Edward P Mcleskey

US Patent:

6381837, May 7, 2002

Filed:

Sep 4, 1998

Appl. No.:

09/148061

Inventors:

Jay DeAvis Baker - W. Bloomfield MI
Edward McLeskey - Waterford MI
Delin Li - Canton MI
Cuong Van Pham - Belleville MI
Robert Edward Belke - West Bloomfield MI
Vivek Amir Jairazbhoy - Farmington Hills MI
Thomas B Krautheim - Belleville MI
Mohan R. Paruchuri - Canton MI
Lakhi Nandlal Goenka - Ann Arbor MI
Jun Ming Hu - Canton MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

H05K 334

US Classification:

29840, 29832, 29834, 29831, 29846, 174261

Abstract:

A method for producing an electronic circuit assembly (e. g. , a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.

US Patent:

6475703, Nov 5, 2002

Filed:

Dec 1, 1998

Appl. No.:

09/203148

Inventors:

Delin Li - Canton MI
Achyuta Achari - Canton MI
Alice Dawn Zitzmann - Belleville MI
Brenda Joyce Nation - Troy MI
Edward McLeskey - Waterford MI
Mohan R. Paruchuri - Canton MI
Lakhi Nandlal Goenka - Ann Arbor MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

G03C 556

US Classification:

430313, 430315, 430329, 216 15, 216 16, 216 20, 427404, 427405, 427471, 427532

Abstract:

A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.

US Patent:

6622555, Sep 23, 2003

Filed:

Oct 11, 2001

Appl. No.:

09/975112

Inventors:

Scott Lee Straight - Livonia MI
Eric Christopher Myers - Howell MI
James Driscoll - Sterling Heights MI
Ralph James Ross - Wixom MI
Edward Paul McLeskey - Whitmore Lake MI
Lawrence A. Zurek - Warren MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

G01F 500

US Classification:

732025

Abstract:

A mass fluid flow sensor for determining the amount of fluid inducted into an internal combustion engine, for example, is disclosed. The mass fluid flow sensor includes an external intake fluid temperature element which improves the accuracy of the mass fluid reading. An external cold wire element is further provided which improves response time. The mass fluid flow sensor has an improved aerodynamic design which provides a lower system pressure drop. Moreover, the sensor is smaller and lighter and has fewer parts, thus providing better manufacturability. A molded one-piece isolated jet nozzle having a hot element disposed therein is included in the fluid sampling portion. Consequently, an improved lower internal flow passage pressure drop is achieved. Additionally, an improved signal to noise ratio, as well as a larger dynamic range is an advantageous consequence of the present invention. The present invention further provides improved electromagnetic interference performance.

US Patent:

6752015, Jun 22, 2004

Filed:

Sep 24, 2002

Appl. No.:

10/253190

Inventors:

David J. Thompson - Livonia MI
Edward P. McLeskey - Whitmore Lake MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

G01F 168

US Classification:

7320422

Abstract:

The present invention involves a device for detecting a condition of a flowing fluid within a vehicle having reduced sulfur ingress. The device includes a base plate having a receiving surface and a circumferential edge and a printed circuit board disposed on the receiving surface of the base plate. The device further includes a housing having peripheral side walls attaching to the receiving surface adjacent the circumferential edge to define a peripheral interface enclosing the printed circuit board within the housing. The device further includes an adhesive material disposed at the interface to adhere the housing to the base plate. The adhesive material has a predetermined thermal expansion coefficient and a predetermined elastic modulus to reduce fluid ingress through the interface and to accommodate thermal expansions of the base plate and the housing.

