Edward J Rich

US Patent:

62784005, Aug 21, 2001

Filed:

Nov 29, 1999

Appl. No.:

9/450905

Inventors:

John W. Cassen - Sykesville MD
Edward L. Rich - Arnold MD
Gary N. Bonadies - Laurel MD
John S. Fisher - Ellicott City MD
John W. Gipprich - Millersville MD
John D. Gornto - Columbia MD
Daniel J. Heffernan - Pasadena MD
David A. Herlihy - Ellicott City MD
Scott C. Tolle - Baltimore MD
Patrick K. Richard - Baltimore MD
David W. Strack - Baltimore MD
Scott K. Suko - Elkridge MD
Timothy L. Eder - Glen Burnie MD
Chad E. Wilson - Redmond WA
Gary L. Ferrell - Pasadena MD
Stephanie A. Parks - Virginia Beach VA

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

G01S 728

US Classification:

342175

Abstract:

Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high or low temperature cofired ceramic layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. An RF connector assembly for coupling transmit and receive signals to and from the module is located at the front of the package.

US Patent:

60055316, Dec 21, 1999

Filed:

Sep 23, 1998

Appl. No.:

9/158827

Inventors:

John W. Cassen - Sykesville MD
Gary N. Bonadies - Laurel MD
Patrick K. Richard - Baltimore MD
David A. Herlihy - Ellicott City MD
Ayn U. Fuller - Greenbelt MD
Daniel H. Wenzlick - Linthicum MD
Richard C. Kapraun - Baltimore MD
Mark R. Schrote - Ellicott City MD
Kerry M. Yon - Beltsville MD
H. Halley Lisle - Monrovia MD
Toby Hess - Olney MD
Edward L. Rich - Arnold MD
George T. Hall - Catonsville MD
Brian T. Drude - Arbutus MD

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H01Q 2100

US Classification:

343853

Abstract:

An antenna assembly for an active electronically scanned array includes, among other things: an array of antenna elements; an RF signal feed and circulator assembly coupled to said antenna elements and forming thereby an array of radiating structures; a generally planar RF manifold assembly having regularly spaced openings therein located behind and normal to the radiating structures; an array of T/R modules connected to the array of radiating structures and having respective RF connector assemblies forming a portion of an RF interface at one end portion of each of the modules which project upwardly through said spaced openings in the RF manifold and wherein the respective connector assemblies thereof connect to at least one immediately adjacent circulator as well as to transmit and receive manifold portions of the RF manifold; each of the T/R modules further have a heat sink plate on the back side thereof which is positioned against one of a number of elongated liquid coolant circulating coldplates connected to a coolant distribution manifold encircling the array; a DC power and logic signal distribution manifold; and, a plurality of elongated DC/logic circuit board members connected to the DC power and logic signal distribution manifold and being respectively located adjacent and coextensive with a respective coldplate for supplying DC power and logic control signals to a DC/logic interface located at the other end portion of the respective modules.

US Patent:

60551623, Apr 25, 2000

Filed:

Mar 12, 1998

Appl. No.:

9/041213

Inventors:

Albert G. Tarrillo - Silver Spring MD
Dennis Schaefer - Middletown OH
Scott K. Suko - Elkridge MD
Edward L. Rich - Arnold MD
Keith L. Rowe - Cincinnati OH

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H02M 3335
H02M 7538

US Classification:

363 25

Abstract:

A DC-DC voltage converter 40, which is adaptable to VHF operation, has a power oscillator 52 to which a filtered input DC voltage 50 is applied for conversion to an output DC voltage. The power oscillator includes a push-pull amplifier 58, 60 and an impedance transformation circuit 62 to which the amplifier is connected. The power oscillator also includes a rectifier circuit 64 which is connected to the impedance transformation circuit. A feedback circuit 68 controls the frequency of the oscillator to regulate the output DC voltage. The oscillator frequency depends on the impedance values of oscillator circuit components and the values of a plurality of oscillator component intrinsic parameters.

