Skills:
TECHNICAL SKILLS AND EXPERIENCE Mechanical Testing: Dynamic Crack Propagation, Crack Path Selection, Fatigue Crack Growth (DCPD and Krak Gage), Toughness, High Temperature, Hardness Testing, Strain Gages Microscopy: AFM, SEM, EDS, EBSD, Laser Confocal Microscope, XRD, STM and XPS Thermal Analysis: DSC, TGA, TMA, and DTA CAE/FEA: Abaqus, Franc2D, Ansys Computing: Windows, Linux, MS Office, Excel, PowerPoint, JMP Programming: Python(Matplotlib, Numpy, Scipy, Abaqus), C/C++, Matlab, Labview Wafer Dicing: KNS 782/982