David E Pedersen

US Patent:

6486528, Nov 26, 2002

Filed:

Aug 23, 1999

Appl. No.:

09/378879

Inventors:

David V. Pedersen - Scotts Valley CA
Michael G. Finley - Cambria CA
Kenneth M. Sautter - Sunnyvale CA

Assignee:

Vertical Circuits, Inc. - Scotts Valley CA

International Classification:

H01L 2900

US Classification:

257529, 361733, 438132

Abstract:

The present invention is a method and apparatus for programming a stack of segments wherein each segment includes a plurality of die which are interconnected through metal interconnects patterned on the surface of each segment. Once the segments are arranged into a stack, the stack is connected to external circuits and each segment is addressed through control lines. Electrically conductive fuses on the segments are used as an interface between the control lines and the die. Segment level programming is performed on each segment by opening the conductive fuses on the segments in a predetermined pattern in order to route the control lines to each segment such that segments are uniquely addressed. After segment level programming, circuit board programming is performed so that any defective die found in the stack is logically replaced with replacement die in the stack. This is accomplished by connecting a set of metal switches between all the die and each of the control lines and by dispensing a conductive epoxy whisker between the control line for the defective die and the metal switch of the replacement die.

US Patent:

6640415, Nov 4, 2003

Filed:

Jul 25, 2002

Appl. No.:

10/202971

Inventors:

Mohammad Eslamy - San Jose CA
David V Pedersen - Scotts Valley CA
Harry D. Cobb - Ripon CA

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

H01H 158

US Classification:

29593, 29825, 29859, 29874, 324754, 324765, 324757, 438 17

Abstract:

A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.

US Patent:

6735004, May 11, 2004

Filed:

Mar 15, 2002

Appl. No.:

10/099246

Inventors:

Paul M. Hagelin - Saratoga CA
David R. Pedersen - Sunnyvale CA

Assignee:

Nanogear, Inc. - Santa Clara CA

International Classification:

G02B 2608

US Classification:

359198, 359199, 359212, 359223, 359224, 310306, 310309, 310311

Abstract:

A counterbalanced actuator for steering a beam of light is disclosed. The actuator includes a rotatable actuator member coupled to a substrate, a movable portion of an actuator drive mechanism coupled to the rotatable actuator member, a balancing spring coupled between the substrate and the movable portion of the actuator drive mechanism, and an actuator arm operably coupled to the movable portion of the actuator drive mechanism. The balancing spring maintains the movable portion of the actuator drive mechanism nominally, parallel to the substrate when the actuator arm is rotated. An optical mirror element is coupled to the actuator arm. The actuator also includes apparatus for applying a first drive voltage to the movable portion of the actuator drive mechanism and a second drive voltage to a fixed portion of the actuator drive mechanism to position the mirror. Also disclosed is an optical subassembly for directing at least one beam of light including a plurality of micromirror assemblies on a substrate, where each micromirror assembly includes an optical mirror coupled to a plurality of counterbalanced actuators attached to the substrate. A method of actuating a micromirror assembly and a system for actuation the micromirror assembly is also disclosed.

US Patent:

7065870, Jun 27, 2006

Filed:

Sep 22, 2003

Appl. No.:

10/667689

Inventors:

Mohammad Eslamy - San Jose CA, US
David V. Pedersen - Scotts Valley CA, US
Harry D. Cobb - Ripon CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

H01R 43/02

US Classification:

29877, 29593, 29825, 29874, 324754, 324765

Abstract:

A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.

US Patent:

7202677, Apr 10, 2007

Filed:

Dec 30, 2003

Appl. No.:

10/749028

Inventors:

David V. Pedersen - Scotts Valley CA, US
Benjamin N. Eldridge - Danville CA, US
Igor Y. Khandros - Orinda CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324754

Abstract:

Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

US Patent:

7215131, May 8, 2007

Filed:

Jun 7, 1999

Appl. No.:

09/327116

Inventors:

Mohammad Eslamy - San Jose CA, US
David V. Pedersen - Scotts Valley CA, US
Harry D. Cobb - Ripon CA, US

Assignee:

Formfactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324754, 324761, 324765

Abstract:

A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.

US Patent:

7534654, May 19, 2009

Filed:

Apr 10, 2007

Appl. No.:

11/733562

Inventors:

David V. Pedersen - Scotts Valley CA, US
Benjamin N. Eldridge - Danville CA, US
Igor Y. Khandros - Orinda CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

H01L 21/44
H01L 21/48
H01L 21/50

US Classification:

438110, 438107, 438113, 257692, 257696, 324754, 324755

Abstract:

Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

US Patent:

7545237, Jun 9, 2009

Filed:

Dec 20, 2006

Appl. No.:

11/613869

Inventors:

Paul Merritt Hagelin - Saratoga CA, US
David Raymond Pedersen - Mountain View CA, US

Assignee:

SiTime Inc. - Sunnyvale CA

International Classification:

H03H 9/125
H03H 9/24
H03B 5/30
H03H 9/46

US Classification:

333186, 333197, 333200, 310309, 310370, 331154, 331156

Abstract:

One embodiment of the present invention sets forth a serrated tooth actuator for driving MEMS resonator structures. The actuator includes a fixed drive electrode having a serrated tooth surface opposing a MEMS resonator arm also having a serrated tooth surface, where the MEMS resonator arm is configured to rotate towards the drive electrode when an AC signal is applied to the drive electrode. Such a configuration permits higher amplitude signals to be applied to the drive electrode without the performance of the actuator being compromised by nonlinear effects. In addition, the serrated tooth configuration enables a sufficiently high actuating force to be maintained even though the distance traversed by the MEMS resonator arm during operation is quite small. Further, the serrated configuration allows a MEMS resonator system to withstand larger fluctuations in voltage and larger substrate stresses without experiencing a substantial shift in resonant frequency.