Benjamin N. Eldridge - Danville CA Igor Y. Khandros - Orinda CA David V. Pedersen - Scotts Valley CA Ralph G. Whitten - San Jose CA
Assignee:
FormFactor, Inc. - Livermore CA
International Classification:
H01L 2166
US Classification:
438 14, 438 10, 438 17
Abstract:
One embodiment of the present invention concerns a design methodology for generating a test die for a product die including the step of concurrently designing test circuitry and a product circuitry in a unified design. The test circuitry can be designed to provide a high degree of fault coverage for the corresponding product circuitry generally without regard to the amount of silicon area that will be required by the test circuitry. The design methodology then partitions the unified design into the test die and the product die. The test die includes the test circuitry and the product die includes the product circuitry. The product and test die may then be fabricated on separate semiconductor wafers. By partitioning the product circuitry and test circuitry into separate die, embedded test circuitry can be either eliminated or minimized on the product die. This will tend to decrease the size of the product die and decrease the cost of manufacturing the product die while maintaining a high degree of test coverage of the product circuits within the product die.
Special Contact Points For Accessing Internal Circuitry Of An Integrated Circuit
Benjamin N. Eldridge - Danville CA Igor Y. Khandros - Orinda CA David V. Pedersen - Scotts Valley CA Ralph G. Whitten - San Jose CA
Assignee:
FormFactor, Inc. - Livermore CA
International Classification:
G01R 3102
US Classification:
324754, 3241581
Abstract:
One embodiment of the present invention concerns an integrated circuit that includes bond pads and special contact pads or points. The bond pads are for interfacing the integrated circuit as a whole with an external circuit, and are to be bonded to a package or circuit board. The bond pads are disposed on the die in a predetermined alignment such as a peripheral, grid, or lead-on-center alignment. The special contact pads are used to provide external test patterns to internal circuits and/or to externally monitor results from testing the internal circuits. The special contact pads may be advantageously located on the integrated circuit with a high degree of positional freedom. For one embodiment, the special contact pads may be disposed on the die at a location that is not in the same alignment as the bond pads. The special contact pads may be smaller than the bond pads so as not to increase the die size due to the special contact pads. The special contact points may also be used to externally program internal circuits (e. g.
Silicon Segment Programming Apparatus And Three Terminal Fuse Configuration
David V. Pedersen - Scotts Valley CA Michael G. Finley - Cambria CA Kenneth M. Sautter - Sunnyvale CA
Assignee:
Vertical Circuits, Inc. - Scotts Valley CA
International Classification:
H01L 2900
US Classification:
257529, 361733, 438132
Abstract:
The present invention is a method and apparatus for programming a stack of segments wherein each segment includes a plurality of die which are interconnected through metal interconnects patterned on the surface of each segment. Once the segments are arranged into a stack, the stack is connected to external circuits and each segment is addressed through control lines. Electrically conductive fuses on the segments are used as an interface between the control lines and the die. Segment level programming is performed on each segment by opening the conductive fuses on the segments in a predetermined pattern in order to route the control lines to each segment such that segments are uniquely addressed. After segment level programming, circuit board programming is performed so that any defective die found in the stack is logically replaced with replacement die in the stack. This is accomplished by connecting a set of metal switches between all the die and each of the control lines and by dispensing a conductive epoxy whisker between the control line for the defective die and the metal switch of the replacement die.
Igor Y. Khandros - Orinda CA David V. Pedersen - Scotts Valley CA
Assignee:
FormFactor, Inc. - Livermore CA
International Classification:
G01R 3126
US Classification:
324765, 324754, 324760
Abstract:
Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate having active electronic components such as ASICs mounted to an interconnection substrate or incorporated therein, metallic spring contact elements effecting interconnections between the ASICs and a plurality of devices-under-test (DUTs) on a wafer-under-test (WUT), all disposed in a vacuum vessel so that the ASICs can be operated at temperatures independent from and significantly lower than the burn-in temperature of the DUTs. The spring contact elements may be mounted to either the DUTs or to the ASICs, and may fan out to relax tolerance constraints on aligning and interconnecting the ASICs and the DUTs. Physical alignment techniques are also described.
