Module Having Integrated Circuit Packages Coupled To Multiple Sides With Package Types Selected Based On Inductance Of Leads To Couple The Module To Another Component
A dual-sided circuit board module designed for an operating position that is not perpendicular to a system motherboard will be coupled to the motherboard by leads having at least two different lengths. Because leads of differing lengths have differing associated inductance, the operating characteristics of the leads and therefore the devices coupled to the leads will differ. In order to improve the operating characteristics of the module, integrated circuit packages are selected based on the inductive (and possibly other) qualities of the leads to which the respective packages are coupled. In one embodiment, leads having a larger inductance are coupled to integrated circuit (IC) packages having a smaller inductance and vice versa, which allows the inductive characteristics of the various components of the module to have more closely matching inductive characteristics than would otherwise be possible.
Karl H. Mauritz - Chandler AZ David W. Frame - Phoenix AZ
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01P 308
US Classification:
333 34, 333246, 333263
Abstract:
A signal transmission unit includes a first transmission line, a second transmission line, and a tapered transmission line coupling the first transmission line to the second transmission line. The tapered transmission line has a width and a length and the width changes along the length according to one or more functions. The one or more functions include but are not limited to linear functions, non-linear functions, hyperbolic functions, and exponential functions.
David W. Frame - Phoenix AZ, US Edward Butler - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G06F012/00
US Classification:
711106, 365222
Abstract:
A method of self-refresh in a memory array includes initializing a programmable refresh counter of a memory module to an offset value from at least another memory module in the memory array. A data line carrying a system-wide self-refresh indicator signal is interrogated to determine whether any memory module is in a self-refresh mode. The self-refresh mode for the memory module is entered if the programmable refresh counter indicates that a self-refresh cycle is due, and it is determined that no other memory modules are in the self-refresh mode.
Apparatus And Method For Coupling To A Memory Module
David W. Frame - Aloha OR, US Christopher J. Banyai - Chandler AZ, US Karl H. Mauritz - Chandler AZ, US Albert R. Nelson - Olympia WA, US Hany M. Fahmy - University Pl. WA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G06F 13/00
US Classification:
710100, 326 30
Abstract:
Briefly, in accordance with one embodiment of the invention, a system includes two boards coupled by a bus. The bus having a dual-terminated transmission line that communicatively couples a memory control hub with a memory repeater hub that each have a Rambus ASIC Cell (RAC). Briefly, in accordance with another embodiment of the invention, a connector has two metal traces that are of different lengths. The parasitic capacitance of the longer metal trace is increased so that the impedance of the two metal traces is substantially equal.
Electrical Solution To Enable High-Speed Interfaces
Karl Mauritz - Chandler AZ, US David Frame - Phoenix AZ, US
International Classification:
G06F012/00
US Classification:
365/189010, 365/052000, 711/100000, 714/733000
Abstract:
According to one embodiment of the present invention, a circuit is disclosed. The circuit includes: a plurality of memory modules; a memory controller coupled to the plurality of memory modules; a plurality of bus splitters coupled between the plurality of memory modules and the memory controller to split signals communicated between the plurality of memory modules and the memory controller; and a plurality of terminators to reduce signal reflections corresponding to the split signals.
Vincennes University Aug 25, 2014 - Oct 29, 2018
Assistant Professor of Electronics
Utah Valley University Aug 25, 2014 - Oct 29, 2018
Assistant Professor
Devry University Aug 2008 - Aug 2018
Visiting Professor Ii
Intel Corporation May 2016 - Aug 2016
Validation Engineer
Intel Corporation Feb 2008 - Aug 2014
Staff Electrical Validation Architect
Education:
Arizona State University 2000 - 2004
Master of Science, Masters, Computer Information Systems, Computer Systems
Indiana University Bloomington 1992 - 1997
Indiana University–Purdue University Indianapolis 1988 - 1991
Bachelors, Bachelor of Science
Vincennes University 1983 - 1986
Muncie Nothside High School
Monroe Central Junior - Senior High School
Indiana University
Indiana University–Purdue University Indianapolis
Oregon Graduate Institute
Skills:
Embedded Systems Hardware Architecture Debugging Analog Computer Architecture Semiconductors Microprocessors Hardware Microcontrollers Electronics Digital Electronics Systems Engineering Signal Integrity Soc Silicon Testing Circuit Design Firmware Vhdl Fpga Pcb Design Computer System Validation Robotics Sensors Ic Digital Signal Processors Analog Circuit Design Eda Python Programming Teaching Technology Python Field Programmable Gate Arrays Integrated Circuits Computer Hardware
Dec 2010 to 2000 Local Site CoordinatorJackson Hewitt Company
Dec 2009 to 2000 Seasonal Tax PreparerAmazon.com Fernley, NV Aug 2006 to Jan 2008 Warehouse AssociateComstock Airfreight Sparks, NV May 2005 to Aug 2006 Driver/CourierIntegrity Staffing Fernley, NV Sep 2004 to Apr 2005 Warehouse AssociateSundowner Hotel and Casino Reno, NV Feb 2001 to Nov 2003 Main Cage CashierUS Census Bureau Reno, NV Jul 1999 to Oct 2000 Field Office Operations SupervisorNorth State Security
May 1997 to Jan 1999 Security Officer and SupervisorWells Fargo Bank
Apr 1996 to May 1997 Phone Banker
Education:
University of Phoenix Hoenix, Az 2009 to 2011 Masters/Business Administration in AccountingUniversity of Phoenix Phoenix, AZ 2009 Bachelors in Business Administration/ Finance
Googleplus
David Frame
Work:
Orthopaedics - MD (1971-2011)
Education:
Washington University in St. Louis - Economics/psych, Temple University - Medicine, Northwestern University - Intern/resident, University of Pittsburgh - Resident
eruption of Mt. Pinatubo in 1991, which spewed sunlight-blocking particles into the atmosphere, as well as the collapse of industry in the Soviet Union or the economic growth of China, Stone and David Frame, of Victoria University Wellington in New Zealand, write in work published online today (Dec.
One of the certainties about predicting climate change is uncertainty, which is why climate change professor David Frame and 26 of his colleagues from around the world have tried to narrow things down.