Douglas K Young

US Patent:

6352623, Mar 5, 2002

Filed:

Dec 17, 1999

Appl. No.:

09/466014

Inventors:

Konstantin Volodarsky - San Francisco CA
Boguslaw A. Nagorski - San Jose CA
Rimma Volodarsky - San Francisco CA
Douglas W. Young - Sunnyvale CA
Cyprian Uzoh - Milpitas CA
Homayoun Talieh - San Jose CA

Assignee:

Nutool, Inc. - Milpitas CA

International Classification:

C25B 900

US Classification:

2042751, 204267, 118500

Abstract:

The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

US Patent:

6359264, Mar 19, 2002

Filed:

Mar 11, 1998

Appl. No.:

09/041471

Inventors:

Charles Schaper - Union City CA
Douglas W. Young - Sunnyvale CA
Hooman Bolandi - Santa Clara CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H05B 368

US Classification:

2194441, 118724

Abstract:

A thermal cycling module for thermally processing a substrate has a thermally-conductive support structure with a planar first side and a second side with a plurality of recesses. A heater is disposed on the first side of the support structure and a fluid distributor positioned beneath the second side of the support structure to direct a coolant onto the support structure to decrease the temperature of the substrate. The fluid distributor may have a plurality of rotatable arms and a plurality of nozzles attached to each arm.

US Patent:

6478936, Nov 12, 2002

Filed:

May 11, 2000

Appl. No.:

09/568584

Inventors:

Rimma Volodarsky - San Francisco CA
Konstantin Volodarsky - San Francisco CA
Cyprian Uzoh - Milpitas CA
Homayoun Talieh - San Jose CA
Douglas W. Young - Sunnyvale CA

Assignee:

NuTool Inc. - Milpitas CA

International Classification:

C25B 1103

US Classification:

2042861, 2042881, 2042883, 204280, 2042751, 204232, 20429701, 20429706, 204199, 204212, 204213

Abstract:

A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.

US Patent:

6773576, Aug 10, 2004

Filed:

Sep 20, 2002

Appl. No.:

10/251377

Inventors:

Rimma Volodarsky - San Francisco CA
Konstantin Volodarsky - San Francisco CA
Cyprian Uzoh - Milpitas CA
Homayoun Talieh - San Jose CA
Douglas W. Young - Sunnyvale CA

Assignee:

NuTool, Inc. - Milpitas CA

International Classification:

C25F 302

US Classification:

205670, 205640, 205653, 205668, 205672

Abstract:

A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.

US Patent:

6884334, Apr 26, 2005

Filed:

Dec 28, 2001

Appl. No.:

10/041058

Inventors:

Konstantin Volodarsky - San Francisco CA, US
Boguslaw A. Nigorski - San Jose CA, US
Rimma Volodarsky - San Francisco CA, US
Douglas W. Young - Sunnyvale CA, US
Cyprian Uzoh - Milpitas CA, US
Homayoun Talieh - San Jose CA, US

Assignee:

ASM NuTool, Inc. - Fremont CA

International Classification:

C25D005/00

US Classification:

205 87, 205220, 205117, 427331, 427346, 4273722, 118500, 118730, 118409, 134 32, 134153, 134143

Abstract:

The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

US Patent:

6969456, Nov 29, 2005

Filed:

Dec 28, 2001

Appl. No.:

10/041029

Inventors:

Konstantin Volodarsky - San Francisco CA, US
Boguslaw A. Nagorski - San Jose CA, US
Rimma Volodarsky - San Francisco CA, US
Douglas W. Young - Sunnyvale CA, US
Cyprian Uzoh - Milpitas CA, US
Homayoun Talieh - San Jose CA, US

Assignee:

ASM Nutool, Inc. - Fremont CA

International Classification:

C25F003/00
B08B003/04

US Classification:

205640, 134 32, 134 85, 134902

Abstract:

The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

US Patent:

20050040049, Feb 24, 2005

Filed:

Aug 10, 2004

Appl. No.:

10/914490

Inventors:

Rimma Volodarsky - San Francisco CA, US
Konstantin Volodarsky - San Francisco CA, US
Cyprian Uzoh - Milpitas CA, US
Homayoun Talieh - San Jose CA, US
Douglas Young - Sunnyvale CA, US

International Classification:

B23H007/00

US Classification:

205652000

Abstract:

A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.

US Patent:

20050198593, Sep 8, 2005

Filed:

May 5, 2005

Appl. No.:

11/121957

Inventors:

Leroy Keely - Portola Valley CA, US
Douglas Young - Mountain View CA, US
Andrew Palay - Mountain View CA, US

Assignee:

Microsoft Corporation - Redmond WA

International Classification:

G06F003/00

US Classification:

715863000, 715834000, 715776000, 715839000, 715780000

Abstract:

A notepad computer with a page display region displaying a page of a document on which a user can write using a pen or stylus type writing tool is provided. Associated with the page is an interface that can be used with the pen. The interface includes a core task tool region adjacent to the page where tool icons are partially visible until the pen is brought near one of the icons. The tool icon becomes fully visible when the pen is within the region of the icon. The tool when activated can pop-up a radial pop-up menu located at an edge of the document where all the menu choices are located in a semi-circle away from the edge so that the users hand while holding the pen and making a selection does not block the choices. A page flipping tool is located in a corner of the page and is an explicit two-stroke menu allowing selection of a next or previous page. A page scrolling tool is located along an edge of the page, the scrolling tool when activated is an implicit button allowing scrolling in one implied direction. The interface also includes a stack region adjacent to said page display region having one or more stack icons each representing a stack of documents. The icon is also an explicit two-stroke radial pop-up menu having forward and backward choices for selecting documents in the stack and a stack document list display displaying a list of documents in the stack when the stack icon is touched by an input pen. The interface also includes a typing tool overlaying a portion of the page and including a writing zone where a user handwrites strokes and, a page zone comprising part of the page where typed text corresponding to the handwritten strokes is displayed as the handwriting occurs.