Edward J Barrett

US Patent:

20040047765, Mar 11, 2004

Filed:

Nov 27, 2002

Appl. No.:

10/306787

Inventors:

Steven Gordon - Weston MA, US
A. Boccuti - Arlington MA, US
David Brancazio - Cambridge MA, US
Steven Grenier - Arlington MA, US
Kenneth Hathaway - Attleborough MA, US
Edward Barrett - South Weymouth MA, US

International Classification:

B01L003/02

US Classification:

422/063000, 422/100000, 422/104000

Abstract:

The invention provides an automated workstation capable of continuous, non-stop processing of specimens. The workstation includes a storage area that holds multiple cassettes containing specimens compounds or other materials to be analyzed or used in conjunction therewith (collectively, “specimens”) which, preferably, are maintained on slides, microliter plates, or the like (collectively, “plates”). The workstation also includes a robotic arm for processing the specimens, e.g., by grasping the plates, moving them from the cassettes to other apparatus contained within the workstation, and placing the plates back in the cassettes. The invention also provides methods and apparatus for acquiring and processing samples in narrow, thin-walled pipettes without transferring them to wells, vials, or other reaction vessels.

US Patent:

61292605, Oct 10, 2000

Filed:

Aug 19, 1998

Appl. No.:

9/136846

Inventors:

Lance Andrus - Southboro MA
James Fraivillig - Austin TX
Edward Barrett - Revere MA
Brian High - Londonderry NH

Assignee:

Fravillig Technologies Company - Boston MA

International Classification:

B23K 3102
H05K 338

US Classification:

228120

Abstract:

Solderable structures, and related methods for making them, can provide thermal conductivity and/or electrical isolation for electronic devices soldered to the structures. Each of the structures includes a solderable material bonded to a heat sink by a thermally-activated bonding material which provides thermal conductivity between the solderable material and the heat sink and which can be configured as a three-layer bonding film to also provide electrical isolation. The structures can be produced in a highly-automated, rapid way without the need for standard mounting hardware and mechanical preparation of the heat sinks.