David G Haas

US Patent:

6530147, Mar 11, 2003

Filed:

Nov 7, 2000

Appl. No.:

09/708131

Inventors:

David R. Haas - Westfield NJ
Chengzeng Xu - Morristown NJ
Mavyn McAuliffe - Morristown NJ

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H05K 300

US Classification:

29829, 29830, 29837, 216 65

Abstract:

This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed wiring boards with and without lased via holes. The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg and forming at least one via in the prepreg.

US Patent:

6673190, Jan 6, 2004

Filed:

Apr 4, 2001

Appl. No.:

09/826718

Inventors:

David Haas - Westfield NJ
Chengzeng Xu - Succasunna NJ
Mavyn McAuliffe - Waltham MA
Scott Zimmerman - Baskingridge NJ
Laura Miller - Mount Airy NC
Meifang Qin - Branchburg NJ
Baopei Xu - Tewksbury MA
Richard Pommer - Trabuco Canyon CA

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

B32B 3100

US Classification:

156289, 1563073, 29829, 29830

Abstract:

This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.

US Patent:

6908241, Jun 21, 2005

Filed:

Mar 16, 2004

Appl. No.:

10/800860

Inventors:

Philip M. Roth - Flanders NJ, US
Keith R. Ashley - Clark NJ, US
Yook Chan - South Amboy NJ, US
David J. Haas - Mahwah NJ, US
Igor Pankiw - Hillside NJ, US

Assignee:

Card Technology - Paramus NJ

International Classification:

G06K005/00

US Classification:

400521, 400188, 235380, 235449

Abstract:

A system for processing cards including a magnetic medium extending along one side of the cards and printing on both sides of the cards is disclosed. The system is a plurality of card processing stations () spaced along a card transport (′) extending between a card input and a card output. A first drive motor () drives a transmission () coupling the motor to a card drive associated with each station to transport the cards at each station during processing thereof. A second drive motor rotates a combined magnetic encoding and card flipping station. A controller controls operation of the stations and the first and second motors so that the combined magnetic encoding and flipping station flips the cards to a reverse orientation to print a second side.

US Patent:

20040016118, Jan 29, 2004

Filed:

Dec 19, 2002

Appl. No.:

10/326207

Inventors:

David Haas - Westfield NJ, US
Chengzeng Xu - Tewksbury MA, US

International Classification:

B32B003/00

US Classification:

029/852000, 029/847000, 428/210000

Abstract:

This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed wiring boards with and without lased via holes. The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg and forming at least one via in the prepreg.

US Patent:

20040170795, Sep 2, 2004

Filed:

Nov 17, 2003

Appl. No.:

10/715718

Inventors:

David Haas - Westfield NJ, US
Chengzeng Xu - Tewksbury MA, US
Mavyn McAuliffe - Waltham MA, US
Scott Zimmerman - Baskingridge NJ, US
Laura Miller - Mount Airy NC, US
Meifang Qin - Branchburg NJ, US
Baopei Xu - Wakefield MA, US
Richard Pommer - Trabuco Canyon CA, US

Assignee:

AlliedSignal Inc.

International Classification:

B32B027/02
B32B017/02
B32B009/00
B32B033/00

US Classification:

428/041800, 442/164000, 442/415000, 442/180000

Abstract:

This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.

US Patent:

6255039, Jul 3, 2001

Filed:

Apr 3, 1998

Appl. No.:

9/054264

Inventors:

Chengzeng Xu - Succasunna NJ
James T. Yardley - Morristown NJ
David Haas - Westfield NJ
Michael Vallance - La Crosse WI
Jeffrey T. Gotro - Onalaska WI
Michael A. Petti - Buffalo Grove IL

Assignee:

Isola Laminate Systems Corp. - LaCrosse WI

International Classification:

G03F 726

US Classification:

430318

Abstract:

High density built-up multilayer printed circuit boards are produced by constructing microvias with photoimageable dielectric materials. A photosensitive dielectric composition on a conductive foil is laminated to conductive lines on a core. After imaging the foil and imaging and curing the photosensitive dielectric composition, vias are formed to the conductive lines. Thereafter the conductive lines are connected through the vias to the conductive foil, and then the conductive foil is patterned.

US Patent:

51435772, Sep 1, 1992

Filed:

Feb 8, 1991

Appl. No.:

7/653332

Inventors:

David Haas - Springfield NJ
Hyun-Nam Yoon - New Providence NJ
Chia-Chi Teng - Piscataway NJ

Assignee:

Hoechst Celanese Corporation - Somerville NJ

International Classification:

B44C 122
B29C 3700
C23F 100

US Classification:

156625

Abstract:

This invention provides process embodiments for fabricating polymeric channel or rib optical waveguides. An invention optical waveguide has a channel or rib structure which has a polymer thin film smooth-wall lining on its surfaces to minimize optical loss by scattering of propagating wave energy. The smooth-wall channel waveguide polymeric medium is in combination with polymeric cladding thin films to form a laminated matrix. The polymers in the waveguiding medium and the lining and cladding thin films of the laminated matrix preferably have side chains which exhibit second order nonlinear optical susceptibility, and which can be molecularly oriented by an electric field.

US Patent:

51062119, Apr 21, 1992

Filed:

Feb 14, 1991

Appl. No.:

7/655015

Inventors:

Kophu Chiang - Edison NJ
David Haas - Springfield NJ

Assignee:

Hoechst Celanese Corp. - Somerville NJ

International Classification:

G02B 610
G03C 500
B23K 2600
H03F 700

US Classification:

385132

Abstract:

This invention provides polymeric chanel waveguides which are formed by means of an excimer laser photoablation procedure. The smooth-wall channel waveguides polymeric medium is in combination with polymeric cladding layers to form a laminated matrix. The polymers in the waveguiding medium and the cladding layers of the laminated matrix have side chains which exhibit second order nonlinear optical susceptibility, and which can be molecularly oriented by an electric field.