Edward R Rich

US Patent:

62784005, Aug 21, 2001

Filed:

Nov 29, 1999

Appl. No.:

9/450905

Inventors:

John W. Cassen - Sykesville MD
Edward L. Rich - Arnold MD
Gary N. Bonadies - Laurel MD
John S. Fisher - Ellicott City MD
John W. Gipprich - Millersville MD
John D. Gornto - Columbia MD
Daniel J. Heffernan - Pasadena MD
David A. Herlihy - Ellicott City MD
Scott C. Tolle - Baltimore MD
Patrick K. Richard - Baltimore MD
David W. Strack - Baltimore MD
Scott K. Suko - Elkridge MD
Timothy L. Eder - Glen Burnie MD
Chad E. Wilson - Redmond WA
Gary L. Ferrell - Pasadena MD
Stephanie A. Parks - Virginia Beach VA

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

G01S 728

US Classification:

342175

Abstract:

Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high or low temperature cofired ceramic layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. An RF connector assembly for coupling transmit and receive signals to and from the module is located at the front of the package.

US Patent:

59459417, Aug 31, 1999

Filed:

Mar 12, 1998

Appl. No.:

9/041214

Inventors:

Edward L. Rich - Arnold MD
Albert G. Tarrillo - Silver Spring MD

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

G01S 7282

US Classification:

342157

Abstract:

A power distribution system (12) is provided in radar apparatus to distribute power from a 270 VDC source (60) through an intermediate power converter (70) and very high frequency (VHF) regulator/modulator units (80). Bus conductors (71,74) interconnect the source, the intermediate power converter, and the VHF units. Capacitors (71, 76) are connected to the bus conductors on the input and output sides of the intermediate power converter. Each VHF unit supplies modulating pulses to RF amplifiers (82) of an AESA array of the radar apparatus.

US Patent:

60055316, Dec 21, 1999

Filed:

Sep 23, 1998

Appl. No.:

9/158827

Inventors:

John W. Cassen - Sykesville MD
Gary N. Bonadies - Laurel MD
Patrick K. Richard - Baltimore MD
David A. Herlihy - Ellicott City MD
Ayn U. Fuller - Greenbelt MD
Daniel H. Wenzlick - Linthicum MD
Richard C. Kapraun - Baltimore MD
Mark R. Schrote - Ellicott City MD
Kerry M. Yon - Beltsville MD
H. Halley Lisle - Monrovia MD
Toby Hess - Olney MD
Edward L. Rich - Arnold MD
George T. Hall - Catonsville MD
Brian T. Drude - Arbutus MD

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H01Q 2100

US Classification:

343853

Abstract:

An antenna assembly for an active electronically scanned array includes, among other things: an array of antenna elements; an RF signal feed and circulator assembly coupled to said antenna elements and forming thereby an array of radiating structures; a generally planar RF manifold assembly having regularly spaced openings therein located behind and normal to the radiating structures; an array of T/R modules connected to the array of radiating structures and having respective RF connector assemblies forming a portion of an RF interface at one end portion of each of the modules which project upwardly through said spaced openings in the RF manifold and wherein the respective connector assemblies thereof connect to at least one immediately adjacent circulator as well as to transmit and receive manifold portions of the RF manifold; each of the T/R modules further have a heat sink plate on the back side thereof which is positioned against one of a number of elongated liquid coolant circulating coldplates connected to a coolant distribution manifold encircling the array; a DC power and logic signal distribution manifold; and, a plurality of elongated DC/logic circuit board members connected to the DC power and logic signal distribution manifold and being respectively located adjacent and coextensive with a respective coldplate for supplying DC power and logic control signals to a DC/logic interface located at the other end portion of the respective modules.

US Patent:

60551623, Apr 25, 2000

Filed:

Mar 12, 1998

Appl. No.:

9/041213

Inventors:

Albert G. Tarrillo - Silver Spring MD
Dennis Schaefer - Middletown OH
Scott K. Suko - Elkridge MD
Edward L. Rich - Arnold MD
Keith L. Rowe - Cincinnati OH

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H02M 3335
H02M 7538

US Classification:

363 25

Abstract:

A DC-DC voltage converter 40, which is adaptable to VHF operation, has a power oscillator 52 to which a filtered input DC voltage 50 is applied for conversion to an output DC voltage. The power oscillator includes a push-pull amplifier 58, 60 and an impedance transformation circuit 62 to which the amplifier is connected. The power oscillator also includes a rectifier circuit 64 which is connected to the impedance transformation circuit. A feedback circuit 68 controls the frequency of the oscillator to regulate the output DC voltage. The oscillator frequency depends on the impedance values of oscillator circuit components and the values of a plurality of oscillator component intrinsic parameters.

