David D Light

US Patent:

6632791, Oct 14, 2003

Filed:

Jun 12, 2001

Appl. No.:

09/880484

Inventors:

David Light - San Mateo CA
Michael John Morser - San Francisco CA
Mariko Nagashima - Belmont CA

Assignee:

Schering Aktiengesellschaft - Berlin

International Classification:

A61K 3800

US Classification:

514 8, 530350

Abstract:

The present invention relates to the design, production and use of analogs of thrombomodulin (TM) that have the ability to enhance the thrombin-mediated activation of protein C but which have a significantly reduced ability to promote activation of thrombin-activatable fibrinolysis inhibitor (TAFI). These analogs are useful in, for example, antithrombotic therapy.

US Patent:

6790828, Sep 14, 2004

Filed:

May 14, 2003

Appl. No.:

10/438648

Inventors:

David Light - San Mateo CA
Michael John Morser - San Francisco CA
Mariko Nagashima - Belmont CA

Assignee:

Schering Aktiengesellschaft - Berlin

International Classification:

A61K 3816

US Classification:

514 8

Abstract:

The present invention relates to the design, production and use of analogs of thrombomodulin (TM) that have the ability to enhance the thrombin-mediated activation of protein C but which have a significantly reduced ability to promote activation of thrombin-activatable fibrinolysis inhibitor (TAFI). These analogs are useful in, for example, antithrombotic therapy.

US Patent:

6794202, Sep 21, 2004

Filed:

Mar 9, 2001

Appl. No.:

09/802834

Inventors:

Masud Beroz - Livermore CA
David Light - Los Gatos CA

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

H01L 2166

US Classification:

438 14, 438109, 438119

Abstract:

A method of making a microelectronic assembly includes providing a first microelectronic element having one or more conductive bumps, the conductive bumps including a first fusible material that transforms from a solid to a liquid at a first melting temperature, and providing a second microelectronic element having one or more conductive elements. The conductive bumps of the first microelectronic element are electrically interconnected with the conductive elements of the second microelectronic element using a second fusible material, the second fusible material having a second melting temperature that is lower than the first melting temperature of the first fusible material. During the electrically interconnecting step, the second fusible material is maintained at a temperature that is greater than or equal to the second melting temperature and less than the first melting temperature of the first fusible material. The method also includes testing the microelectronic assembly after the electrically interconnecting step while maintaining the second fusible material at a temperature that is greater than or equal to the second melting temperature.

US Patent:

7205659, Apr 17, 2007

Filed:

Feb 12, 2004

Appl. No.:

10/777804

Inventors:

Masud Beroz - Livermore CA, US
David Light - Los Gatos CA, US

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

H01L 23/48

US Classification:

257737, 257734, 257E23021

Abstract:

A microelectronic assembly includes a first microelectronic element having a contact bearing face and at least one contact accessible at the contact bearing face, and a second microelectronic element opposing the first microelectronic element, the second microelectronic element having a first surface including at least one lead extending over the first surface. The microelectronic assembly includes the first fusible material engaging the at least one contact of the first microelectronic element, and a second fusible material engaging the at least one lead, whereby one of the first and second fusible materials has a higher melting temperature and one of the first and second fusible materials has a lower melting temperature. The first and second microelectronic elements are juxtaposed with one another so that the first and second fusible materials are in substantial alignment with one another, with one of the first and second fusible materials in a liquid state and one of the first and second fusible materials in a solid state.

US Patent:

7250168, Jul 31, 2007

Filed:

Apr 30, 2003

Appl. No.:

10/427805

Inventors:

David Light - San Mateo CA, US
Kirk McLean - Oakland CA, US

Assignee:

Bayer Schering Pharma AG - Berlin

International Classification:

A61K 39/00

US Classification:

4241921, 4241341, 4241351, 4241451, 5303873, 53038825

Abstract:

This invention relates to novel fusion proteins which are comprised of a targeting protein that binds tissue factor (TF), which is operably linked to the thrombomodulin (TM) EGF456 domain alone or in combination with at least one other TM domain selected from the group consisting of the N-terminal hydrophobic region domain, the EGF123 domain, the interdomain loop between EGF3 and EGF4, and the O-glycosylated Ser/Thr-rich domain, or analogs, fragments, derivatives or variants thereof. The fusion protein binds at the site of injury and prevents the initiation of thrombosis. The fusion protein can be used to treat a variety of thrombotic conditions including but not limited to deep vein thrombosis, disseminated intravascular coagulation, and acute coronary syndrome.

US Patent:

7579000, Aug 25, 2009

Filed:

Apr 30, 2004

Appl. No.:

10/512215

Inventors:

David Light - San Mateo CA, US
Kirk McLean - Oakland CA, US

Assignee:

Bayer Schering Pharma AG - Berlin

International Classification:

A61K 39/395

US Classification:

4241351, 4241451, 4241461, 4241331, 4241341, 4241411, 5303873, 53038825

Abstract:

This invention relates to novel antibodies that bind with greater affinity to the factor VIIa/tissue factor (FVIIa/TF) complex than to tissue factor (TF) alone, do not compete for binding to TF with FVII and FX, an inhibit FX activation. The antibodies bind at the site of injury and prevent the initiation of thrombosis. The antibodies can be used to treat a variety of thrombotic conditions including but not limited to deep vein thrombosis, disseminated intravascular coagulation, and acute coronary syndrome.

US Patent:

7622122, Nov 24, 2009

Filed:

Jun 21, 2007

Appl. No.:

11/766160

Inventors:

David Bruce Light - San Mateo CA, US
Kirk McLean - Oakland CA, US

Assignee:

Bayer Schering Pharma Aktiengesellschaft - Berlin

International Classification:

A61K 39/00

US Classification:

4241921, 4241341, 4241431, 4241851

Abstract:

This invention relates to novel fusion proteins which are comprised of a targeting protein that binds tissue factor (TF), which is operably linked to the thrombomodulin (TM) EGF456 domain alone or in combination with at least one other TM domain selected from the group consisting of the N-terminal hydrophobic region domain, the EGF123 domain, the interdomain loop between EGF3 and EGF4, and the O-glycosylated Ser/Thr-rich domain, or analogs, fragments, derivatives or variants thereof. The fusion protein binds at the site of injury and prevents the initiation of thrombosis. The fusion protein can be used to treat a variety of thrombotic conditions including but not limited to deep vein thrombosis, disseminated intravascular coagulation, and acute coronary syndrome.

US Patent:

7622457, Nov 24, 2009

Filed:

Jun 21, 2007

Appl. No.:

11/766155

Inventors:

David Bruce Light - San Mateo CA, US
Kirk McLean - Oakland CA, US

Assignee:

Bayer Schering Pharma Aktiengesellschaft - Berlin

International Classification:

A61K 48/00

US Classification:

514 44, 536 231, 536 234, 536 2353

Abstract:

This invention relates to novel fusion proteins which are comprised of a targeting protein that binds tissue factor (TF), which is operably linked to the thrombomodulin (TM) EGF456 domain alone or in combination with at least one other TM domain selected from the group consisting of the N-terminal hydrophobic region domain, the EGF123 domain, the interdomain loop between EGF3 and EGF4, and the O-glycosylated Ser/Thr-rich domain, or analogs, fragments, derivatives or variants thereof. The fusion protein binds at the site of injury and prevents the initiation of thrombosis. The fusion protein can be used to treat a variety of thrombotic conditions including but not limited to deep vein thrombosis, disseminated intravascular coagulation, and acute coronary syndrome.