Edward J Pena

US Patent:

45836760, Apr 22, 1986

Filed:

May 3, 1982

Appl. No.:

6/374449

Inventors:

Edward Pena - Austin TX
S. L. Cheong - Kuala Lumpur, MY

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B23K 3102
H05K 334

US Classification:

228179

Abstract:

A semiconductor die surface heater and a method of using the die surface heater as a wire bonding assembly are provided. In the preferred form, the semiconductor die surface heater comprises two heaters. A preheater heats the surface of a semiconductor die which is attached to a lead frame via radiant energy. A clamp which positions both the semiconductor die and lead frame during the wire bonding has a window portion with a surface clamp heater for heating at least the portion of the clamp around the window.