David Lee Douglas

US Patent:

8390109, Mar 5, 2013

Filed:

Feb 17, 2011

Appl. No.:

13/029825

Inventors:

Darko R. Popovic - San Diego CA, US
Matthew D. Giere - San Diego CA, US
Bruce M. Guenin - San Diego CA, US
Theresa Y. Sze - San Diego CA, US
Ivan Shubin - San Diego CA, US
John A. Harada - Mountain View CA, US
David C. Douglas - Palo Alto CA, US
Jing Shi - Carlsbad CA, US

Assignee:

Oracle America, Inc. - Redwood Shores CA

International Classification:

H01L 25/07
H01L 21/60

US Classification:

257686, 257E25016, 257E21506, 257685, 257723, 257777, 257778, 257734, 257738, 257728, 257684, 257784, 257773, 257774, 257690

Abstract:

In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a ‘plank stack’) are separated by a mechanical spacer (such as a filler material or an adhesive). Moreover, the chip package includes a substrate at a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the substrate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as: solder, stud bumps, plated traces, wire bonds, spring connectors, a conductive adhesive and/or an anisotropic conducting film. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the substrate.

US Patent:

8487429, Jul 16, 2013

Filed:

Sep 22, 2009

Appl. No.:

12/564822

Inventors:

Jing Shi - Carlsbad CA, US
David C. Douglas - Palo Alto CA, US

Assignee:

Oracle America, Inc. - Redwood Shores CA

International Classification:

H01L 23/34

US Classification:

257727, 257686, 257704, 257E2318

Abstract:

A multi-chip module (MCM) is described. This MCM includes two substrates, having facing surfaces, which are mechanically coupled. Disposed on a surface of a first of these substrates, there is a negative feature, which is recessed below this surface. A positive feature in the MCM, which includes an assembly material other than a bulk material in the substrates, at least in part mates with the negative feature. For example, the positive feature may be disposed on the surface of the other substrate. Alternatively, prior to assembly of the MCM, the positive feature may be a separate component from the substrates (such as a micro-sphere). Note that the assembly material has a bulk modulus that is less than a bulk modulus of the material in the substrates. Furthermore, at least a portion of the positive feature may have been sacrificed when the mechanical coupling was established.