David Paul Workman

US Patent:

6440689, Aug 27, 2002

Filed:

Jun 28, 2001

Appl. No.:

09/894929

Inventors:

Rodney H. Banks - Aurora IL
Nancy L. Casselman - Aurora IL
Mita Chattoraj - Warrenville IL
Ronald V. Davis - Geneva IL
Michael J. Fehr - Geneva IL
Sasireka S. Ramesh - Aurora IL
David P. Workman - Naperville IL

Assignee:

Ondeo Nalco Company - Naperville IL

International Classification:

C12Q 102

US Classification:

435 29, 435968, 435 4

Abstract:

A method for monitoring the microbiological contamination of opaque media is described and claimed. In this method, a Fluorogenic Dye is added to an Aliquot of opaque medium. After a certain time period, a fluorometer capable of measuring fluorescent signals in an opaque medium is used to measure the fluorogenic signals of the Fluorogenic Dye and the Reacted Fluorogenic Dye. A Useful RATIO of the fluorescent signal of the Reacted Fluorogenic Dye to the fluorescent signal of the Fluorogenic Dye is calculated and the information gleaned from the RATIO is used to ascertain the state of microbiological contamination in the opaque medium.

US Patent:

6461518, Oct 8, 2002

Filed:

Oct 30, 2000

Appl. No.:

09/699672

Inventors:

Konstantinos Demadis - Glen Ellyn IL
Douglas G. Kelley - Naperville IL
David P. Workman - Naperville IL
Mingli Wei - Naperville IL

Assignee:

Nalco Chemical Company - Naperville IL

International Classification:

C02F 512

US Classification:

210698, 252180, 252392, 422 16

Abstract:

This invention relates to a method for inhibiting the formation and deposition of silica scale in water systems. The method includes treating the water in such water systems with an effective amount of a polyamide that contains secondary amine and/or ether and amide functional groups.

US Patent:

6545244, Apr 8, 2003

Filed:

Aug 27, 2001

Appl. No.:

09/940390

Inventors:

Jerry E. Gould - Columbus OH
Lawrence R. Lehman - Columbus OH
David P. Workman - Dublin OH

Assignee:

Edison Welding Institute - Columbus OH

International Classification:

B23K 1106

US Classification:

219118, 219119, 219 82, 219 83

Abstract:

A welding arrangement comprises first and second parts to be welded with an edge portion of the first part and an edge portion of the second part juxtaposed to form a weld zone. An electrically-conductive sheet(s) with a higher melting temperature than a melting temperature of the first and second parts are placed over the weld zone and a force application device is used to apply a lateral compressive force to the weld zone. First and second electrodes are placed in contact with the electrically conductive sheet(s) which are resistively heated and in turn conductively heat the weld zone.

US Patent:

7126076, Oct 24, 2006

Filed:

Feb 5, 2004

Appl. No.:

10/772701

Inventors:

David P. Workman - Dublin OH, US
Timothy J. Trapp - Upper Arlington OH, US
Jerry E. Gould - Grandview Heights OH, US

Assignee:

Edison Welding Institute, Inc. - Columbus OH

International Classification:

B23K 11/00

US Classification:

2191171, 228119

Abstract:

A method for repairing defects in a metallic substrate including the steps of placing a consumable filler slug in contact with the substrate in the vicinity of the defect; bringing a first electrode and a second electrode in contact with the consumable slug and applying a pressure to the consumable slug; and transmitting electrical current between the electrodes for a period, thereby resistively heating the consumable slug and the metallic substrate resulting in coalescence in a substantially liquid pool that fills the defect. The pool is then cooled to solidification under the pressure of the electrodes. The electrodes are then removed from contact with the consumable slug and excess material may be removed. The consumable slug may be formed as a single unit or multiple sections, and may incorporate sacrificial retainers to add additional defect filling material, retain the pool, and seal the pool from atmosphere.

US Patent:

7141754, Nov 28, 2006

Filed:

Nov 5, 2004

Appl. No.:

10/983154

Inventors:

David Page Workman - Dublin OH, US
Timothy Joseph Trapp - Upper Arlington OH, US
Jerry Ellison Gould - Grandview Heights OH, US

Assignee:

Edison Welding Institute, Inc. - Columbus OH

International Classification:

B23K 11/00

US Classification:

2191171, 228119

Abstract:

A method for repairing defects in a substrate including the steps of placing a consumable filler slug in contact with the substrate in the vicinity of the defect; placing at least one electrically conductive cover sheet in contact with a portion of the consumable filler slug; bringing a first electrode and a second electrode in contact with the at least one cover sheet and applying a force; and transmitting electrical current between the electrodes, thereby resistively heating the at least one cover sheet and conductively heating the consumable slug and a portion of the substrate resulting in coalescence in a substantially liquid pool that fills the defect. The pool is then cooled to solidification under pressure. Alternative embodiments eliminate the need for the conductive cover sheet(s) by utilizing electrodes having increased electrical and thermal resistance. The consumable slug may be formed as a single unit or multiple sections, and may incorporate sacrificial retainers.

US Patent:

7467741, Dec 23, 2008

Filed:

Oct 21, 2003

Appl. No.:

10/689771

Inventors:

David P. Workman - Dublin OH, US

Assignee:

Cabot Corporation - Boston MA

International Classification:

C23C 14/34
B23K 20/12

US Classification:

228114, 2281121, 228115, 228116, 228136, 228164, 228166, 228167, 228168, 228171, 2281732, 228165, 228193, 228194, 228195, 20429812, 20419813

Abstract:

A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method includes bonding a sputtering target to a backing plate at a low temperature. Also described is a method of forming a sputtering target assembly such that a gap is formed between the sputtering target and the backing plate. Also described is a method of forming a sputtering target assembly providing a mechanism to prevent unintended sputtering into the backing plate.

US Patent:

20050004236, Jan 6, 2005

Filed:

Jul 1, 2003

Appl. No.:

10/610687

Inventors:

David Workman - Naperville IL, US
Ronald Doles - LaGrange Park IL, US

International Classification:

C01B033/141
B32B021/12

US Classification:

516080000, 428452000

Abstract:

Silica particle agglomerates prepared by adding an aluminum phosphate agglomerating agent with mixing to an aqueous dispersion of colloidal silica particles to form an aqueous homogeneous dispersion of silica particles and agglomerating agent and then adjusting the pH of the dispersion with mixing to about 3.5 to about 8.5 to produce the agglomerated silica particles and use of the agglomerates to prepare an ink receptive coating, as catalysts, as reinforcing fillers and as flattening agents.

US Patent:

20050178070, Aug 18, 2005

Filed:

Jun 30, 2004

Appl. No.:

10/880910

Inventors:

David Workman - Naperville IL, US
Michael Romba - Joliet IL, US
Ronald Doles - LaGrange Park IL, US

International Classification:

B01J002/28
B24D003/02
C04B014/04

US Classification:

051307000, 02331300R, 106483000, 106287170, 051309000, 051308000, 106426000, 106442000, 106450000, 106459000

Abstract:

Metal oxide particle agglomerates prepared by adding an aluminum phosphate agglomerating agent with mixing to an aqueous dispersion of metal oxide nanoparticles to form an aqueous homogeneous dispersion of nanoparticles and agglomerating agent and then adjusting the pH of the dispersion with mixing to about 3.5 to about 6.5 to produce the particle agglomerates and use of the particle agglomerates to prepare ink receptive coatings, as catalysts, as reinforcing fillers, as polishing abrasives and as flattening agents.