2012 to 2014 Administrative AssistantRural Metro Ambulance
2008 to 2011 Medicare PCS RepresentativeStrong Haul Trucking
2007 to 2008 Office Manager
Education:
Clover Park Technical College Lakewood, WA 1996 to 1997 Diploma in Office AdministrationEverest College Mesa, AZ Diploma in Medical Billing and Coding
Skills:
Receptionist experience, multi-line phone, customer service, proficient in Word, Excel, Outlook and Lotus Notes, SAP, AS400, 10-key (11,000 sph), QuickBooks Pro
Kaiser Permanente Marlow Heights Medical Center 5100 Auth Way, Suitland, MD 20746 3017025000 (phone), 3017025116 (fax)
Education:
Medical School Howard University College of Medicine Graduated: 1982
Conditions:
Diabetes Mellitus (DM) Disorders of Lipoid Metabolism Hypertension (HTN) Hypothyroidism Skin and Subcutaneous Infections
Languages:
English Spanish
Description:
Dr. Thompson graduated from the Howard University College of Medicine in 1982. She works in Suitland, MD and specializes in Family Medicine. Dr. Thompson is affiliated with Holy Cross Hospital and Medstar Washington Hospital Center.
Bienville Orthopaedics Specialists LLC 1720A Medical Park Dr STE 220, Biloxi, MS 39532 2283929355 (phone), 2283921781 (fax)
Languages:
English
Description:
Ms. Thompson works in Biloxi, MS and specializes in Orthopaedic Surgery. Ms. Thompson is affiliated with Merit Health Biloxi and Ocean Springs Hospital.
Premiere Physicians 726 S Weber Rd, Bolingbrook, IL 60490 6303789785 (phone), 6303789836 (fax)
Languages:
English Spanish
Description:
Ms. Thompson works in Bolingbrook, IL and specializes in Internal Medicine. Ms. Thompson is affiliated with Adventist Bolingbrook Hospital and Edward Hospital.
Kabul Sengupta - Tempe AZ Deborah L. Thompson - Tempe AZ
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2144
US Classification:
438126, 438116, 438121, 438122, 257680, 257796
Abstract:
An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.
Kabul Sengupta - Tempe AZ, US Deborah L. Thompson - Tempe AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 23/02
US Classification:
257678, 257680
Abstract:
An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.
Kabul Sengupta - Tempe AZ, US Deborah L. Thompson - Tempe AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21/44
US Classification:
438106, 438126
Abstract:
An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.
Windowed Non-Ceramic Package Having Embedded Frame
Kabul Sengupta - Tempe AZ Deborah L. Thompson - Tempe AZ
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 310203 H01L 2302 H01L 2322
US Classification:
257680
Abstract:
An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.
Kabul S. Sengupta - Tempe AZ Carl E. Sklenicka - Phoenix AZ Deborah L. Thompson - Tempe AZ Raul A. Arellano - Phoenix AZ Naoyuki Nagai - Kagoshima, JP Nobuyuki Takehashi - Shinga, JP Kouichiro Nomoto - Kagoshima, JP
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2302
US Classification:
174 523
Abstract:
A windowed package is capable of withstanding a mass reflow process. During mass reflow, the entire package is subjected to the solder reflow temperature. In one embodiment, the lid comprises a ceramic frame and a glass window.
Youtube
Deborah Thompson
Story Summit January 31, 2020 Storyteller: Deborah Thompson Story Summ...
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Fire Fall Udeme Otung ft Ijeoma Nwachi Debor...
worshipsongs #gospelsongs.
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Min. Deborah Thompson - Stay With Jesus
My Event Description.
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49m 11s
'Enthusiasm - the Easy path to succeed' with ...
Enthusiasm - the Easy path to succeed where Craig Gordon is in convers...
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28m 14s
City Called Heaven - Deborah Thompson, "The R...
Various Artists - The Roots Of Gospel Music Audio CD Release Date: Jun...