David Robillard

US Patent:

39846202, Oct 5, 1976

Filed:

Jun 4, 1975

Appl. No.:

5/583739

Inventors:

David R. Robillard - Westboro MA
Robert L. Michals - Marlboro MA

Assignee:

Raytheon Company - Lexington MA

International Classification:

H05K 502

US Classification:

174 52FP

Abstract:

A semiconductor integrated circuit device of the beam lead type having a semiconductor interconnection substrate with apertures for integrated circuit chips therein and with metallization patterns having sharply pointed ends for penetrating oxide layers over the bonding pads of the chips and for making electrical connection thereto. Devices thus produced may be assembled and tested and failed chips replaced as necessary before the chips are ultrasonically welded to the interconnection metallization and before final fabrication of the device. The invention also includes a method for producing an interconnection substrate in which a plurality of conically shaped holes are etched into a semiconductor wafer having sharp points within the body of the wafer. A metal layer is deposited over the surface of the semiconductor wafer filling the etched holes. Sharp points are thus formed on the metal in the etched holes.

US Patent:

41898257, Feb 26, 1980

Filed:

Sep 1, 1977

Appl. No.:

5/829770

Inventors:

David R. Robillard - Westboro MA
Robert L. Michaels - Marlboro MA

Assignee:

Raytheon Company - Lexington MA

International Classification:

B01J 1700

US Classification:

29574

Abstract:

A semiconductor integrated circuit device of the beam lead type having a semiconductor interconnection substrate with apertures for integrated circuit chips therein and with metallization patterns having sharply pointed ends for penetrating oxide layers over the bonding pads of the chips and for making electrical connection thereto. Devices thus produced may be assembled and tested and failed chips replaced as necessary before the chips are ultrasonically welded to the interconnection metallization and before final fabrication of the device. The invention also includes a method for producing an interconnection substrate in which a plurality of conically shaped holes are etched into a semiconductor wafer having sharp points within the body of the wafer. A metal layer is deposited over the surface of the semiconductor wafer filling the etched holes. Sharp points are thus formed on the metal in the etched holes.

US Patent:

43121179, Jan 26, 1982

Filed:

Nov 20, 1979

Appl. No.:

6/096118

Inventors:

David R. Robillard - Westboro MA
Robert L. Michals - Marlboro MA

Assignee:

Raytheon Company - Lexington MA

International Classification:

H01L 21603

US Classification:

29589

Abstract:

A semiconductor integrated circuit device of the beam lead type having a semiconductor interconnection substrate with apertures for integrated circuit chips therein and with metallization patterns having sharply pointed ends for penetrating oxide layers over the bonding pads of the chips and for making electrical connection thereto. Devices thus produced may be assembled and tested and failed chips replaced as necessary before the chips are ultrasonically welded to the interconnection metallization and before final fabrication of the device. The invention also includes a method for producing an interconnection substrate in which a plurality of conically shaped holes are etched into a semiconductor wafer having sharp points within the body of the wafer. A metal layer is deposited over the surface of the semiconductor wafer filling the etched holes. Sharp points are thus formed on the metal in the etched holes.

US Patent:

45616191, Dec 31, 1985

Filed:

Feb 10, 1984

Appl. No.:

6/578795

Inventors:

David R. Robillard - Westboro MA
Robert J. Bullock - Chelmsford MA
Jerry C. Marino - Sudbury MA

Assignee:

Prime Computer, Inc. - Natick MA

International Classification:

E04G 300

US Classification:

248285

Abstract:

A support for a CRT monitor provides translational movement for the monitor in two perpendicular directions. The support is on rollers for movement over a horizontal surface, and includes telescoping arms for movement in a first direction. One of the arms enters an elongate guide channel mountable on the surface and includes rollers for rolling along a vertical wall of the channel so that the support moves in a second direction perpendicular to the first. The channel includes a cover and end walls.

US Patent:

40963489, Jun 20, 1978

Filed:

Mar 15, 1976

Appl. No.:

5/666826

Inventors:

David R. Robillard - Westboro MA
Robert L. Michals - Marlboro MA

Assignee:

Raytheon Company - Lexington MA

International Classification:

H05K 502
H05K 102

US Classification:

174 52FP

Abstract:

A semiconductor integrated circuit device of the beam lead type having a semiconductor interconnection substrate with apertures for integrated circuit chips therein and with metallization patterns having sharply pointed ends for penetrating oxide layers over the bonding pads of the chips and for making electrical connection thereto. Devices thus produced may be assembled and tested and failed chips replaced as necessary before the chips are ultrasonically welded to the interconnection metallization and before final fabrication of the device. The invention also includes a method for producing an interconnection substrate in which a plurality of conically shaped holes are etched into a semiconductor wafer having sharp points within the body of the wafer. A metal layer is deposited over the surface of the semiconductor wafer filling the etched holes. Sharp points are thus formed on the metal in the etched holes.