Douglas K Grove

US Patent:

60656646, May 23, 2000

Filed:

Aug 10, 1998

Appl. No.:

9/131528

Inventors:

Scott D. Garner - Lititz PA
Douglas W. Grove - Mount Joy PA

Assignee:

Thermal Corp. - Georgetown DE

International Classification:

B21D 3904
B21D 3908
B21D 5302
B23K 3102
B23P 1102

US Classification:

228126

Abstract:

The disclosure is for a method of installing a heat pipe within another structure. A completely processed heat pipe is coated with solder and inserted into a cylindrical hole within the structure with sliding clearance. The casing of the heat pipe is then expanded into tight contact with the surrounding hole by heating the heat pipe and expanding the heat pipe casing with the heat pipe's own internal vapor pressure. The application of heat also simultaneously melts the solder to bond the heat pipe into the hole.