David Thanh Quach

US Patent:

7274005, Sep 25, 2007

Filed:

Jul 5, 2005

Appl. No.:

11/174681

Inventors:

David H. Quach - San Jose CA, US
Tetsuya Ishikawa - Saratoga CA, US

Assignee:

Sokudo Co., Ltd. - Kyoto

International Classification:

H05B 3/68
C23C 16/00
F28F 7/00

US Classification:

2194441, 118724, 165 801

Abstract:

A bake station comprising a bake plate adapted to heat a substrate supported on an upper surface of the bake plate, the bake plate vertically moveable between an upper baking position and a lower cooling position; and a plurality of heat sinks adapted to be engageably coupled to a lower surface of the bake plate when the bake plate is in the lower cooling position.

US Patent:

7282675, Oct 16, 2007

Filed:

Jul 5, 2005

Appl. No.:

11/174988

Inventors:

David H. Quach - San Jose CA, US
Martin Jeff Salinas - San Jose CA, US

Assignee:

Sokudo Co., Ltd. - Kyoto

International Classification:

H05B 3/68

US Classification:

2194441, 414935

Abstract:

An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.

US Patent:

7288746, Oct 30, 2007

Filed:

Jul 5, 2005

Appl. No.:

11/174782

Inventors:

David H. Quach - San Jose CA, US
Tetsuya Ishikawa - Saratoga CA, US

Assignee:

Sokudo Co., Ltd. - Kyoto

International Classification:

H05B 3/68
C23C 16/00

US Classification:

2194441, 118724

Abstract:

An integrated thermal unit comprising a bake plate having a substrate holding surface configured to hold and heat a substrate in a baking position and a chill plate having a substrate holding surface configured to hold and cool a substrate in a cooling position where the substrate holding surface of the bake plate is positioned in a first substantially horizontal plane when the bake plate is in the baking position and the substrate holding surface of the chill plate is positioned in a second substantially horizontal plane that is below the first plane when the chill plate is in a cooling position.

US Patent:

7297906, Nov 20, 2007

Filed:

Jul 5, 2005

Appl. No.:

11/174781

Inventors:

David H. Quach - San Jose CA, US
Martin Jeff Salinas - San Jose CA, US

Assignee:

Sokudo Co., Ltd. - Kyoto

International Classification:

H05B 3/68
C23C 16/80

US Classification:

2194441, 118724

Abstract:

An integrated thermal unit comprises a bake station comprising a bake plate configured to hold and heat a substrate; a chill station comprising a chill plate configured to hold and cool a substrate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the chill plate along a horizontally linear path within the thermal unit and raise and lower substrates along a vertical path within the integrated thermal unit.

US Patent:

7357842, Apr 15, 2008

Filed:

Apr 22, 2005

Appl. No.:

11/112281

Inventors:

Tetsuya Ishikawa - Saratoga CA, US
Rick J. Roberts - San Jose CA, US
Helen R. Armer - Cupertino CA, US
Leon Volfovski - Mountain View CA, US
Jay D. Pinson - San Jose CA, US
Michael Rice - Pleasanton CA, US
David H. Quach - San Jose CA, US
Mohsen S. Salek - Saratoga CA, US
Robert Lowrance - Los Gatos CA, US
John A. Backer - San Jose CA, US
William Tyler Weaver - Austin TX, US
Charles Carlson - Cedar Park TX, US
Chongyang Wang - San Jose CA, US
Jeffrey Hudgens - San Francisco CA, US
Harald Herchen - Los Altos CA, US
Brian Lue - Mountain View CA, US

Assignee:

Sokudo Co., Ltd. - Kyoto

International Classification:

B05C 13/02
C23C 14/00
H01L 21/677

US Classification:

118503, 118 50, 41422501, 414217, 414936

Abstract:

A cluster tool for processing a substrate includes a cassette and a processing module including a first processing chamber that is configured to perform a chill process on a substrate, a second processing chamber that is configured to perform a bake process on the substrate, and an input chamber. The first processing chamber, the second processing chamber, and the input chamber are substantially adjacent to each other. The processing module also includes a robot that is configured to receive the substrate in the input chamber and transfer and position the substrate in the first processing chamber and second processing chamber. The robot includes a robot blade, an actuator, and a heat exchanging device. The heat exchanging device includes a chilled transfer arm assembly. The cluster tool also includes a 6-axis articulated robot configured to transfer the substrate between the cassette and the input chamber.

US Patent:

7381052, Jun 3, 2008

Filed:

Jun 2, 2006

Appl. No.:

11/445630

Inventors:

Jun Zhao - Cupertino CA, US
David Quach - San Jose CA, US
Timothy Weidman - Sunnyvale CA, US
Rick J. Roberts - Sunnyvale CA, US
Farhad Moghadam - Saratoga CA, US
Dan Maydan - Los Altos Hills CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C23C 16/04

US Classification:

432249, 118724

Abstract:

An apparatus for processing substrates is disclosed. In one embodiment, the apparatus includes a housing and a plurality of stacked cell structures in the housing. An actuator is adapted to move the plurality of stacked cell structures inside of the housing while substrates in the stacked cell structures are being heated.

US Patent:

7427728, Sep 23, 2008

Filed:

Jul 7, 2006

Appl. No.:

11/483832

Inventors:

Martin Jeff Salinas - San Jose CA, US
David H. Quach - San Jose CA, US

Assignee:

Sokudo Co., Ltd. - Kyoto

International Classification:

H05B 3/68

US Classification:

2194461, 2194431

Abstract:

A substrate heater comprising a bake plate having an upper surface, a lower surface and a peripheral side surface extending between the upper and lower surfaces, the bake plate including at least one heating element, at least one temperature sensor and a plurality of wires including at least one wire coupled to the heating element and at least one wire coupled to the temperature sensor; a shield spaced apart from and generally surrounding the lower and peripheral side surfaces of the bake plate, the shield having an interior upper surface facing the lower surface of the bake plate, an interior side surface facing the peripheral side surface of the bake plate and a lower surface opposite the interior upper surface; a patterned signal layer formed on the lower surface of the shield, wherein the plurality of wires are electrically coupled to a corresponding plurality of signal traces formed in the patterned signal layer; and a connector, electrically coupled to the plurality of signal traces in the patterned signal layer, adapted to facilitate electrical connections to the plurality of wires.

US Patent:

7431585, Oct 7, 2008

Filed:

Oct 22, 2002

Appl. No.:

10/278615

Inventors:

Jun Zhao - Cupertino CA, US
David Quach - San Jose CA, US
Timothy Weidman - Sunnyvale CA, US
Rick J. Roberts - Sunnyvale CA, US
Farhad Moghadam - Saratoga CA, US
Dan Maydan - Los Altos Hills CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

F27D 3/00

US Classification:

432241, 432207, 432247, 118725, 219390, 414939

Abstract:

An apparatus for processing substrates is disclosed. In one embodiment, the apparatus includes a housing and a plurality of stacked cell structures in the housing. An actuator is adapted to move the plurality of stacked cell structures inside of the housing while substrates in the stacked cell structures are being heated.