William F. Burghout - Mesa AZ, US Dennis Lee Conner - Glendale AZ, US Michael J. Seddon - Gilbert AZ, US Jay A. Yoder - Phoenix AZ, US
International Classification:
H01L 21/78
US Classification:
438460, 257E21599
Abstract:
In one embodiment, semiconductor die are singulated from a semiconductor wafer having a backmetal layer by placing the semiconductor wafer onto a carrier tape with the backmetal layer adjacent the carrier tape, forming singulation lines through the semiconductor wafer to expose the backmetal layer within the singulation lines, and fluid machining the semiconductor wafer to remove the backmetal layer from the singulation lines.
Semiconductor Package Structures And Methods Of Manufacture
- Phoenix AZ, US Jay A. YODER - Phoenix AZ, US Dennis Lee CONNER - Peoria AZ, US Frank Robert CERVANTES - Laveen AZ, US Andrew Celaya - Phoenix AZ, US
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC - Phoenix AZ
International Classification:
H01L 23/498 H01L 21/56 H01L 23/495 H01L 23/31
Abstract:
Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.
Single Or Multi Chip Module Package And Related Methods
- Phoenix AZ, US Roger M. Arbuthnot - Mesa AZ, US Jay A. Yoder - Phoenix AZ, US Dennis Lee Conner - Glendale AZ, US
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC - Phoenix AZ
International Classification:
H01L 23/498 H01L 21/56 H01L 23/495 H01L 23/31
Abstract:
Implementations of a semiconductor device package may include: a plurality of electrical contacts on a first face of a die, at least one clip electrically and mechanically coupled with at least one electrical contact on a second face of the die where the second face of the die is on an opposing side of the die from the first face of the die. The at least one clip may include at least one lead in electrical communication with the at least one electrical contact on the second face of the die. A mold compound or an encapsulating compound may be included around the die and a majority of the at least one clip where a portion of the at least one lead and a portion of the plurality of electrical contacts on the first face of the die are not overmolded or encapsulated. The semiconductor package includes no lead frame.
Single Or Multi Chip Module Package And Related Methods
- Phoenix AZ, US Roger M. ARBUTHNOT - Mesa AZ, US Jay A. YODER - Phoenix AZ, US Dennis Lee CONNER - Glendale AZ, US
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC - Phoenix AZ
International Classification:
H01L 23/498 H01L 23/495 H01L 21/56 H01L 23/31
Abstract:
Implementations of a semiconductor device package may include: a plurality of electrical contacts on a first face of a die, at least one clip electrically and mechanically coupled with at least one electrical contact on a second face of the die where the second face of the die is on an opposing side of the die from the first face of the die. The at least one clip may include at least one lead in electrical communication with the at least one electrical contact on the second face of the die. A mold compound or an encapsulating compound may be included around the die and a majority of the at least one clip where a portion of the at least one lead and a portion of the plurality of electrical contacts on the first face of the die are not overmolded or encapsulated. The semiconductor package includes no lead frame.
Single Or Multi Chip Module Package And Related Methods
- Phoenix AZ, US Roger M. Arbuthnot - Mesa AZ, US Jay A. Yoder - Phoenix AZ, US Dennis Lee Conner - Glendale AZ, US
International Classification:
H01L 21/56
Abstract:
A method of forming a semiconductor device package. Implementations may include providing an adhesive tape; contacting at least one electrical contact of at least one die with an adhesive surface of the adhesive tape; mechanically and electrically coupling at least one clip with the at least one die and contacting an electrical contact of the at least one clip with the adhesive surface; one of overmolding and encapsulating the at least one die and a majority of the at least one clip with one of a mold compound and an encapsulating compound, respectively, wherein the at least one electrical contact of the at least one die and the electrical contact of the at least one clip are not one of overmolded and encapsulated, forming the semiconductor device package; removing the semiconductor device package from the adhesive surface; and including no leadframe in the package.
joined by New Zealander Russell Coutts, the CEO of Oracle Team USA who suffered his first defeat in six Americas Cup finals. It was Coutts who first won the America's Cup for the small sailing-mad island nation, skippering Team New Zealand to a five-race sweep of Dennis Conner off San Diego in 1995.
Bond, a larger-than-life entrepreneur, became a national hero when he led a team that won the Americas Cup yachting crown from the US in 1983, bankrolling Australia IIs historic victory over Dennis Conners Liberty.
In a landmark victory, Coutts led Team New Zealand to a five-race sweep of American skipper Dennis Conner off San Diego in 1995. He then guided the Kiwis to a sweep of Luna Rossa in the 2000 America's Cup before jumping ship for a bigger paycheck from Alinghi of Switzerland, leading it to a sweep of
Date: Apr 01, 2015
Category: Sports
Source: Google
Oracle Team USA Picks Bermuda for 2017 America's Cup
San Diego appeared to have all the advantages: It held the event in the 1980s and 1990s, where Dennis Conner famously sailed the yacht Stars and Stripes. It was home to Jimmy Spithill, the Oracle teams skipper, and just an hours flight fr
Australia's big moment in the America's Cup came in 1983, when John Bertrand beat Dennis Conner to end the New York Yacht Club's 132-year winning streak. Four years later, Conner went down under and beat Murray to reclaim the Auld Mug.
If San Diego is selected, racing would be on the bay rather than miles offshore on the Pacific Ocean when the city hosted the America's Cup in 1988, 1992 and 1995. Coutts ended San Diego's run when he skippered Team New Zealand to a five-race sweep of Dennis Conner in May 1995. Coutts still owns a h
Date: Jun 11, 2014
Category: Sports
Source: Google
Murray hired to lead Australian America's Cup team
Murray competed in three Americas Cups. He was the losing skipper in 1987, when Dennis Conner swept Kookaburra III to regain the Americas Cup for the United States after losing it to Australia four years earlier.
Date: Nov 27, 2013
Category: Sports
Source: Google
Race 14 of America's Cup postponed due to unsettled wind as Kiwis hold on ...
The rules are the rules, said Murray, an Australian who lost the Americas Cup in 1987 to Dennis Conner. We didnt make them. They were made by the teams, and the teams have to abide by them.