David L Payne

US Patent:

6378927, Apr 30, 2002

Filed:

Oct 27, 2000

Appl. No.:

09/697851

Inventors:

Richard Parry-Jones - Ann Arbor MI
David L. Payne - Plymouth MI
Daniel Rodriguez - Farmnington Hills MI
Norman William Fasecas - Westland MI
Robert J. Garby - Northville MI

Assignee:

Ford Global Technologies, Inc. - Dearborn MI

International Classification:

B62D 3303

US Classification:

296 61, 414537

Abstract:

A stowable load ramp for a vehicle includes a tailgate operable between a closed vertical position and an open horizontal position, an upper panel hingedly attached to the tailgate, a lower panel hingedly attached to the upper panel, and wherein the upper and lower panels are operable between a stowed horizontal position and an extended downwardly angled ramp position.

US Patent:

6518168, Feb 11, 2003

Filed:

Nov 2, 1998

Appl. No.:

09/029317

Inventors:

Paul G. Clem - Albuquerque NM
Milan Mrksich - Chicago IL
Ralph G. Nuzzo - Champaign IL
David A. Payne - Champaign IL
George M. Whitesides - Newton MA
Younan Xia - Seattle WA

Assignee:

President and Fellows of Harvard College - Cambridge MA
Board of Trustees of the University of Illinois - Urbana IL

International Classification:

H01L 214763

US Classification:

438623, 438624, 438778

Abstract:

A technique for creating patterns of material deposited on a surface involves forming a self-assembled monolayer in a pattern on the surface and depositing, via chemical vapor deposition or via sol-gel processing, a material on the surface in a pattern complementary to the self-assembled monolayer pattern. The material can be a metal, metal oxide, or the like. The surface can be contoured, including trenches or holes, the trenches or holes remaining free of self-assembled monolayer while the remainder of the surface is coated. When exposed to deposition conditions, metal or metal oxide is deposited in the trenches or holes, and remaining portions of the article surface remain free of deposition. The technique finds particular use in creation of conductive metal pathways selectively within holes passing from one side of a substrate to another.