David B Jensen

US Patent:

6720195, Apr 13, 2004

Filed:

May 15, 2002

Appl. No.:

10/145986

Inventors:

David G. Jensen - Kuna ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

G01R 3126

US Classification:

438 15, 438612

Abstract:

Aspects of the invention provide various methods and apparatus for delivering more reliable packaged microelectronic components. One embodiment provides a method in which packaged microelectronic components are heated to a reflow temperature of a selected solder before the solder is applied. After the solder is applied, the performance of the packaged microelectronic component can be tested and any packaged microelectronic component that fails to meet minimum performance criteria can be rejected as defective. Such a process may help identify microelectronic components that may pass normal testing procedures, but fail during a subsequent solder reflow operation. One embodiment provides a system that includes a suitable heating apparatus and a solder plating apparatus, with the heating apparatus being adapted to heat and cool packaged microelectronic components before they are delivered to the solder plating apparatus.

US Patent:

6878172, Apr 12, 2005

Filed:

Apr 13, 2004

Appl. No.:

10/823326

Inventors:

David G. Jensen - Kuna ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L021/00

US Classification:

29 2501, 228232, 324765

Abstract:

Aspects of the invention provide various methods and apparatus for delivering more reliable packaged microelectronic components. One embodiment provides a method in which packaged microelectronic components are heated to a reflow temperature of a selected solder before the solder is applied. After the solder is applied, the performance of the packaged microelectronic component can be tested and any packaged microelectronic component that fails to meet minimum performance criteria can be rejected as defective. Such a process may help identify microelectronic components that may pass normal testing procedures, but fail during a subsequent solder reflow operation. One embodiment provides a system that includes a suitable heating apparatus and a solder plating apparatus, with the heating apparatus being adapted to heat and cool packaged microelectronic components before they are delivered to the solder plating apparatus.

US Patent:

7080461, Jul 25, 2006

Filed:

Jan 20, 2004

Appl. No.:

10/762084

Inventors:

David G. Jensen - Auburn WA, US
David M. Pett - Seattle WA, US
Paul Buehler - Mill Creek WA, US

Assignee:

The Boeing Company - Chicago IL

International Classification:

G01D 21/00

US Classification:

33645, 33832, 3350105

Abstract:

A system, for installation of fastening systems to a structure, includes a fastening system installation specification, which includes dimensional and qualitative requirements for components of the fastening systems; and a tool. The tool includes an outer housing having an interior hollow, a gage surface, and a base surface, the base surface having a contact area that contacts the surface of the structure. An inner plug disposed within the interior hollow translates axially within the interior hollow. The inner plug has a sensing end that contacts a bolt of the fastening system and references the shank section of the bolt. The inner plug has an indicator end dimensioned to accept washers and nuts of the fastening system stacked on the gage surface. The inner plug has an indicator that provides installation information, according to either qualitative or dimensional requirements, about the components of the fastening system being installed using the tool.

US Patent:

7100299, Sep 5, 2006

Filed:

Jan 30, 2006

Appl. No.:

11/344324

Inventors:

David G. Jensen - Auburn WA, US
David M. Pett - Seattle WA, US
Paul Buehler - Mill Creek WA, US

Assignee:

The Boeing Company - Chicago IL

International Classification:

G01D 21/00

US Classification:

33645, 33832, 3350105

Abstract:

A system, for installation of fastening systems to a structure, includes a fastening system installation specification, which includes dimensional and qualitative requirements for components of the fastening systems; and a tool. The tool includes an outer housing having an interior hollow, a gage surface, and a base surface, the base surface having a contact area that contacts the surface of the structure. An inner plug disposed within the interior hollow translates axially within the interior hollow. The inner plug has a sensing end that contacts a bolt of the fastening system and references the shank section of the bolt. The inner plug has an indicator end dimensioned to accept washers and nuts of the fastening system stacked on the gage surface. The inner plug has an indicator that provides installation information, according to either qualitative or dimensional requirements, about the components of the fastening system being installed using the tool.

