David R Ekstrom

US Patent:

20100184304, Jul 22, 2010

Filed:

Jan 8, 2010

Appl. No.:

12/684867

Inventors:

David R. Ekstrom - Oregon City OR, US

International Classification:

H01R 13/44
H01R 24/06
H01R 13/64

US Classification:

439 41, 439136, 29741

Abstract:

Retractable protection apparatus, and methods for use, provide protection for vertically oriented electrical connection pins from unintended bending, while further providing operability that allows protected pins to be uncovered to at least the extent necessary to make electrical connection with one or more connectors, and covered after coupling with the connectors is no longer required. In a further aspect, a locking mechanism is provided to prevent the retractable protection mechanism from retracting during shipping or similar handling. In a still further aspect, the retractable protection apparatus is segmented so that only selected portions of the vertically oriented electrical connection pins may be exposed for electrical access.

US Patent:

60439904, Mar 28, 2000

Filed:

Jun 9, 1997

Appl. No.:

8/871085

Inventors:

Morgan T. Johnson - Portland OR
David R. Ekstrom - Oregon City OR

Assignee:

Prototype Solutions Corporation - Beaverton OR

International Classification:

B23K 3102
B23K 3704
H05K 111

US Classification:

361803

Abstract:

A multiple circuit board package employing solder balls and method and apparatus for fabricating same is described. Two or more printed circuit boards and a plurality of electronic devices are joined together using solder balls. Alternatively, three or more printed circuit boards are joined together using the solder balls. A novel and improved solder ball connection is disclosed, along with a fixture for aligning and fixing the disposition of the pads and the solder balls during a heating cycle in which the circuit boards are placed under pressure while the solder balls are re-flowed for making an electrical connection.