David D Stark

US Patent:

7134947, Nov 14, 2006

Filed:

Oct 29, 2003

Appl. No.:

10/696623

Inventors:

David A. Stark - Dallas TX, US
Christopher Schutte - Richardson TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

B24B 7/00
B24B 1/00

US Classification:

451285, 451287

Abstract:

According to one embodiment of the invention, a chemical mechanical polishing system includes a platen having a first surface adapted to couple a polishing pad thereto. The first surface includes a generally circular center portion and an annular portion surrounding the generally circular center portion. The generally circular center portion encloses an area and has an attachment surface area that is less than the area enclosed by the generally circular center portion. The attachment surface area is adapted to couple an inner portion of the polishing pad to the platen. According to one embodiment of the invention, a chemical mechanical polishing system includes a platen having a first surface coupling a polishing pad thereto. The first surface includes a generally circular center portion and an annular portion surrounding the generally circular center portion. The generally circular center portion encloses an area and has an attachment surface area that is less than the area enclosed by the generally circular center portion.

US Patent:

7695589, Apr 13, 2010

Filed:

Jul 21, 2004

Appl. No.:

10/897286

Inventors:

David A. Stark - Dallas TX, US
Laurence D. Schultz - Richardson TX, US
Neal T. Murphy - Richardson TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

C23F 1/00
C09K 3/14
H01L 21/306

US Classification:

15634512, 134 50, 134902, 134 991, 15634513

Abstract:

The present invention provides a system () for conditioning multi-component slurries utilized in chemical mechanical polishing (CMP) of semiconductor wafers (). The system provides a first slurry component (), and a second slurry component (). A conditioning component () has first and second inlets, and an outlet operatively coupled to a dispensing system (). First and second flow control components () are operably intercoupled between the first and second inlets and the first and second slurry components, respectively. The system further provides a megasonic energy source (), adapted to generate an energy field () across the conditioning component. A conveyance component () conducts the slurry components from the inlets through the energy field, and delivers a final mixture () of multi-component slurry to the outlet.

US Patent:

20060276042, Dec 7, 2006

Filed:

Aug 18, 2006

Appl. No.:

11/465501

Inventors:

David Stark - Dallas TX, US
Laurence Schultz - Richardson TX, US
Neal Murphy - Richardson TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 21/461

US Classification:

438692000

Abstract:

The present invention provides a system () for conditioning multi-component slurries utilized in chemical mechanical polishing (CMP) of semiconductor wafers (). The system provides a first slurry component (), and a second slurry component (). A conditioning component () has first and second inlets, and an outlet operatively coupled to a dispensing system (). First and second flow control components () are operably intercoupled between the first and second inlets and the first and second slurry components, respectively. The system further provides a megasonic energy source (), adapted to generate an energy field () across the conditioning component. A conveyance component () conducts the slurry components from the inlets through the energy field, and delivers a final mixture () of multi-component slurry to the outlet.