Mar 2012 to 2000 aviation machinestA.P.A. [email protected] Indianapolis, IN Aug 2011 to Mar 2012 Aviation Structural MechanicStrom aviation @Lockheed Greenville, SC Jul 2009 to Jul 2011 Aviation Structural MechanicLockheed martin
Sep 2008 to Jul 2009 structures mechanicGulfstream Aerospace Savannah, GA Feb 2002 to Jun 2008 sr. corrdinator //lower management//M A E Mobile, AL 1999 to 2002 Cargo conversion structures lead on 757 2001-2002Gulfstream Aerospace
1997 to 1999 STRUCTURES LEADU.S.Navy
1991 to 1997 Structures and hydraulics mechanic
Education:
WYTHE CO. V O C HIGH Wytheville, VA 1983 to 1985 MACHINE SHOPRURAL RETREAT HIGH Rural Retreat, VA 1981 to 1985
Nov 2009 to 2000 Inventory Associate / Support ManagerD.I.G Architecture Terre Haute, IN Nov 2006 to Dec 2008 CAD DesignerWal-Mart Avon, IN Dec 2003 to Nov 2006 Overnight Support ManagerCinergy/PSI Plainfield, IN Jan 2001 to Apr 2003 Real Estate SpecialistAnalytical Surveys Inc Indianapolis, IN Jun 1998 to Jan 2001 Digital Services SpecialistPizza Hut Indianapolis, IN May 1993 to Jun 1998 Shift Manager / Delivery driverBest Homes Indianapolis, IN Apr 1997 to Nov 1997 Draftsman
Education:
Ivy Tech State College Indianapolis, IN Aug 1993 to Aug 2000 AAS in Design TechnologyGeorge Washington High School Indianapolis, IN Aug 1989 to Jun 1993 High School Diploma in Math & Art
Abhijeet V. Chavan - Carmel IN James H. Logsdon - Kokomo IN Dan W. Chilcott - Greentown IN Han-Sheng S. Lee - Bloomfield Hills MI David K. Lambert - Sterling Heights MI Timothy A. Vas - Kokomo IN
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
G01K 702
US Classification:
374179, 374163, 374183, 374121, 136213
Abstract:
An integrated sensor comprising a thermopile transducer and signal processing circuitry that are combined on a single semiconductor substrate, such that the transducer output signal is sampled in close vicinity by the processing circuitry. The sensor comprises a frame formed of a semiconductor material that is not heavily doped, and with which a diaphragm is supported. The diaphragm has a first surface for receiving thermal (e. g. , infrared) radiation, and comprises multiple layers that include a sensing layer containing at least a pair of interlaced thermopiles. Each thermopile comprises a sequence of thermocouples, each thermocouple comprising dissimilar electrically-resistive materials that define hot junctions located on the diaphragm and cold junctions located on the frame. The signal processing circuitry is located on the frame and electrically interconnected with the thermopiles. The thermopiles are interlaced so that the output of one of the thermopiles increases with increasing temperature difference between the hot and cold junctions thereof, while the output of the second thermopile decreases with increasing temperature difference between its hot and cold junctions.
David Lambert - Rincon GA, US Melissa Hibbard Lambert - Rincon GA, US
Assignee:
OMEGA TECHNOLOGIES, INC. - Westlake Village CA
International Classification:
B25B 13/46 B25B 13/48
US Classification:
81 60, 81125
Abstract:
An air frame fastener wrench includes first and second handles pivotally attached to one another. A ratchet head of the first handle includes a selectively rotatable driver mateable with a socket. As the first and second handles are brought towards one another, the driver rotates the mated socket and an engaged collar of an air frame fastener. A key, which is connected to the first or second handle for preventing rotation of the key, extends through the ratchet head and prevents rotation of a pin of the air frame fastener as the collar is tightened thereto.