Dennis R Patterson

US Patent:

6401884, Jun 11, 2002

Filed:

Dec 27, 2000

Appl. No.:

09/748555

Inventors:

Ralph S. Norman - Chula Vista CA 91910
Dennis Patterson - Hesperia CA 92345

International Classification:

F16F 914

US Classification:

188310, 188306

Abstract:

A fluidic dampening device having a housing containing a rotatably mounted wiper that sealingly moves past the side walls, bottom, and peripheral wall of the housing as well as a faceplate attached to the top of the housing. The housing contains a bypass channel that has a first port in the first side wall of the chamber and a second port in the second side wall of the chamber. A control shaft is rotatably mounted within the housing. The control shaft has indentations of varying sizes formed at distinct points around the shaft with areas having no indentation between each consecutive pair of indentations and is so located in the housing that either no indentation or only one indentation lies within the bypass channel at a given time. When no indentation has been rotated into the bypass channel, the control shaft completely blocks the bypass channel. Optionally, channels exist in the bottom of the faceplate or in the portion of the housing which forms the bottom of the chamber.

US Patent:

6790597, Sep 14, 2004

Filed:

Aug 1, 2002

Appl. No.:

10/211168

Inventors:

Stephen M. Dershem - San Diego CA
Dennis B. Patterson - Palmdale CA

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

C08F22240

US Classification:

430300, 430311, 430320, 430321, 430331, 4284735, 428355 CN, 428355 N, 428901, 522173, 522176, 25218311, 526266, 526262, 524548, 427 96, 4272071, 4272082

Abstract:

In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e. g. , in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

US Patent:

6825245, Nov 30, 2004

Filed:

Aug 1, 2002

Appl. No.:

10/211164

Inventors:

Stephen M. Dershem - San Diego CA
Dennis B. Patterson - Palmdale CA

Assignee:

Henkel Corporation - CT

International Classification:

C08J 328

US Classification:

522142, 522144, 522164, 522152, 522182, 522176, 522173, 522178, 522181, 522 74, 522 77, 522 83, 522 81, 522 60, 526262, 525282, 525205, 525322, 524439, 524506, 524516, 524580

Abstract:

In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e. g. , in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

US Patent:

6852814, Feb 8, 2005

Filed:

Feb 25, 2002

Appl. No.:

10/084389

Inventors:

Stephen M. Dershem - San Diego CA, US
Dennis B. Patterson - Palmdale CA, US

Assignee:

Henkel Corporation - CT

International Classification:

C08F222/40

US Classification:

526262, 524439, 524506, 524516, 524850, 525282, 525205, 525322, 522 60, 522 61, 522176, 522173, 522164

Abstract:

In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e. g. , in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

US Patent:

6916856, Jul 12, 2005

Filed:

Jul 3, 2002

Appl. No.:

10/187839

Inventors:

Stephen M. Dershem - San Diego CA, US
Dennis B. Patterson - Palmdale CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

C08F002/46

US Classification:

522176, 522152, 522164, 522173, 526262, 524439, 524506, 524516, 524850, 525282, 525205, 525322, 430311, 430320

Abstract:

In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e. g. , in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

US Patent:

7102015, Sep 5, 2006

Filed:

Jun 18, 2004

Appl. No.:

10/870066

Inventors:

Stephen M Dershem - San Diego CA, US
Dennis B Patterson - Palmdale CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

C07D 207/448

US Classification:

548548

Abstract:

In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e. g. , in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

US Patent:

7309724, Dec 18, 2007

Filed:

Jun 10, 2004

Appl. No.:

10/865506

Inventors:

Stephen M. Dershem - San Diego CA, US
Dennis B. Patterson - Palmdale CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

C08F 2/46
C08F 222/40

US Classification:

522164, 522168, 522170, 522173, 522176, 522 60, 522 61, 522100, 522143, 525282, 525205, 525322, 524439, 524506, 524850, 526262

Abstract:

In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e. g. , in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

US Patent:

7645899, Jan 12, 2010

Filed:

Sep 5, 2006

Appl. No.:

11/469964

Inventors:

Stephen M. Dershem - San Diego CA, US
Dennis B. Patterson - Palmdale CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

C07C 69/74

US Classification:

560128

Abstract:

In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e. g. , in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.