Ronald James Jensen - Bloomington MN, US David Scheid - Eau Claire WI, US
Assignee:
Honeywell International Inc. - Morristown NJ
International Classification:
H01L 23/02
US Classification:
257686, 257777, 257698
Abstract:
An integrated circuit package base includes a plurality of tiers. In some examples, an integrated circuit package encloses a plurality of stacked integrated circuits that are each electrically coupled to an electrical contact located on a respective tier of the package base. The tiers of the integrated circuit package can have different elevations relative to a bottom surface of the integrated circuit package.