US Patent:

6776036, Aug 17, 2004

Filed:

Jul 3, 2003

Appl. No.:

10/613257

Inventors:

Scott Lee Straight - Livonia MI
Eric Christopher Myers - Howell MI
James Driscoll - Sterling Heights MI
Ralph James Ross - Wixom MI
Edward Paul McLeskey - Whitmore Lake MI
Lawrence A. Zurek - Warren MI

Assignee:

Vistoen Global Technologies, Inc. - Dearborn MI

International Classification:

G01F 500

US Classification:

732025

Abstract:

A mass fluid flow sensor for determining the amount of fluid inducted into an internal combustion engine, for example, is disclosed. The mass fluid flow sensor includes an external intake fluid temperature element which improves the accuracy of the mass fluid reading. An external cold wire element is further provided which improves response time. The mass fluid flow sensor has an improved aerodynamic design which provides a lower system pressure drop. Moreover, the sensor is smaller and lighter and has fewer parts, thus providing better manufacturability. A molded one-piece isolated jet nozzle having a hot element disposed therein is included in the fluid sampling portion. Consequently, an improved lower internal flow passage pressure drop is achieved. Additionally, an improved signal to noise ratio, as well as a larger dynamic range is an advantageous consequence of the present invention. The present invention further provides improved electromagnetic interference performance.

US Patent:

6845661, Jan 25, 2005

Filed:

Oct 11, 2002

Appl. No.:

10/269232

Inventors:

Leon Bogdanov - Troy MI, US
Ralph J. Ross - Wixom MI, US
Richard W. Caron - Canton MI, US
Edward P. McLeskey - Whitmore Lake MI, US
Eric C. Myers - Howell MI, US

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

G01F 168

US Classification:

7320422

Abstract:

A device for detecting a mass of a flowing fluid is disclosed. The device includes a housing having a fluid sampling portion and a circuit cavity portion. The fluid sampling portion is positionable within a fluid carrying duct and includes a flow passage. A nozzle is in fluid communication with the flow passage, wherein the nozzle has a nozzle exit. An electrical element is disposed in the flow passage proximate to the nozzle exit. Further, a circuit module is in communication with the electrical element and disposed in the circuit cavity portion for detecting a change in an electrical property of the electrical element, wherein the detected change in the electrical property is used to determine the mass of the flowing fluid. Finally, a homogenous lead frame having a connector pin portion and an electrical attachment portion for providing an electrical path from the electrical element and circuit module to the connector pin portion is provided.

US Patent:

20020000331, Jan 3, 2002

Filed:

Aug 1, 2001

Appl. No.:

09/920192

Inventors:

Vivek Jairazbhoy - Farmington Hills MI, US
Thomas Krautheim - Belleville MI, US
Mohan Paruchuri - Canton MI, US
Lakhi Goenka - Ann Arbor MI, US
Jun Hu - Canton MI, US
Jay Baker - W. Bloomfield MI, US
Edward McLeskey - Waterford MI, US
Delin Li - Canton MI, US
Cuong Pham - Belleville MI, US
Robert Belke - West Bloomfield MI, US

International Classification:

H05K001/11
H01R012/04
H05K001/16
H05K003/36
H05K003/34

US Classification:

174/263000, 174/260000, 029/830000, 029/832000, 029/847000, 029/840000, 029/843000

Abstract:

A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.

US Patent:

59763914, Nov 2, 1999

Filed:

Jan 13, 1998

Appl. No.:

9/006213

Inventors:

Robert Edward Belke - W. Bloomfield MI
Edward P. McLeskey - Waterford MI
John Trublowski - Troy MI
Alice Dawn Zitzmann - Belleville MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

B44C 122

US Classification:

216 13

Abstract:

A method of manufacturing an improved multi-layer printed circuit assembly having at least two conductor patterns. The method includes providing a first layer having a first metal surface a second layer having a second metal surface. A thin flexible carrier is placed between the first and second layers. The first and second layers are attached to opposite surfaces of the carrier. The first and second metal surfaces are etched to form first and second conductor patterns. The conductor patterns form the electrical traces interconnecting components on an electronic circuit assembly. The first and second conductor patterns are electrically connected to form an electronic circuit assembly that includes electronic traces on both sides of the circuit board.