David K Light

US Patent:

6338982, Jan 15, 2002

Filed:

Oct 16, 2000

Appl. No.:

09/688397

Inventors:

Masud Beroz - Milpitas CA
Thomas H. DiStefano - Monte Sereno CA
Matthew T. Hendrickson - San Jose CA
David Light - Los Gatos CA
John W. Smith - Palo Alto CA

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

H01L 2102

US Classification:

438116, 438118, 269909

Abstract:

A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.

US Patent:

6357112, Mar 19, 2002

Filed:

Nov 25, 1998

Appl. No.:

09/200100

Inventors:

Thomas H. DiStefano - Monte Sereno CA
Joseph Fjelstad - Sunnyvale CA
Belgacem Haba - Cupertino CA
Owais Jamil - San Jose CA
Konstantine Karavakis - Pleasanton CA
David Light - Los Gatos CA
John W. Smith - Palo Alto CA

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

H01R 906

US Classification:

29843, 29842, 228 45, 2281805, 228199, 228754

Abstract:

A connection component for use in making microelectronic element assemblies, has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.

US Patent:

6518160, Feb 11, 2003

Filed:

Feb 5, 1999

Appl. No.:

09/245227

Inventors:

Joseph Fjelstad - Sunnyvale CA
Belgacem Haba - Cupertino CA
David Light - Los Gatos CA

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

H01L 2144

US Classification:

438612, 438614, 438611, 438667, 438669, 216 18

Abstract:

A connection component is made by providing an assembly comprising a base layer of a dielectric material, a metal layer overlying the base layer, and a top layer of a plasma-etchable material overlying the metal layer; forming openings in the top layer to produce a top layer mask; and forming first conductive elements from the metal layer by removing metal from regions of the metal layer aligned with the openings in the top layer mask. This method may be used to form a connection component having vias or bond windows formed therein for connection with other elements of a microelectronic device and conductive elements may be formed on either or both sides of the base layer.

US Patent:

6632791, Oct 14, 2003

Filed:

Jun 12, 2001

Appl. No.:

09/880484

Inventors:

David Light - San Mateo CA
Michael John Morser - San Francisco CA
Mariko Nagashima - Belmont CA

Assignee:

Schering Aktiengesellschaft - Berlin

International Classification:

A61K 3800

US Classification:

514 8, 530350

Abstract:

The present invention relates to the design, production and use of analogs of thrombomodulin (TM) that have the ability to enhance the thrombin-mediated activation of protein C but which have a significantly reduced ability to promote activation of thrombin-activatable fibrinolysis inhibitor (TAFI). These analogs are useful in, for example, antithrombotic therapy.

US Patent:

6657286, Dec 2, 2003

Filed:

Sep 20, 2001

Appl. No.:

09/957120

Inventors:

David Light - Los Gatos CA

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

H01L 23495

US Classification:

257666, 257692, 257695, 438620, 438123, 438597

Abstract:

Leads are connected between first and second elements so that a first end of each lead is connected to the first element and a second end of each lead is connected to the second element. and the elements are moved away from one another so as to bend the leads towards a vertically-extensive disposition. The direction of each lead, prior to the movement step, is represented by a lead direction vector from the first end of the lead to the second end of the same lead. At least some of these lead direction vectors are non-parallel with at least some other lead direction vectors, but the various lead direction vectors have components in a common direction. During the vertical movement step, the first element is moved in a horizontal direction of motion in this common direction, thereby moving the first end of each lead horizontally toward the second end of that lead, so as to provide or maintain slack in the leads.

US Patent:

6790828, Sep 14, 2004

Filed:

May 14, 2003

Appl. No.:

10/438648

Inventors:

David Light - San Mateo CA
Michael John Morser - San Francisco CA
Mariko Nagashima - Belmont CA

Assignee:

Schering Aktiengesellschaft - Berlin

International Classification:

A61K 3816

US Classification:

514 8

Abstract:

The present invention relates to the design, production and use of analogs of thrombomodulin (TM) that have the ability to enhance the thrombin-mediated activation of protein C but which have a significantly reduced ability to promote activation of thrombin-activatable fibrinolysis inhibitor (TAFI). These analogs are useful in, for example, antithrombotic therapy.

US Patent:

6794202, Sep 21, 2004

Filed:

Mar 9, 2001

Appl. No.:

09/802834

Inventors:

Masud Beroz - Livermore CA
David Light - Los Gatos CA

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

H01L 2166

US Classification:

438 14, 438109, 438119

Abstract:

A method of making a microelectronic assembly includes providing a first microelectronic element having one or more conductive bumps, the conductive bumps including a first fusible material that transforms from a solid to a liquid at a first melting temperature, and providing a second microelectronic element having one or more conductive elements. The conductive bumps of the first microelectronic element are electrically interconnected with the conductive elements of the second microelectronic element using a second fusible material, the second fusible material having a second melting temperature that is lower than the first melting temperature of the first fusible material. During the electrically interconnecting step, the second fusible material is maintained at a temperature that is greater than or equal to the second melting temperature and less than the first melting temperature of the first fusible material. The method also includes testing the microelectronic assembly after the electrically interconnecting step while maintaining the second fusible material at a temperature that is greater than or equal to the second melting temperature.

US Patent:

6808958, Oct 26, 2004

Filed:

Mar 7, 2002

Appl. No.:

10/093213

Inventors:

David Light - Los Gatos CA

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

H01L 2144

US Classification:

438106, 438119, 438612

Abstract:

A method of electrically interconnecting microelectronic elements comprises providing a first microelectronic element having contacts with protrusions and dipping the protrusions into a layer of bonding material. At least some of the bonding material is transferred onto the contacts. The contacts are bonded to conductive features of a second microelectronic element.