Saddlebck Memorial Medical Ctr 24451 Health Center Dr Suite 540, Laguna Hills, CA 92653 9494527199 (Phone)
Certifications:
Obstetrics & Gynecology, 2001
Awards:
Healthgrades Honor Roll
Languages:
English Spanish
Education:
Medical School University of California At Irvine / California College of Medicine & Surgery Graduated: 1988 Medical School UCLA Med Ctr Graduated: 1988
Pediatrix Medical GroupMagella Medical Group 24411 Health Ctr Dr STE 300, Laguna Hills, CA 92653 9494527199 (phone), 9494527333 (fax)
Education:
Medical School University of California, Irvine School of Medicine Graduated: 1988
Procedures:
Vaginal Repair
Conditions:
Conditions of Pregnancy and Delivery Pregnancy-Induced Hypertension Uncomplicated or Low Risk Pregnancy and Delivery Abnormal Vaginal Bleeding Complicating Pregnancy or Childbirth
Languages:
Chinese English Spanish
Description:
Dr. Vu graduated from the University of California, Irvine School of Medicine in 1988. He works in Laguna Hills, CA and specializes in Obstetrics & Gynecology. Dr. Vu is affiliated with Saddleback Memorial Medical Center.
An endoscopic balloon device and method of using in a laparoscopic surgical procedure such as a cystectomy is disclosed. An intact organ such as an ovary is encapsulated with the endoscopic balloon while the organ remains attached to the body. By inserting instruments into the bag, a surgical procedure is then performed within the bag, for example, a cyst may be removed from an ovary. After cyst removal, the bag is irrigated to remove leakage before withdrawal of the cyst within the bag.
Endoscopic Device For Spill-Proof Laparoscopic Ovarian Cystectomy
A endoscopic device for use in a laparoscopic surgical procedure such as a cystectomy is disclosed. An intact organ such as an ovary is encapsulated partially or completely with the endoscopic device while the organ remains attached to the body. By inserting instruments into the endoscopic device, a surgical procedure is then performed within the endoscopic device, for example, a cyst may be removed from an ovary. After cyst removal, the endoscopic device is irrigated to remove leakage before withdrawal of the cyst within the endoscopic device.
- Saint Marys PA, US Lihua Li - Fremont CA, US Kim Vu - Milpitas CA, US Dinh Vu - San Jose CA, US
International Classification:
G01L 9/06 G01R 33/09 G01R 33/07
Abstract:
A device/method for sensing a physical parameter, including a sensor die and a stress-sensitive circuit. The sensor die includes a semiconductor substrate and a cavity that creates an elastic element that bends in response to the physical parameter exerted on the sensor die. The elastic element includes at least at least one rigid island formed within the cavity, a thin area surrounding the at least one rigid island and having smaller thickness than the rigid island, and at least one stress concentrator at least partially formed in the thin area of the elastic element on the side of the substrate opposite the cavity. The stress-sensitive circuit includes at least one stress-sensitive component formed in the thin area of the elastic element. The at least one stress concentrator increases stress in the locations of the at least one stress-sensitive component resulting in an increase of the device sensitivity to the physical parameter.
- Schenectady NY, US Lihua Li - Fremont CA, US Kim Vu - Milpitas CA, US Dinh Vu - San Jose CA, US
Assignee:
GENERAL ELECTRIC COMPANY - Schenectady NY
International Classification:
G01L 9/06 B81C 1/00 G01L 9/00
Abstract:
Low pressure sensors and flow sensors are provided. In some embodiments, a pressure sensor can include a sensor die that includes a substrate and a cavity that is formed in a bottom side of the substrate and that defines an elastic element including a thin diaphragm area and a rigid island. A maximum thickness of the rigid island can be substantially smaller than a thickness of the substrate and can be greater than a thickness of the thin diaphragm area. Side walls of the rigid island can be substantially parallel to one another and can be substantially perpendicular to top and bottom surfaces of the wafer and substantially perpendicular to top and bottom surfaces of the die. The side walls of the at least one rigid island can be formed by wet etching the cavity into the die. The wafer can have an impurity diffused in one or more portions thereof prior to the wet etching such that the one or more portions are doped.