Edward J Conlon

US Patent:

20010001406, May 24, 2001

Filed:

Oct 30, 1998

Appl. No.:

09/183479

Inventors:

MICHAEL JAMES LIBERATORE - LAWRENCEVILLE NJ, US
BARRY JAY THALER - LAWRENCEVILLE NJ, US
PAUL F. PELKA - STANHOPE NJ, US
EDWARD J. CONLON - PRINCETON NJ, US
JON SHELDON PROKOP - DALLAS TX, US

International Classification:

C03B029/00
C04B033/34
C04B037/00
B05D005/12

US Classification:

156/089120, 156/089210, 427/096000

Abstract:

A method of making transmission lines and buried passive components in a green tape comprising embossing a channel or opening into the green tape of the desired size under heat and pressure, screen printing an ink of a conductive material or a passive component material to fill said embossed channel or opening; and firing said green tape. The embossing tool forms channels and openings having improved dimensional control over that obtained using screen printing. Further, embossing provides improved thickness control of lines and passive components as well.

US Patent:

50359398, Jul 30, 1991

Filed:

Feb 9, 1990

Appl. No.:

7/477393

Inventors:

Edward J. Conlon - Princeton NJ
Ashok N. Prabhu - East Windsor NJ
Simon M. Boardman - Holland PA
Valerie A. Pendrick - Lambertville NJ

Assignee:

David Sarnoff Research Center, Inc. - Princeton NJ

International Classification:

B32B 300

US Classification:

428137

Abstract:

In the manufacture of printed circuit boards, a first photoresist post is patterned on the substrate where via holes are to be made. A dielectric layer is put down, a second photoresist layer patterned so as to have openings over and in alignment with the photoresist posts, and the dielectric removed from the via holes. Barrier layers to reduce interaction between layers of copper, dielectric and photoresist during filling of the via holes with a conductor via fill ink are also described.

US Patent:

55652620, Oct 15, 1996

Filed:

Jan 27, 1995

Appl. No.:

8/379264

Inventors:

Thomas P. Azzaro - Burlington NJ
Barry J. Thaler - Lawrenceville NJ
Edward J. Conlon - Princeton NJ
Ananda H. Kumar - Plainsboro NJ

Assignee:

David Sarnoff Research Center, Inc. - Princeton NJ

International Classification:

B32B 900

US Classification:

428210

Abstract:

Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass, and then filling the remainder of the feedthroughs with a conductive metal via fill ink. After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate.

US Patent:

48745502, Oct 17, 1989

Filed:

Dec 2, 1988

Appl. No.:

7/278987

Inventors:

Ashok N. Prabhu - East Windsor NJ
Kenneth W. Hang - Princeton NJ
Edward J. Conlon - Princeton NJ

Assignee:

General Electric Company - Schenectady NY

International Classification:

H01B 106

US Classification:

252512

Abstract:

Improved copper conductor inks useful in fabricating multilevel circuits are provided. The inks comprise copper powder, a devitrifying glass frit which does not begin to flow until the furnace temperature is above about 700. degree. C. , and a suitable organic vehicle. Devitrifying glass frits with these properties include a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass frit and mixtures thereof. The inks are advantageous in that they form copper conductor layers having excellent properties without the inclusion of traditional flux materials such as bismuth oxide.

US Patent:

52162079, Jun 1, 1993

Filed:

Feb 27, 1991

Appl. No.:

7/661264

Inventors:

Ashok N. Prabhu - East Windsor NJ
Edward J. Conlon - Princeton NJ
Barry J. Thaler - Lawrenceville NJ

Assignee:

David Sarnoff Research Center, Inc. - Princeton NJ

International Classification:

H05K 100

US Classification:

174256

Abstract:

A novel ceramic green tape composition useful in the manufacture of silver conductor based, low temperature, co-fired multilayer circuit boards comprises from about 8-35% by weight of a calcium-zinc-aluminum-borosilicate devitrifying glass; from about 10-35% by weight of a low alkali borosilicate glass; from about 10-35% by weight of a lead-zinc-aluminosilicate glass; from about 10-35% by weight of a ceramic filler; up to 0. 5% by weight of a coloring agent and from about 20-45% by weight of an organic binder. The co-fired multilayer circuit boards made from these green tape compositions have excellent mechanical and electrical properties and have thermal expansion characteristics matching that of silicon. The devitrifying glass comprises from about 10-30% by weight of zinc oxide; from about 10-20% by weight of calcium oxide; up to about 15% by weight of boron oxide; from about 15-20% by weight of aluminum oxide and about 25-55% by weight of silicon oxide. The lead-zinc-aluminosilicate vitreous glass comprises from about 30-40% by weight of lead oxide, from about 6-12% by weight of zinc oxide, from about 6-10% by weight of aluminum oxide and from about 40-55% by weight of silicon oxide.

US Patent:

56814445, Oct 28, 1997

Filed:

Jul 3, 1996

Appl. No.:

8/670203

Inventors:

Thomas Peter Azzaro - Burlington NJ
Barry Jay Thaler - Lawrenceville NJ
Edward James Conlon - Princeton NJ
Ananda Hosakere Kumar - Plainsboro NJ

Assignee:

David Sarnoff Research Center, Inc. - Princeton NJ

International Classification:

C25D 502
C25D 556
C25D 550
C25D 512

US Classification:

205125

Abstract:

Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass, and then filling the remainder of the feedthroughs with a conductive metal via fill ink. After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate.

US Patent:

39724638, Aug 3, 1976

Filed:

Feb 7, 1975

Appl. No.:

5/548009

Inventors:

Edward James Conlon - Trenton NJ
Ralph DeStephanis - Middlesex NJ
Thomas Tipton Hitch - Trenton NJ

Assignee:

RCA Corporation - New York NY

International Classification:

B23K 1900

US Classification:

228 441A

Abstract:

A microcircuit adhesion testing method and fixture for uniform placement and soldering of a preselected length of wire above a film pad on a microcircuit substrate with consistent substrate-to-wire spacing, comprising a holder for the substrate, finger spacers attached to the holder, and a member for pressing the wire against the spacers. The spacers are made of a material which is not wettable with solder of the type used to attach the wire to the film.