Benjamin N. Eldridge - Danville CA Gary W. Grube - Pleasanton CA Igor Y. Khandros - Orinda CA Gaetan L. Mathieu - Livermore CA David V. Pedersen - Scotts Valley CA Michael A. Stadt - Castro Valley CA
Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
Test Assembly Including A Test Die For Testing A Semiconductor Product Die
Benjamin N. Eldridge - Danville CA Igor Y. Khandros - Orinda CA David V. Pedersen - Scotts Valley CA Ralph G. Whitten - San Jose CA
Assignee:
FormFactor, Inc. - Livermore CA
International Classification:
H01L 2166
US Classification:
438 14, 438 15, 438 17
Abstract:
One embodiment of the present invention concerns a test assembly for testing product circuitry of a product die. In one embodiment, the test assembly includes at test die and an interconnection substrate for electrically coupling the test die to a host controller that communicates with the test die. The test die may be designed according to a design methodology that includes the step of concurrently designing test circuitry and a product circuitry in a unified design. The test circuitry can be designed to provide a high degree of fault coverage for the corresponding product circuitry generally without regard to the amount of silicon area that will be required by the test circuitry. The design methodology then partitions the unified design into the test die and the product die. The test die includes the test circuitry and the product die includes the product circuitry. The product and test die may then be fabricated on separate semiconductor wafers.
Special Contact Points For Accessing Internal Circuitry Of An Integrated Circuit
Benjamin N. Eldridge - Danville CA Igor Y. Khandros - Orinda CA David V. Pedersen - Scotts Valley CA Ralph G. Whitten - San Jose CA
Assignee:
FormFactor, Inc. - Livermore CA
International Classification:
G01R 3102
US Classification:
324754, 3241581
Abstract:
An integrated circuit that includes bond pads and special contact pads or points. The bond pads are for interfacing the integrated circuit as a whole with an external circuit, and are to be bonded to a package or circuit board. The bond pads are disposed on the die in a predetermined alignment such as a peripheral, grid, or lead-on-center alignment. The special contact pads are used to provide external test patterns to internal circuits and/or to externally monitor results from testing the internal circuits. The special contact pads may be advantageously located on the integrated circuit with a high degree of positional freedom. For one embodiment, the special contact pads may be disposed on the die at a location that is not in the same alignment as the bond pads. The special contact pads may be smaller than the bond pads so as not to increase the die size due to the special contact pads. The special contact points may also be used to externally program internal circuits (e. g.
Special Contact Points For Accessing Internal Circuitry Of An Integrated Circuit
Benjamin N. Eldridge - Danville CA Igor Y. Khandros - Orinda CA David V. Pedersen - Scotts Valley CA Ralph G. Whitten - San Jose CA
Assignee:
FormFactor, Inc. - Livermore CA
International Classification:
G01R 3102
US Classification:
324755, 324756, 3241581
Abstract:
One embodiment of the present invention concerns an integrated circuit that includes bond pads and special contact pads or points. The bond pads are for interfacing the integrated circuit as a whole with an external circuit, and are to be bonded to a package or circuit board. The bond pads are disposed on the die in a predetermined alignment such as a peripheral, grid, or lead-on-center alignment. The special contact pads are used to provide external test patterns to internal circuits and/or to externally monitor results from testing the internal circuits. The special contact pads may be advantageously located on the integrated circuit with a high degree of positional freedom. For one embodiment, the special contact pads may be disposed on the die at a location that is not in the same alignment as the bond pads. The special contact pads may be smaller than the bond pads so as not to increase the die size due to the special contact pads. The special contact points may also be used to externally program internal circuits (e. g.
David Pedersen (born May 15, 1986 in Andenes, Vesterlen) is a Norwegian singer and came in 3rd place on Idol in 2003. The next year David was asked to join ...
License Records
David J. Pedersen
License #:
25213550 - Expired
Category:
Contractor
David J. Pedersen
License #:
25231020 - Expired
Category:
Contractor
David H Pedersen
License #:
7137 - Expired
Category:
Pharmacy
Issued Date:
Jul 1, 1955
Effective Date:
Aug 27, 2002
Type:
Certified Preceptor
David W Pedersen
License #:
15577 - Active
Category:
Emergency Medical Care
Issued Date:
Apr 29, 2003
Effective Date:
Apr 29, 2003
Expiration Date:
Dec 31, 2017
Type:
EMT
David G Pedersen
License #:
6725 - Expired
Category:
Water Operator
Issued Date:
May 31, 1994
Type:
Grade VI Water Operator
David H Pedersen
License #:
7137 - Expired
Category:
Pharmacy
Issued Date:
Jul 1, 1955
Effective Date:
Jan 2, 2000
Expiration Date:
Jan 1, 2000
Type:
Pharmacist
Name / Title
Company / Classification
Phones & Addresses
David Pedersen CTO
Aeris.net Mortgage Bankers and Loan Correspondents
1245 S Winchester Blvd, San Jose, CA 95128
David Pedersen Vice-President
Systech Solutions Nonclassifiable Establishments
18971 Easton Pl, Saratoga, CA 95070
David Pedersen CTO
Aeris.net Other Activities Related to Credit Intermediation
1245 S Winchester Blvd STE 216, San Jose, CA 95128 4085571900, 4085571979
David Pedersen Owner
Signature Construction Single-Family House Construction
710 Linwood St, Escondido, CA 92027
David V. Pedersen Director
STAR SOLUTIONS, INC
David Pedersen President
BLISS BEAUTY SUPPLY AND SALON, INC Beauty Salon Equipment & Supplies Retail
David A Pedersen MD 1712 W Anklam Rd STE 103, Tucson, AZ 85745 5206227384 (phone), 5206224899 (fax)
Education:
Medical School University of Arizona College of Medicine at Tucson Graduated: 1990
Procedures:
Appendectomy Bariatric Surgery Destruction of Lesions on the Anus Endoscopic Retrograde Cholangiopancreatography (ERCP) Gallbladder Removal Hemorrhoid Procedures Hernia Repair Laparoscopic Appendectomy Laparoscopic Gallbladder Removal Liver Transplant Proctosigmoidoscopy Small Bowel Resection Spleen Surgey Thoracoscopy Tracheostomy Upper Gastrointestinal Endoscopy
Conditions:
Abdominal Hernia Appendicitis Cholelethiasis or Cholecystitis Hemorrhoids Inguinal Hernia
Languages:
English Spanish
Description:
Dr. Pedersen graduated from the University of Arizona College of Medicine at Tucson in 1990. He works in Tucson, AZ and specializes in General Surgery. Dr. Pedersen is affiliated with Carondelet St Marys Hospital.
