David Dawei Wei

US Patent:

6656024, Dec 2, 2003

Filed:

Dec 21, 2001

Appl. No.:

10/029742

Inventors:

John M. Boyd - Atascadero CA
David Wei - Fremont CA
Yehiel Gotkis - Fremont CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 500

US Classification:

451 41, 451 24, 451303, 451285

Abstract:

A retaining ring is provided. The retaining ring includes a lower annular sleeve having a base. The base has an inner sidewall and an outer sidewall extending therefrom. The lower annular sleeve has at least one hole defined therein. An upper annular sleeve is moveably disposed over the lower annular sleeve. The upper annular sleeve has a top, that has at least one hole defined therein. The top has an inner sidewall and an outer sidewall extending therefrom. A method for reducing a consumption of compressed dry air (CDA) during a chemical mechanical planarization (CMP) operation is also described.

US Patent:

6719874, Apr 13, 2004

Filed:

Mar 30, 2001

Appl. No.:

09/823800

Inventors:

Yehiel Gotkis - Fremont CA
Aleksander A. Owczarz - San Jose CA
Miguel A. Saldana - Fremont CA
David Wei - Fremont CA
Damon Vincent Williams - Fremont CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 100

US Classification:

15634514, 451 41

Abstract:

A chemical mechanical planarization (CMP) system having a polishing pad, a carrier body for holding a wafer, a retaining ring, and an active retaining ring support is provided. The active retaining ring is defined by a circular ring having a thickness and a width. The circular ring is defined by an elastomeric material. The circular ring is configured to be placed between the retaining ring and the carrier body. The circular ring has a plurality of voids therein, and the plurality of voids are defined in locations around the circular ring. The circular ring has a compressibility level that is set by the elastomeric material and the plurality of voids.

US Patent:

6749491, Jun 15, 2004

Filed:

Dec 26, 2001

Appl. No.:

10/033501

Inventors:

Yehiel Gotkis - Fremont CA
David Wei - Fremont CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 2120

US Classification:

451296, 451311, 451499, 451 5

Abstract:

An apparatus for reducing non-uniform stretch of a belt used in the CMP system is disclosed. The belt that may be used with the apparatus extends between a first roller and a second roller to define a belt loop with an inner surface and an outer surface to be used for CMP. The apparatus includes a compensating roller that has a first end and a second end where the first end and second end extends a width of the belt. The first end and the second end have a first diameter. The center of the roller has a second diameter that is less than the first diameter. The compensating roller has a symmetrically tapered shape that extends between each of the first end and second end to the center. The compensating roller is positioned inside of the belt loop, and is applied to the inner surface of the belt loop to reduce non-uniform stretch of the belt.

US Patent:

6761626, Jul 13, 2004

Filed:

Dec 20, 2001

Appl. No.:

10/037452

Inventors:

Anthony de la Llera - Union City CA
Xuyen Pham - Fremont CA
David Wei - Fremont CA
Tony Luong - San Jose CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 722

US Classification:

451303, 451307

Abstract:

An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.

US Patent:

6808442, Oct 26, 2004

Filed:

Dec 20, 2001

Appl. No.:

10/027947

Inventors:

David Wei - Fremont CA
Yehiel Gotkis - Fremont CA
Aleksander Owczarz - San Jose CA
John M. Boyd - Atascadero CA
Rod Kistler - Los Gatos CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 100

US Classification:

451 59, 451 41, 451288, 451290, 451303, 451311, 451495

Abstract:

An invention is provided for removal rate profile manipulation during a CMP process. An apparatus of the embodiments of the present invention includes an actuator capable of vertical movement perpendicular to a polishing surface of a polishing pad. The actuator is further capable of flexing the polishing pad independently of a pad support device. Also included in the apparatus is an actuator control mechanism that is in communication with the actuator. The actuator control mechanism is capable of controlling an amount of vertical movement of the actuator, allowing the actuator to provide local flexing of the polishing pad to achieve a particular removal rate profile. The actuator can also be capable of horizontal movement parallel to the polishing surface of the polishing pad.

US Patent:

6878048, Apr 12, 2005

Filed:

Jun 8, 2004

Appl. No.:

10/864031

Inventors:

Yehiel Gotkis - Fremont CA, US
David Wei - Fremont CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B021/20

US Classification:

451296, 451 5, 451311, 451499

Abstract:

An apparatus for reducing non-uniform stretch of a belt used in the CMP system is disclosed. The belt that may be used with the apparatus extends between a first roller and a second roller to define a belt loop with an inner surface and an outer surface to be used for CMP. The apparatus includes a compensating roller that has a first end and a second end where the first end and second end extends a width of the belt. The first end and the second end have a first diameter. The center of the roller has a second diameter that is less than the first diameter. The compensating roller has a symmetrically tapered shape that extends between each of the first end and second end to the center. The compensating roller is positioned inside of the belt loop, and is applied to the inner surface of the belt loop to reduce non-uniform stretch of the belt.

US Patent:

6896586, May 24, 2005

Filed:

Mar 29, 2002

Appl. No.:

10/112628

Inventors:

Xuyen Pham - Fremont CA, US
Tuan Nguyen - San Jose CA, US
Ren Zhou - Fremont CA, US
David Wei - Fremont CA, US
Linda Jiang - Milpitas CA, US
Joseph P. Simon - Newark CA, US
Tony Luong - San Jose CA, US
Sridharan Srivatsan - Sunnyvale CA, US
Anjun Jerry Jin - Milpitas CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B049/00

US Classification:

451 7, 451 8, 451 53

Abstract:

A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.

US Patent:

6976906, Dec 20, 2005

Filed:

Oct 7, 2003

Appl. No.:

10/681719

Inventors:

John M. Boyd - Atascadero CA, US
David Wei - Fremont CA, US
Yehiel Gotkis - Fremont CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B005/00

US Classification:

451 41, 451 24, 451285, 451303

Abstract:

A chemical mechanical planarization (CMP) system is provided. The system includes a polishing surface and a platen disposed along an underside of the polishing surface. A retaining ring surrounds the platen. The retaining ring includes a lower annular sleeve and an upper annular sleeve moveably disposed over the lower annular sleeve. A method for reducing a consumption of compressed dry air (CDA) during a chemical mechanical planarization (CMP) operation is also described.

Address:

4142 Stevenson Blvd APT 1216, Fremont, CA 94538

Phone:

5106978898

VIN:

WMWMF73547TT83205

Make:

MINI

Model:

COOPER

Year:

2007