David Roman

US Patent:

6455356, Sep 24, 2002

Filed:

Sep 14, 1999

Appl. No.:

09/395875

Inventors:

Thomas P. Glenn - Gilbert AZ
Scott J. Jewler - Gilbert AZ
David Roman - Tempe AZ
J. H. Yee - Seoul, KR
D. H. Moon - Seoul, KR

Assignee:

Amkor Technology - Chandler AZ

International Classification:

H01L 2148

US Classification:

438123, 438124, 438127, 29827, 29841, 29855

Abstract:

Methods for making packages and leadframes are enclosed. The package includes a die, a die pad, leads, bond wires, and an encapsulant. The lower surfaces of the die pad and leads are provided with a stepped profile by an etching step that etches partially through the thickness of a peripheral portion of the die pad, and also etches partially through the thickness of portions of the leads. Encapsulant material is applied by molding or liquid encapsulation techniques. The encapsulant material fills in beneath the recessed, substantially horizontal surfaces of the die pad and leads formed by the above-described partial etching step, and thereby prevents the die pad and leads from being pulled vertically from the package body. Other surface of the die pad and leads are not covered during the encapsulation step, but rather remain exposed at the lower surface of the package for connecting the package externally. After encapsulation, the die pad and leads are severed from the leadframe, and a completed package is cut from the leadframe.

US Patent:

6521987, Feb 18, 2003

Filed:

Oct 31, 2000

Appl. No.:

09/703195

Inventors:

Thomas P. Glenn - Gilbert AZ
Scott J. Jewler - Gilbert AZ
David Roman - Tempe AZ
Jae Hak Yee - Seoul, KR
Doo Hwan Moon - Seoul, KR

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 2312

US Classification:

257684, 257666, 257696, 257698, 257796, 257674, 257675, 257713, 257707, 257730, 257788

Abstract:

A package for an integrated circuit device, having a die, a die pad, leads, bond wire, and an encapsulant. The lower surfaces of the die pad and the leads are provided with stepped profiles. Structures extending from lateral sides of the leads are formed to prevent the leads from being pulled horizontally from the package. Encapsulant material fills beneath the recessed, substantially horizontal surfaces of the die pad and the leads, and thereby prevents the die pad and the leads from being pulled vertically from the package body. Other portions of the die pad and the leads are exposed within the package for connecting the package externally.

US Patent:

6570825, May 27, 2003

Filed:

Aug 21, 2001

Appl. No.:

09/934040

Inventors:

John Armando Miranda - Chandler AZ
David Tapia Roman - Tempe AZ

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H05K 700

US Classification:

368728, 361732, 361756

Abstract:

A method and circuit module package for automated switch actuator insertion provides automated assembly of circuit modules having an integrated switch actuator, such as Secure Digital cards. A switch actuator is inserted automatically into a circuit module package housing by a robotic assembler. The housing and switch actuator have mating surfaces to retain the switch actuator within the housing so that shipping and subsequent assembly do not dislodge the switch actuator. The switch actuator/housing assembly can be contoured such that the switch actuator/housing assemblies may be stacked and then fed to a stack-loading feeder for joining of the actuator/housing assemblies to the remainder of the circuit module package housing. The switch actuator may be made from a material having a higher melting point than the housing so that ultrasonic welding may be performed on the circuit module package without joining the switch actuator permanently to the circuit module package assembly.

US Patent:

6847103, Jan 25, 2005

Filed:

Nov 9, 1999

Appl. No.:

09/436158

Inventors:

Erasmo Perez - Chandler AZ, US
David T. Roman - Tempe AZ, US

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 23495

US Classification:

257676, 257666, 257667, 257668

Abstract:

A very thin, small outline, thermally enhanced semiconductor package includes a leadframe that is coined to form locking features on an exposed die pad and on a plurality of extremely narrow, closely spaced leads. The coined features improve the mechanical locking between the leadframe and the plastic body of the package to increase their resistance to delamination and subsequent penetration by moisture, and enable reliable wire bonds to be made to the otherwise extremely narrow leads.

US Patent:

6919620, Jul 19, 2005

Filed:

Sep 17, 2002

Appl. No.:

10/245071

Inventors:

Jeffrey Alan Miks - Chandler AZ, US
David Roman - Tempe AZ, US
John A. Miranda - Chandler AZ, US

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L023/495

US Classification:

257666, 257692, 257787

Abstract:

A memory card comprising a leadframe which includes a main frame defining a peripheral side. Extending toward the peripheral side of the main frame is a first set of leads, while extending away from the peripheral side is a second set of leads which are disposed in juxtaposed relation to respective ones of the leads of the first set. Positioned upon the main frame and electrically connected to the leads of the first and second sets is an electrical subassembly. A package body at least partially encapsulates the leadframe and the electrical subassembly. Portions of the leads of the first and second sets are exposed within the package body and mimic the structural and functional attributes of the fifty pin connector of a conventional CF card.

US Patent:

6965157, Nov 15, 2005

Filed:

Dec 16, 2003

Appl. No.:

10/737572

Inventors:

Erasmo Perez - Chandler AZ, US
David T. Roman - Tempe AZ, US

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L023/495

US Classification:

257666, 257787

Abstract:

A very thin, small outline, thermally enhanced semiconductor package includes a leadframe that is coined to form locking features on an exposed die pad and on a plurality of extremely narrow, closely spaced leads. The coined features improve the mechanical locking between the leadframe and the plastic body of the package to increase their resistance to delamination and subsequent penetration by moisture, and enable reliable wire bonds to be made to the otherwise extremely narrow leads.

US Patent:

8272105, Sep 25, 2012

Filed:

Oct 26, 2009

Appl. No.:

12/605636

Inventors:

David T. Roman - Chandler AZ, US

Assignee:

Cinta Tools, LLC - Scottsdale AZ

International Classification:

B25G 1/04

US Classification:

16429, 151444, 152358

Abstract:

An extendable linkage mechanism for operating a slave actuator over a range of distances from a master actuator, an extendable handle for operating a tool over a range of handle length; and a tool for use by an operator for dispensing drywall joint compound into joints between sheets of drywall. Slanted engagement surfaces on master and slave wedges engage each other as well as master and slave rods to transmit motion and force at varying distances, for instance, from a lever at one end to a clamp at the other end. The elongated slave rod passes through orifices in the wedges. Structural or tubular members may slidably engage to provide extendibility.

US Patent:

8356548, Jan 22, 2013

Filed:

Oct 26, 2009

Appl. No.:

12/605658

Inventors:

David T. Roman - Chandler AZ, US

Assignee:

Cinta Tools, LLC - Scottsdale AZ

International Classification:

F15B 15/16
B25G 1/00

US Classification:

92117A, 151441, 16429

Abstract:

Handles, extendable handles, and linkage mechanisms are examples of apparatuses that include a body; a pivotably attached head; cylinder, actuator, or hydraulic actuator; a fluid passage or hose; and a valve, blocking means, or hydraulic control device. The valve, blocking means, or hydraulic control device may be normally open and may close only when held closed, and may be connected on one side to the fluid passage or hose and on another side to atmosphere. An operator may use a tool, such as a drywall flat box attached to the head, by holding the handle and controlling pivoting of the head by operating the valve. Methods include providing for an operator to control a tool on a handle, and include providing the handle and instructing the operator to actuate the blocking means to hold the tool in a constant orientation relative to the handle.