Derek T Smith

US Patent:

6502783, Jan 7, 2003

Filed:

Aug 15, 2000

Appl. No.:

09/639279

Inventors:

Derek T. Smith - Eagle ID
Tony T. Ibarra - Nampa ID
Merle Bicknell - Nampa ID
Todd D. Higgins - Nampa ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B65H 1808

US Classification:

2425303, 242393, 242534, 242540, 242541, 2425942, 2425943

Abstract:

A carrier tape recycling apparatus for receiving bare carrier tape from a manufacturing system and for winding the carrier tape onto a plurality of tape reels for reuse. The carrier tape recycling apparatus includes a reel drive mechanism configured to support and rotationally drive a plurality of tape reels such that bare carrier tape dispensed from the manufacturing system may be wound onto the tape reels. The reel drive mechanism provides a slip drive allowing each tape reel disposed in the recycling apparatus to rotate and receive carrier tape independent of other tape reels disposed in the recycling apparatus, so as to compensate for variation in the rate at which carrier tape is supplied to each tape reel disposed in the carrier tape recycling apparatus. The present invention also includes a method of using the recycling apparatus to recycle bare carrier tape dispensed from a manufacturing system.

US Patent:

60546824, Apr 25, 2000

Filed:

Mar 11, 1999

Appl. No.:

9/266499

Inventors:

Roland Ochoa - Nampa ID
Derek T. Smith - Eagle ID

Assignee:

Micron Electronics, Inc. - Boise ID

International Classification:

F26B 1310
F27B 319
F27B 914

US Classification:

219388

Abstract:

A system and method for assembling components onto a circuit board is disclosed. The system includes: a thermal chamber for receiving a plurality of components therein and for heating the plurality of components at a predetermined temperature for a predetermined length of time; an outfeed slot located on a wall of the thermal chamber which allows at least one component from the plurality of components to pass therethrough and emerge externally of the thermal chamber; and a pick and place machine, located adjacent to the thermal chamber, which automatically retrieves the at least one component which has passed through the outfeed slot and automatically places the at least one component onto a designated circuit board. The method includes: placing at least one component into an interior chamber of a thermal oven; heating the at least one component at a predetermined temperature within the thermal oven for a predetermined length of time; passing the at least one component through an outfeed slot located on a wall of the thermal oven, at the expiration of the predetermined length of time, such that the at least one component emerges externally of the thermal oven; and retrieving the at least one component which emerges from the thermal oven through the outfeed slot with an automated pick and place machine which thereafter places the at least one component onto a designated circuit board.

US Patent:

20230042526, Feb 9, 2023

Filed:

Oct 18, 2022

Appl. No.:

17/968415

Inventors:

- Midvale UT, US
Derek M. Smith - Alpine UT, US
John W. Melville - Salt Lake City UT, US
Brian S. Packer - Weiser ID, US

International Classification:

B29C 63/02
B32B 27/30
B29C 63/00
B32B 25/20
B32B 7/12
B32B 27/40
B32B 25/08
B32B 27/28
B32B 27/36
C09J 7/29
B32B 7/06
B32B 27/32
B32B 27/08
G06F 1/16
H04M 1/18

Abstract:

A protective film includes an adhesive material configured for “dry” application to a surface that is to be protected, such as the surface of an electronic device. An installation assembly that includes the protective film is configured to minimize or eliminate contact with the protective film as it is applied to the surface that is to be protected. Methods for manufacturing a protective film and an installation assembly that includes the protective film may be effected in contaminant-free conditions. Methods for applying the protective film are also disclosed, as are devices (e.g., electronic devices, etc.) with at least one surface covered with a protective film.

US Patent:

20150133824, May 14, 2015

Filed:

Nov 11, 2014

Appl. No.:

14/538384

Inventors:

- New Brunswick NJ, US
Edan Golomb - Hoboken NJ, US
Kyle Ripley - Weymouth MA, US
Derek Smith - Boise ID, US
Jennifer Trinh - Jersey City NJ, US
Vikki Hazelwood - Wayne NJ, US

Assignee:

Stevens Institute of Technology - Hoboken NJ

International Classification:

A61B 5/11

US Classification:

600595

Abstract:

A monitoring apparatus includes a clip assembly configured to be secured on a patient's digit. The clip assembly houses an accelerometer which measures acceleration in three dimensions. A microcontroller is configured to receive acceleration data from the accelerometer representative of the acceleration measured in each of the three dimensions. A processor is configured to analyze the acceleration data and determine and output a train-of-four ratio based the acceleration measured in each of the three dimensions.

Address:

960 Lincoln St, Salt Lake City, UT 84105

Phone:

8015578049

VIN:

3TMLU4EN2BM079653

Make:

TOYOTA

Model:

TACOMA

Year:

2011