Simsbury,ct Mt view, ca Glastonbury, ct Needham,ma Carmel, in
Work:
Ontario Systems - SVP Operations (3)
Tagline:
Enterprise Software Executive
David Pedersen
Work:
Edward Jones Investments - Financial Advisor (1993)
Education:
Galesburg, Illinois
David Pedersen
Work:
Sovereign Guns - Sales person (2013)
Relationship:
Single
Tagline:
CHICKEN BOOBIES
David Pedersen
Education:
Kingoskolen - Folkeskole
David Pedersen
Work:
IGT
David Pedersen
About:
My name is David Pedersen. I worship Jesus Christ, who was killed by my hands, and still loved me enough to conquer death for me. I like to hike, and I love the snow (and winter in general). I love he...
Tagline:
One of them will inderstand. One of them MUST.
Bragging Rights:
None except in Christ.
David Pedersen
David Pedersen
Youtube
David - Wild At Heart
Music video by David performing Wild At Heart. (C) 2003 BMG Norway AS.
Duration:
2m 53s
Winter Training Arc
Today i take you through my chest and shoulders workout as well as som...
Duration:
17m 11s
Sustainabile Leadership to transform the fut...
Transformational leaders say, Nelson Mandela or Mahatma Gandhi, were p...
Duration:
10m 35s
Hack Night - David Pedersen on Axum
On 30/6, we hosted "Hack Night " - arranged by Copenhagen Rust Group. ...
Duration:
42m 10s
David Pedersen -Kryptonite
Contest.
Duration:
4m 3s
David Pedersen - Wherever You Will Go - Idol ...
Idol 2003 - David Pedersen synge Wherever You Will Go av The Calling. ...
As of Dec. 5, there were 4,636 homes for sale on the local multiple listing service. That was down 50.2 percent from December's average active listing total of 9,303. The current low inventory level is comparable to the go-go days of spring 2004, said association spokesman David Pedersen.
The Daily Herald (http://is.gd/fJOYgQ ) reports Snohomish County Superior Court Judge Linda Krese on Friday sentenced David Pedersen to the only penalty available after prosecutors agreed not to seek the death penalty.
Myers was shot and killed two weeks ago, when police say he came into contact with two white supremacists on the run from the law and in need of a car. David Pedersen and Holly Grigsby have admitted involvement in his killing.
and woman identified as persons of interest in his death. They're the same boyfriend-girlfriend duo suspected of murder in Washington state. David Pedersen, a 31-year-old who has spent nearly half of his life in prison, was arrested Wednesday in Yuba County, Calif., with his girlfriend, Holly Grigsby.
The fugitives Pedersens stepson David Pedersen and his girlfriend Holly Ann Grigsby were arrested Wednesday afternoon on a highway in Northern California as they were driving Myerscar.
Date: Oct 06, 2011
Category: U.S.
Source: Google
Car sighted, but missing teenager might be in danger
Leslie Pedersen is David Pedersen's step-mother. David Jones Pedersen, the suspect's father, hasn't been seen since his wife's murder and is considered missing and endangered, Everett Police Sgt. Robert Goetz said. Witnesses saw David Joseph Pedersen with his father at the Washington home the day be
Date: Oct 05, 2011
Category: U.S.
Source: Google
Suspects in Everett slaying arrested in California
Pedersen and Grigsby who both have extensive criminal records are suspects in the stabbing death of 69-year-old Leslie Pedersen in Everett. Leslie Pedersen, stepmother of David Pedersen, was found in her mobile home last Wednesday.