US Patent:

60941618, Jul 25, 2000

Filed:

Dec 8, 1999

Appl. No.:

9/456407

Inventors:

John W. Cassen - Sykesville MD
Stephanie A. Parks - Helston, GB
Edward L. Rich - Arnold MD
Gary N. Bonadies - Laurel MD
Gary L. Ferrell - Pasadena MD
John S. Fisher - Ellicott City MD
John W. Gipprich - Millersville MD
John D. Gornto - Columbia MD
Daniel J. Heffernan - Severna Park MD
David A. Herlihy - Ellicott City MD
Andrew J. Piloto - San Diego CA
Patrick K. Richard - Baltimore MD
David W. Strack - Baltimore MD
Scott K. Suko - Elkridge MD

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

G01S 728

US Classification:

342175

Abstract:

Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. The MMICs which generate substantially all of the heat are located in multi-level cavities formed in the substrate and are bonded directly to a generally flat a heat sink plate which is secured to the bottom of the substrate and acts as a thermal interface to an external heat exchanger such as a cold plate.

US Patent:

60346337, Mar 7, 2000

Filed:

Sep 23, 1998

Appl. No.:

9/158832

Inventors:

John W. Cassen - Sykesville MD
Stephanie A. Parks - Helston, GB
Edward L. Rich - Arnold MD
Gary N. Bonadies - Laurel MD
Gary L. Ferrell - Pasadena MD
John S. Fisher - Ellicott City MD
John W. Gipprich - Millersville MD
John D. Gornto - Columbia MD
Daniel J. Heffernan - Severna Park MD
David A. Herlihy - Ellicott City MD
Patrick K. Richard - Baltimore MD
David W. Strack - Baltimore MD
Scott K. Suko - Elkridge MD

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

G01S 728

US Classification:

342175

Abstract:

A transmit/receive (T/R) module adapted for use in a radar system. The module has a unified structure including a layered substrate on and in which two T/R channel circuits are integrated. The channel circuits make use of power distribution, channel controller, and RF signal routing circuitry, partly on a channel shared basis. In the RF routing circuitry, respective coupler elements are employed to combine RF receive signals for output to an RF receive manifold and to split an RF transmit signal from a transmit manifold into separate RF transmit signals for input to the T/R channel circuits.

US Patent:

60973358, Aug 1, 2000

Filed:

Dec 8, 1999

Appl. No.:

9/456330

Inventors:

John W. Cassen - Sykesville MD
Stephanie A. Parks - Helston, GB
Edward L. Rich - Arnold MD
Gary N. Bonadies - Laurel MD
Gary L. Ferrell - Pasadena MD
John S. Fisher - Ellicott City MD
John W. Gipprich - Millersville MD
John D. Gornto - Columbia MD
Daniel J. Heffernan - Pasadena MD
David A. Herlihy - Ellicott City MD
Patrick K. Richard - Baltimore MD
David W. Strack - Baltimore MD
Scott K. Suko - Elkridge MD

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

G01S 728

US Classification:

342175

Abstract:

A transmit/receive (T/R) module adapted for use in a radar system. The module has a unified structure including a layered substrate on and in which two T/R channel circuits are integrated. The channel circuits make use of power distribution, channel controller, and RF signal routing circuitry, partly on a channel shared basis. In the RF routing circuitry, respective coupler elements are employed to combine RF receive signals for output to an RF receive manifold and to split an RF transmit signal from a transmit manifold into separate RF transmit signals for input to the T/R channel circuits.

US Patent:

61149861, Sep 5, 2000

Filed:

Sep 23, 1998

Appl. No.:

9/158829

Inventors:

John W. Cassen - Sykesville MD
Stephanie A. Parks - Cornwall, GB
Edward L. Rich - Arnold MD
Gary N. Bonadies - Laurel MD
Gary L. Ferrell - Pasadena MD
John S. Fisher - Ellicott City MD
John W. Gipprich - Millersville MD
John D. Gornto - Columbia MD
Daniel J. Heffernan - Severna Park MD
David A. Herlihy - Ellicott City MD
Andrew J. Piloto - San Diego CA
Patrick K. Richard - Baltimore MD
David W. Strack - Baltimore MD
Scott K. Suko - Elkridge MD

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

G01S 728

US Classification:

342175

Abstract:

Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. The T/R module is one module of an array of like T/R modules coupled to an active aperture of a radar system.