David Allen Lachtrupp

US Patent:

20020100956, Aug 1, 2002

Filed:

Jan 30, 2001

Appl. No.:

09/772377

Inventors:

Axel Brintzinger - Livermore CA, US
Chandrasekhar Narayan - Hopewell Junction NY, US
David Lachtrupp - Waterbury Ctr VT, US
Kenneth Arndt - Roselle IL, US

International Classification:

H01L029/00

US Classification:

257/529000

Abstract:

A semiconductor device has a first conductor and a second conductor for fuse terminals. A fuse portion is disposed on a different level relative to both the first conductor and the second conductor. A first contact connects the fuse portion to the first conductor, and a second contact connects the fuse portion to the second conductor.

US Patent:

62884360, Sep 11, 2001

Filed:

Jul 27, 1999

Appl. No.:

9/361960

Inventors:

Chandrasekhar Narayan - Hopewell Junction NY
Kenneth Arndt - Fishkill NY
Toshiaki Kirihata - Poughkeepsie NY
David Lachtrupp - Waterbury Center VT
Axel Brintzinger - Fishkill NY
Gabriel Daniel - Jamaica Estates NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2900

US Classification:

257529

Abstract:

A plurality of fuses of different types, each type of fuse serving a specific purpose are positioned on a semiconductor integrated circuit wafer, wherein activating one type of fuse does not incapacitate fuses of a different type. Fuses of the first type, e. g. , laser activated fuses, are primarily used for repairing defects at the wafer level, whereas fuses of the second type, e. g. , electrically activated fuses, are used for repairing defects found after mounting the IC chips on a module and stressing the module at burn-in test. Defects at the module level typically are single cell failures which are cured by the electrically programmed fuses to activate module level redundancies.