Klaus Beyer - Poughkeepsie NY, US Patricia O'Neil - Fishkill NY, US Deborah Ryan - Lagrangeville NY, US Peter Smeys - Palo Alto CA, US Effendi Leobandung - Wappingers Falls NY, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
H01L021/76
US Classification:
438/404000, 438/424000, 438/427000, 438/435000
Abstract:
In an integrated circuit process for SOI including trench device isolation, the problem of voids in the trench fill is addressed by a triple fill process, in which a thermal oxide sidewall having recesses at the bottom corners is covered with a LPCVD deposition that fills in the recesses, followed by a void-free HDP deposition. Densification results in substantially the same etch rate for the three types of oxide.
New Hyde Park-Garden City Park UFSD New Hyde Park, NY Sep 2006 to Dec 2014 Teacher, Elementary School
Education:
SUNY Plattsburgh Plattsburgh, NY 1997 to 2001 MS in LiteracySUNY Plattsburgh Plattsburgh, NY 1993 to 1997 BS in Elementary Education, Mathematics concentration
Kuchera and Potash OB/GYN Cedar Knolls, NJ 2007 to 2010 Medical AssistantKuchera and Potash OB/GYN
2007 to 2010 Phlebotomy TechnicianHome Nutritional Services Parsippany, NJ 2000 to 2007 Patient Account RepresentativePeter's Marketing Research Parsippany, NJ 1999 to 2003 Research Assistant
Education:
Antham Institute Parsippany, NJ 2006 to 2007 Medcial Assistant, Phlebotomist, EKG Technician, CPR & AED Certified in Allied HealthPassaic County Technical and Vocational High School Wayne, NJ 1982 to 1986 HS Diploma
ENK International New York, NY Jun 2011 to Sep 2012 Manager Finance and AccountingIMG Worldwide New York, NY Mar 2007 to Jun 2011 Senior Financial Analyst - Financial Planning & AnalysisForstmann Little & Co New York, NY May 2003 to Mar 2007 Assistant Analyst
Education:
University of Phoenix Jan 2011 MBA in General BusinessDowling College Jan 2003 BA in Psychology