US Patent:

20040085355, May 6, 2004

Filed:

Oct 31, 2002

Appl. No.:

10/286392

Inventors:

Jeffrey Harmes - Bainbridge Island WA, US
David Jensen - San Diego CA, US
Michael Tominna - San Diego CA, US

International Classification:

G09G005/00

US Classification:

345/751000, 345/780000

Abstract:

A collaborative contract management system integrates the collaborative creation of contract documents, the collaborative negotiation of the contents of those documents, and the management of executed contracts, thereby enabling multiple parallel users to work collectively on the creation, negotiation, and management of contracts. The multiple parallel users communicate with a contract server to access a database containing electronic contracts documents arranged into a plurality of files based on a contract status. A graphical user interface presented through a display at any active user terminal includes graphical representations of the files. The multiple parallel users can easily navigate through the database using the graphical user interface to create and view contract documents, view relationships between contract documents, track versions of contracts, access documents for editing, copying, or annotating during negotiation, track executed documents, and otherwise manage executed contracts.

US Patent:

55522491, Sep 3, 1996

Filed:

Sep 30, 1994

Appl. No.:

8/315993

Inventors:

David G. Jensen - Auburn WA
Daniel R. Tichenor - Kent WA

Assignee:

The Boeing Company - Seattle WA

International Classification:

G03F 900

US Classification:

430 5

Abstract:

Parts having complexly curved, frequency selective surfaces can be manufactured with a high degree of precision using a three-dimensional conformal mask. The mask has a transparent substrate and a patterned opaque layer on the substrate. The layer may be patterned by laser ablation. Alternatively, the patterning of the opaque layer can be accomplished by applying a layer of photosensitive material over the opaque layer and then defining temporary and permanent areas thereof. The temporary areas of the photosensitive layer and the opaque layer are removed sequentially to define the transparent portions of the mask. Parts are made by intimately mating the mask and a part body to which a layer of metal and a layer of photosensitive material have been applied, and exposing the part to radiation through the mask. The exposed part is then chemically developed, the layer of metal is etched, and the remainder of the layer of photosensitive material is removed to complete the patterning of the part body surface. The mask is preferably made using a high precision laser etch system to sharply define the transparent portions of the mask and maximize the precision of the patterning on the subsequently made parts.

US Patent:

51243741, Jun 23, 1992

Filed:

Feb 22, 1988

Appl. No.:

7/159200

Inventors:

Anna L. Baker - Seattle WA
David G. Jensen - Seattle WA
Brad L. Kirkwood - Seattle WA

International Classification:

C08K 906

US Classification:

523212

Abstract:

A high temperature resistant structural composite composed of ceramic fibers and an organic resin is disclosed in which improved structural performance is obtained through modification of the surface of the ceramic fibers to improve the fiber to resin bond. The ceramic fibers are coated with silanol groups that re-establish hydroxyl sites to enable a difunctional organic coupling agent to bond a resin to the ceramic fibers more effectively.

US Patent:

56502494, Jul 22, 1997

Filed:

Jun 5, 1995

Appl. No.:

8/464252

Inventors:

Dennis L. Dull - Sumner WA
David G. Jensen - Auburn WA
Daniel R. Tichenor - Kent WA

Assignee:

The Boeing Company - Seattle WA

International Classification:

G03F 900

US Classification:

430 5

Abstract:

Radomes having complexly curved, frequency selective surfaces are made with a high degree of precision to assure part-to-part uniformity in electrical performance using a three-dimensional conformal mask and a precision etch process. The mask has a transparent substrate and a patterned opaque layer on the substrate. We expose photosensitive material overlying a thin film metal layer (generally deposited on a dielectric) through the mask. Metal exposed by patterning the photosensitive material is etched with a CuCl. sub. 2 and chloride salt solution, and the remainder of the layer of photosensitive material is removed to complete the patterning.