans configured to blow air through the at least one heat exchanger and cool the at least one blade in the rack-mount server.

US Patent:

7791194, Sep 7, 2010

Filed:

Apr 10, 2008

Appl. No.:

12/101077

Inventors:

Vadim Gektin - San Jose CA, US
David W. Copeland - Mountain View CA, US

Assignee:

Oracle America, Inc. - Redwood City CA

International Classification:

H01L 23/488

US Classification:

257734, 257673, 257774, 257E23001

Abstract:

A composite interconnect system includes a plurality of carbon nanotubes, a plurality of solder balls and standoff balls disposed on a first device to provide a connection to a second device. A die-attached substrate includes a substrate and one or more die disposed on the substrate by a die-attach composite interconnect. The die-attach composite interconnect includes a plurality of carbon nanotubes, solder bumps, and standoff balls disposed on the die to provide one or more connections to the substrate. A PCB-attached substrate package includes a substrate package and one or more die disposed on the substrate package. The substrate package is disposed on a PCB by a PCB-attach composite interconnect. The PCB-attach composite interconnect includes a plurality of carbon nanotubes, solder balls, and standoff balls disposed on the substrate package to provide one or more connections to the PCB.

US Patent:

7804687, Sep 28, 2010

Filed:

Aug 8, 2008

Appl. No.:

12/188734

Inventors:

David W. Copeland - Mountain View CA, US
Andrew R. Masto - San Jose CA, US
Marlin R. Vogel - Fremont CA, US

Assignee:

Oracle America, Inc. - Redwood City CA

International Classification:

H05K 7/20
F28F 7/00
H01L 23/34

US Classification:

361701, 361699, 361724, 361818, 165 804, 165 805, 16510433, 165181, 257714

Abstract:

A cooling system for a rack-mount server includes a fan disposed within the rack-mount server and configured to produce an airflow through the rack-mount server, and a heat exchanger disposed within the rack-mount server in a path of the airflow through the rack-mount server. The heat exchanger includes a liquid circulation path structure and an airflow path structure. The airflow path structure is configured to shield electromagnetic interference.