David R. Ekstrom - Beverly MA Matthew L. Ekstrom - Beverly MA Richard P. Bennett - Danvers MA
Assignee:
Bematek Systems Inc - Beverly MA
International Classification:
B01F 704
US Classification:
366305, 366307
Abstract:
The present invention comprises an in-line mixer apparatus for creating output emulsions, homogeneous blends, suspensions and dispersions of pharmaceutical, biological, cosmetic, chemical and food compositions. The mixer includes a drive motor arranged around a support, the motor having an output shaft extending therefrom which is connectable to a drive head. A seal hub is arranged around the shaft, and a plurality of alternation foraminous stator plates and rotors are also arranged about the shaft. An inlet and an emulsion or dispersion discharge is arranged in the drive head. Each of the rotors comprises a plurality of projections for improved compound flow therepast, each projection having a leading cutting edge blade arranged at an acute angle with respect to a frame portion of said rotor member.
Retractable Protection Mechanism For Electrical Connection Pins
Retractable protection apparatus, and methods for use, provide protection for vertically oriented electrical connection pins from unintended bending, while further providing operability that allows protected pins to be uncovered to at least the extent necessary to make electrical connection with one or more connectors, and covered after coupling with the connectors is no longer required. In a further aspect, a locking mechanism is provided to prevent the retractable protection mechanism from retracting during shipping or similar handling. In a still further aspect, the retractable protection apparatus is segmented so that only selected portions of the vertically oriented electrical connection pins may be exposed for electrical access.
Multiple Board Package Employing Solder Balis And Fabrication Method And Apparatus
Morgan T. Johnson - Portland OR David R. Ekstrom - Oregon City OR
Assignee:
Prototype Solutions Corporation - Beaverton OR
International Classification:
B23K 3102 B23K 3704 H05K 111
US Classification:
361803
Abstract:
A multiple circuit board package employing solder balls and method and apparatus for fabricating same is described. Two or more printed circuit boards and a plurality of electronic devices are joined together using solder balls. Alternatively, three or more printed circuit boards are joined together using the solder balls. A novel and improved solder ball connection is disclosed, along with a fixture for aligning and fixing the disposition of the pads and the solder balls during a heating cycle in which the circuit boards are placed under pressure while the solder balls are re-flowed for making an electrical connection.
Systems And Methods For Generating And Preserving Vacuum Between Semiconductor Wafer And Wafer Translator
- Fremont CA, US Christopher T. Lane - Los Gatos CA, US David Ekstrom - Portland OR, US Morgan T. Johnson - Beaverton OR, US Douglas A. Preston - McMinnville OR, US
Systems and methods for testing semiconductor wafers using a wafer translator are disclosed herein. In one embodiment, an apparatus for testing semiconductor dies on a wafer includes a wafer translator having a wafer-side facing toward the wafer, and an inquiry-side facing away from the wafer-side. The wafer has an active side facing the translator. The apparatus includes a peripheral seal configured to seal a space between the wafer translator and the wafer, and a valve in a fluidic communication with the space between the wafer translator and the wafer.
Charter Oak Elementary School West Hartford CT 1971-1978, Talcott Junior High School West Hartford CT 1978-1979, Sedgwick Middle School West Hartford CT 1979-1980