Clinton B. Carlisle - Palo Alto CA, US Jahja I. Trisnadi - Cupertino CA, US Edward D. Huber - Portola Valley CA, US
Assignee:
Silicon Light Machines Corporation - Sunnyvale CA
International Classification:
G02B 26/00 H04J 14/06
US Classification:
3593371, 359494, 35933721, 398 65, 398 87
Abstract:
In one embodiment, an optical device includes a polarization diversity module configured to receive an optical input signal and output a first optical output signal and a second optical output signal having the same polarization state. This helps ensure light beams propagating in the optical device have the same polarization state, thereby mitigating the effects of polarization-dependent loss in the optical device. In one embodiment, the optical device comprises an optical dynamic gain equalizer with a light modulator.
Multi-Site Optical Power Calibration System And Method
Steven Cummins - Santa Clara CA, US Edward Huber - Portola Valley CA, US Vincent Uy - Fremont CA, US Steven Sanders - Belomont CA, US Patrick Zicolello - Santa Clara CA, US Brett A. Spurlock - Los Altos CA, US
Assignee:
Cypress Semiconductor Corporation - San Jose CA
International Classification:
G01J 1/10 G01J 1/12
US Classification:
356229, 356230
Abstract:
A test system and method are provided for testing in parallel radiant output of multiple light emitting devices. Generally, the method involves: (i) providing a system having a master, calibrated power meter (CPM), a source transfer standard (STS), and multiple secondary, test site power meters (TSPMs); (ii) determining a relationship between electrical power supplied to the STS and a radiant output therefrom as measured by the CPM; (iii) calibrating the TSPMs using the STS and the relationship between the power supplied to the STS and the radiant output therefrom as determined by the CPM; and (iv) positioning the devices undergoing test on a fixture of the test system and positioning the fixture relative to the TSPMs to test radiant outputs of the devices. Preferably, the TSPMs are calibrated by exposing each to the STS at a known power, determining a difference between the radiant output measured by the CPM and TSPM, using this difference as an offset that is added to the a signal from the TSPM to provide a corrected radiant output for the device under test. Other embodiments are also disclosed.
System And Method For Illuminating And Imaging A Surface For An Optical Navigation System
Edward D. Huber - Portola Valley CA, US Brett A. Spurlock - Los Altos CA, US Jahja I. Trisnadi - Cupertino CA, US
Assignee:
Cypress Semiconductor Corporation - San Jose CA
International Classification:
G01B 9/02
US Classification:
356498, 345166
Abstract:
The present invention discloses an optic system for providing illumination and imaging functions in an optical navigation system. Generally, the optic system includes a unitary optic component having an illumination lens and at least one prism to project a collimated beam of light from a light source in the optical navigation system onto a surface, and an imaging lens to image at least a portion of the illuminated surface to an array of photosensitive elements. In one embodiment, optic system further includes an aperture component having a precision aperture, the aperture component configured to locate the precision aperture between the imaging lens of the unitary optic component and the array of photosensitive elements in a path of light reflected from the portion of the illuminated surface to the array of photosensitive elements. Other embodiments are also described.
System And Method For Mounting An Optical Component To An Integrated Circuit Package
A packaging structure and method are provided for packaging an optoelectronic device. Generally, the packaging structure includes: (i) an integrated circuit (IC) package to which the optoelectronic device is affixed; (ii) an optical plug mounted to the IC package, the optical plug positioned relative to the optoelectronic device to direct light to or from the optoelectronic device, the optical plug having an interior optical surface closest to the optoelectronic device that does not make physical contact with either the optoelectronic device or the IC package. Preferably, the packaging structure can further include air or an index matching fluid in a gap between the interior optical surface and the optoelectronic device or IC package. More preferably, both the IC package and the optical plug include features to facilitate alignment and mounting of the optical plug to the IC package during assembly. Other embodiments are also disclosed.
