James J. Cordingley - Littleton MA Donald V. Smart - Boston MA Michael Plotkin - Newton MA William Lauer - Westford MA
Assignee:
General Scanning, Inc. - Wilmington MA
International Classification:
H01S 310
US Classification:
372106, 372 26, 372 27, 372107
Abstract:
A laser polarization control apparatus includes a polarization modifying device and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam. An analyzer tool receives the laser beam modified by the polarization modification device and measures the modification of the polarization of the laser beam by the polarization modification device. A plurality of inputs are applied to the polarization modifying device to control modification of the polarization of the laser beam, and the laser beam modified by the polarization modification device is analyzed using the analyzer tool in order to measure modification of the polarization of the laser beam by the polarization modification device.
William Lauer - Westford MA 01886 Pierre Trepagnier - Medford MA 02155 Donald Victor Smart - Boston MA 02110 James Cordingley - Littleton MA 01460 Michael Plotkin - Newton MA 02165
International Classification:
B23K 2600
US Classification:
21912169, 21912168
Abstract:
The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate. The laser output is directed at the target structure on the substrate at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate, in order to vaporize the target structure.
William Lauer - Westford MA, US Pierre Trepagnier - Medford MA, US Donald Victor Smart - Boston MA, US James Cordingley - Littleton MA, US Michael Plotkin - Newton MA, US
Assignee:
General Scanning, Inc. - Billerica MA
International Classification:
B23K026/00
US Classification:
21912169, 21912168
Abstract:
The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate. The laser output is directed at the target structure on the substrate at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate, in order to vaporize the target structure.
James J. Cordingley - Littleton MA, US Donald V. Smart - Boston MA, US Michael Plotkin - Newton MA, US Joohan Lee - Andover MA, US William Lauer - Westford MA, US Jonathan S. Ehrmann - Sudbury MA, US
A laser polarization control apparatus includes a polarization modifying device, such as a liquid crystal variable retarder, and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller, which is connected to the polarization modifying device, adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. For example, the polarization of the laser beam may be rotated to correspond with the alignment of a link in a semiconductor device to be cut by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam. An analyzer tool receives the laser beam modified by the polarization modification device and measures the modification of the polarization of the laser beam by the polarization modification device.
Methods And Systems For Precisely Relatively Positioning A Waist Of A Pulsed Laser Beam And Method And System For Controlling Energy Delivered To A Target Structure
James J. Cordingley - Littleton MA, US Joseph J. Griffiths - Winthrop MA, US Donald V. Smart - Boston MA, US
Assignee:
GSI Lumonics Corporation - Billerica MA
International Classification:
G01B 11/26
US Classification:
356401, 356121, 21912178
Abstract:
A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
Methods And Systems For Processing A Device, Methods And Systems For Modeling Same And The Device
James J. Cordingley - Littleton MA, US Roger D. Dowd - Natick MA, US Jonathan S. Ehrmann - Sudbury MA, US Joseph J. Griffiths - Winthrop MA, US Joohan Lee - Andover MA, US Donald V. Smart - Boston MA, US Donald J. Svetkoff - Ann Arbor MI, US
A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
Methods And Systems For Thermal-Based Laser Processing A Multi-Material Device
James J. Cordingley - Littleton MA, US Jonathan S. Ehrmann - Sudbury MA, US David M. Filgas - Newbury Park CA, US Shepard D. Johnson - Andover MA, US Joohan Lee - Andover MA, US Donald V. Smart - Boston MA, US Donald J. Svetkoff - Ann Arbor MI, US
Assignee:
GSI Lumonics Corporation - Billerica MA
International Classification:
B41J 2/435 B23K 26/00
US Classification:
347224, 21912168
Abstract:
A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
Methods And Systems For Thermal-Based Laser Processing A Multi-Material Device
James J. Cordingley - Littleton MA, US Jonathan S. Ehrmann - Sudbury MA, US Joseph J. Griffiths - Winthrop MA, US Shepard D. Johnson - Andover MA, US Joohan Lee - Andover MA, US Donald V. Smart - Boston MA, US Donald J. Svetkoff - Ann Arbor MI, US
Assignee:
GSI Group Corporation - Billerica MA
International Classification:
B41J 2/435 B23K 26/00
US Classification:
347224, 2191216
Abstract:
A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.