Donald E Herr

US Patent:

20120082840, Apr 5, 2012

Filed:

Dec 12, 2011

Appl. No.:

13/323090

Inventors:

Donald Herr - Lancaster PA, US
Laxmisha M. Sridhar - Monmouth Junction NJ, US
Andrew Slark - Wokingham Berkshire, GB

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

C09J 145/00
C09J 4/00
B05D 3/00
B32B 27/28
B32B 7/12
B32B 37/12
C09J 167/07
C09J 4/06

US Classification:

428221, 525418, 526262, 526261, 525 50, 525282, 524850, 524539, 428521, 4284231, 4284752, 428412, 4284744, 4284735, 428447, 1563317, 156329, 156334, 4273981

Abstract:

The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled without negatively affecting the performance of the adhesive. The thermally reversible composition may also be used as a primer layer. The thermally reversible hot melt adhesive and primer are particularly well suited for end use applications such as packaging, graphic arts, construction, footwear, textiles, general assembly, automotive and consumer goods.

US Patent:

20130233485, Sep 12, 2013

Filed:

Nov 23, 2011

Appl. No.:

13/989087

Inventors:

Donald Herr - Lancaster PA, US
Brian A. Harkins - Dover PA, US

Assignee:

ADHESIVES RESEARCH, INC. - Glen Rock PA

International Classification:

H01L 31/05
H01L 31/0224

US Classification:

1563071, 252500, 428355 EP, 428356, 428355 AK, 428355 AC, 428355 CN, 428355 N, 428355 R, 442 1, 428325, 428328

Abstract:

A reactive pressure sensitive adhesive composition is disclosed. A tape formed using the reactive pressure sensitive adhesive is also disclosed. In its cured state, the pressure sensitive adhesive shows superior mechanical and electrical properties compared to conventional, non-curable charge collection tapes. The tape has a cure profile pre-selected to correspond to that of a photovoltaic cell fabrication process, such that curing can take place during cell fabrication and may occur simultaneously with one or more other curing steps employed in cell fabrication.

US Patent:

20140011904, Jan 9, 2014

Filed:

Sep 14, 2012

Appl. No.:

13/618203

Inventors:

Donald E. Herr - Lancaster PA, US
Shengqian Kong - Hillsborough NJ, US
Sharon Chaplinsky - Ringoes NJ, US
Allison Yue Xiao - Belle Mead NJ, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

C09J 147/00

US Classification:

522 64

Abstract:

A radiation curable temporary laminating adhesive composition for use in temperature applications at 150 C. or greater, and typically at 200 C. or greater, comprises (A) a hydrogenated polybutadiene diacrylate; (B) a radical photoinitiator; and (C) a diluent.

US Patent:

20140158296, Jun 12, 2014

Filed:

Dec 11, 2013

Appl. No.:

14/102566

Inventors:

- Glen Rock PA, US
Donald HERR - Lancaster PA, US

Assignee:

Adhesives Research, Inc. - Glen Rock PA

International Classification:

C09J 167/00
C09J 7/02

US Classification:

1563071, 522111, 522 31

Abstract:

An actinic radiation activated, thermally curable solid film adhesive is disclosed that includes a film forming polymeric binder, a cationically curable resin, and a cationic photoinitiator. The solid film adhesive is capable of being processed at temperatures up to 120 C. prior to exposure to actinic radiation without curing, has a latency period at room temperature following activation of the initiator, and is curable at temperatures above 50 C. following activation of the initiator.