David P Hobson

US Patent:

48395870, Jun 13, 1989

Filed:

Mar 29, 1988

Appl. No.:

7/174697

Inventors:

Robert Flatley - Ashland MA
David Hobson - Waltham MA

Assignee:

Digital Equipment Corporation - Maynard MA

International Classification:

G01R 3102
G01R 3128

US Classification:

324158F

Abstract:

A test fixture for TAB (Tap Automated Bonding) circuits includes circuit boards for maintaining a characteristic impedance to inner lead bond areas of a circuit under test. A plurality of vertically disposed test pins are soldered to conductors in one of the circuit boards, and provide contacts for supplying power and test signals to test pads on a circuit under test. A thermoelectric heat pump is thermally connected to a circuit under test with a copper thermal chuck or heat spreader, and is used to subject the circuit to a wide range of operating temperatures. A two piece anvil is provided to apply pressure to the test pad/test pin interface and to the circuit die/thermal chuck interface.