US Patent:

42094917, Jun 24, 1980

Filed:

Dec 21, 1977

Appl. No.:

5/865017

Inventors:

Edward L. Rich - Arnold MD

Assignee:

Midori Anzen Company, Ltd. - Tokyo

International Classification:

B01J 700
A62B 708

US Classification:

422110

Abstract:

A control and monitoring system for an oxygen generation device having a plurality of chemical oxygen generation elements sequentially decomposed to continuously generate oxygen. The control and monitoring system has a temperature sensor operatively coupled to each of the chemical oxygen generation elements, except the one to be ignited last, for producing a first control signal in response to the heat generated by the chemical oxygen generation elements during decomposition, a gas flow sensor disposed in the oxygen outlet has the oxygen generation elements and responsive to a flow rate less than a predetermined minimum flow rate to produce a second control signal, a sequential ignition mechanism operated on the occurrence of both the first control signal and the second control signal, as an ignition signal for igniting the oxygen generation elements one after another, and an alarm operative in response to the second control signal after a time interval of not less than a predetermined magnitude for indicating the interruption of oxygen generation for an abnormally long time interval. Preferably, light emitter indicator means are provided to indicate ignition of the corresponding oxygen generating element.

US Patent:

49672010, Oct 30, 1990

Filed:

Oct 22, 1987

Appl. No.:

7/111328

Inventors:

Edward L. Rich - Arnold MD

Assignee:

Westinghouse Electric Corp. - Pittsburgh PA

International Classification:

H05K 720

US Classification:

342175

Abstract:

A microwave transmit/receive module comprises a single multi-layer substrate having at least two opposed mounting surfaces. The substrate including a plurality of integrated dielectric layers, electrical conductors and thermal conductors selectively interconnected between the layers of the substrate. A microwave signal processing means is mounted on at least one of the mounting surfaces of the substrate for processing microwave radar signals. A control signal processing means is mounted on at least one of the mounting surfaces of the substrate for providing control signals for the microwave signal processing means via selected electrical conductors. A power conditioning means is mounted on at least one of the mounting surfaces of the substrate for providing power to the microwave signal processing means and the control signal processing means via selected electrical conductors. A heat sink interface means coupled to the thermal conductors is mounted on at least one of the mounting surfaces of the substrate in thermal proximity selected portions of the microwave signal processing means, the power conditioning means and the control signal processing means for conducting thermal energy away therefrom via selected thermal conductors. An optical interface interface as well as an integrated coaxial cable carrying power, control and microwave signals for the module.

US Patent:

60941618, Jul 25, 2000

Filed:

Dec 8, 1999

Appl. No.:

9/456407

Inventors:

John W. Cassen - Sykesville MD
Stephanie A. Parks - Helston, GB
Edward L. Rich - Arnold MD
Gary N. Bonadies - Laurel MD
Gary L. Ferrell - Pasadena MD
John S. Fisher - Ellicott City MD
John W. Gipprich - Millersville MD
John D. Gornto - Columbia MD
Daniel J. Heffernan - Severna Park MD
David A. Herlihy - Ellicott City MD
Andrew J. Piloto - San Diego CA
Patrick K. Richard - Baltimore MD
David W. Strack - Baltimore MD
Scott K. Suko - Elkridge MD

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

G01S 728

US Classification:

342175

Abstract:

Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. The MMICs which generate substantially all of the heat are located in multi-level cavities formed in the substrate and are bonded directly to a generally flat a heat sink plate which is secured to the bottom of the substrate and acts as a thermal interface to an external heat exchanger such as a cold plate.

US Patent:

45076405, Mar 26, 1985

Filed:

Nov 26, 1982

Appl. No.:

6/444637

Inventors:

Edward L. Rich - Arnold MD
Yucel Y. Yalim - Coral Springs FL

Assignee:

Westinghouse Electric Co. - Pittsburgh PA

International Classification:

H01F 2728

US Classification:

336223

Abstract:

A high frequency, transformer capable of operating at high power levels is disclosed. Conductive ribbons including end (terminal) sections which permit the terminal leads of a plurality of windings to be extended from the windings in an overlapping relationship and in the selected order is utilized for the windings. Preferably, the core is formed of a material having low eddy current losses and characteristics permitting the core to be molded such that the windings are substantially surrounded by the core with the exception of small openings through which the leads extend.