Edward D. Huber - Sunnyvale CA Rick A. Williams - Orinda CA
Assignee:
Lockheed Missiles & Space Company, Inc. - Sunnyvale CA
International Classification:
G01B 1130
US Classification:
356371
Abstract:
An optical vision inspection system (4) and method for multiplexed illuminating, viewing, analyzing and recording a range of characteristically different kinds of defects, depressions, and ridges in a selected material surface (7) with first and second alternating optical subsystems (20, 21) illuminating and sensing successive frames of the same material surface patch. To detect the different kinds of surface features including abrupt as well as gradual surface variations, correspondingly different kinds of lighting are applied in time-multiplexed fashion to the common surface area patches under observation.
Edward D. Huber - Sunnyvale CA Rick A. Williams - Orinda CA Scott E. Reinhart - Hayward CA
Assignee:
Lockheed Missiles & Space Co., Inc. - Sunnyvale CA
International Classification:
G01B 1102
US Classification:
356375
Abstract:
A laser inspection tool system (100) includes a hand-held remote tool head (108) that provides an image of a target object (116) and a measurement surface (118). The remote tool head (108) includes light sources (208) and mirrors (210) that in conjunction generate two perpendicular lines of light that impinge the target object (116) and the measurement surface (118) and reflect to a form an image in a camera (218) in the remote tool head (108). The remote tool head (108) may be oriented at any angle relative to the measurement surface (118). A processor (102) remotely coupled to the remote tool head (108) captures the image and determines the offset between the light reflected by the target object (116) and the light reflected by the measurement surface (118), and the angle between the reflected lines of light. Using the offset and the angle, the processor (102) determines the height of the top of the target object (116) above the measurement surface (118) and the angle of the remote tool head (108) relative to the measurement surface (118).
A Bright Field Illumination system for inspecting a range of characteristically different kinds of defects, depressions, and ridges in a selected material surface. The system has an illumination source placed near a first focus of an elliptical reflector. In addition, a camera facing the inspected area is placed near the illumination source and the first focus. The second focus of the elliptical reflector is located at a distance approximately twice the elliptical reflector's distance above the inspected surface. The elliptical reflector directs the light from the source onto the inspected surface. Due to the shape of the elliptical reflector, light that is specularly reflected from the inspected surface is directed into the camera is which located at the position of the reflected second focus of the ellipse. This system creates a brightly lighted background field against which damage sites appear as high contrast dark objects which can be easily detected by a person or an automated inspection system. In addition, the Bright Field Illumination system and method can be used in combination with a vision inspection system providing for multiplexed illumination and data handling of multiple kinds of surface characteristics including abrupt and gradual surface variations and differences between measured characteristics of different kinds and prior instruments.
Edward D. Huber - Sunnyvale CA Rick A. Williams - Orinda CA
Assignee:
Lockheed Missiles & Space Company, Inc. - Sunnyvale CA
International Classification:
G01B 1124
US Classification:
356376
Abstract:
A measurement device or system (11) for determining features of a three-dimensional object (20) from two-dimensional images includes a projector (27) for projecting a pattern (73) upon the object (20), at least one imager (17, 19) for obtaining multiple sets of image data of the illuminated object (20) and a processor (47) for obtaining a three-dimensional image (81) of the object (20) from the multiple sets of data.
Name / Title
Company / Classification
Phones & Addresses
Edward Huber Vice-President
THE GLAD PRODUCTS COMPANY Mfg Unsupport Plstc Film Mfg Plstc/Coat Paper Bag Mfg Polish/Sanitation Gd Mfg Minerals-Earth/Treat
1221 Broadway, Oakland, CA 94612 Oakland, CA 94612 124 W Capitol Ave SUITE 1900, Little Rock, AR 72201 The Glad Products Company, Oakland, CA 94623 5102717000
Edward Huber (1950-1954), Martha Bethke (1954-1958), Jean Hosick (1954-1958), Jeannie Miller (1954-1958), carol white (1953-1957), John McEwen (1952-1956)