Edward F Stephens

US Patent:

7656915, Feb 2, 2010

Filed:

Jul 26, 2006

Appl. No.:

11/493228

Inventors:

Steven M. Coleman - Bedford NH, US
Edward F. Stephens - Golden Eagle IL, US

Assignee:

Northrop Grumman Space & Missions Systems Corp. - Los Angeles CA

International Classification:

H01S 3/04

US Classification:

372 35, 372 34, 372 36

Abstract:

A laser diode package includes a laser diode, a cooler, and a metallization layer. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets and a highly thermally-conductive sheet. The ceramic sheets are fused together and the thermally-conductive sheet is attached to a top ceramic sheet of the plurality of ceramic sheets. The metallization layer has at least a portion on the thermally-conductive sheet. The portion is electrically coupled to the laser diode for conducting the electrical energy to the laser diode.

US Patent:

7957439, Jun 7, 2011

Filed:

Dec 1, 2009

Appl. No.:

12/628842

Inventors:

Edward F. Stephens - Golden Eagle IL, US
Steven M. Coleman - Bedford NH, US

Assignee:

Northrop Grumman Space & Missions - Los Angeles CA

International Classification:

H01S 3/04

US Classification:

372 35, 372 34, 372 36

Abstract:

A laser diode package includes a laser diode, a cooler, and a metallization layer. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets and a highly thermally-conductive sheet. The ceramic sheets are fused together and the thermally-conductive sheet is attached to a top ceramic sheet of the plurality of ceramic sheets. The metallization layer has at least a portion on the thermally-conductive sheet. The portion is electrically coupled to the laser diode for conducting the electrical energy to the laser diode.

US Patent:

20060203866, Sep 14, 2006

Filed:

Mar 10, 2005

Appl. No.:

11/077466

Inventors:

Edward Stephens - Golden Eagle IL, US

International Classification:

H01S 5/00

US Classification:

372043010

Abstract:

A laser diode assembly has a laser diode. The laser diode has an emitting surface and a reflective surface opposing the emitting surface. The laser diode has first and second side surfaces between the emitting and reflective surfaces. A first electrically-insulating heat sink is attached to the first side surface of the laser diode via a first solder bond, and the first heat sink has a first cooling channel. A second electrically-insulating heat sink is attached to the second side surface of the laser diode via a second solder bond, and the second electrically-insulating heat sink has a second cooling channel. A substrate has a top side and a bottom side, and the top side being in communication with a first bottom side of the first electrically-insulating heat sink and a second bottom side of the second electrically-insulating heat sink. The substrate has a flow channel system for passing a coolant to the first cooling channel and the second cooling channel. A metallization layer is attached to the first electrically-insulating heat sink and the second electrically-insulating heat sink. The metallization layer is electrically coupled to the laser diode and conducts electrical current to the laser diode. The metallization layer is isolated from the coolant.

US Patent:

20080056314, Mar 6, 2008

Filed:

Aug 31, 2006

Appl. No.:

11/515093

Inventors:

Steven M. Coleman - Bedford NH, US
Edward F. Stephens - Golden Eagle IL, US

International Classification:

H01S 3/04

US Classification:

372 36

Abstract:

A system includes a laser-diode bar comprising an emitting surface and a reflective surface opposing the emitting surface. The laser-diode bar includes a positive-side surface and a negative-side surface opposing the positive-side surface for conducting electrical energy through laser-diode bar. The system also includes a heat sink thermally coupled to the laser-diode bar. The heat sink is made of a material selected from the group consisting of Skeleton-cemented diamond and diamond-copper composite. The system also includes a heat spreader interposed between the heat sink and the laser-diode bar. The heat spreader includes a first surface thermally interfacing the positive-side surface of the laser-diode bar. The first surface is substantially smoother than a surface on the heat sink and includes an electrically conductive material for conducting the electrical energy into the laser-diode bar.

US Patent:

20080069160, Mar 20, 2008

Filed:

Nov 9, 2007

Appl. No.:

11/983601

Inventors:

Edward Stephens - Golden Eagle IL, US

International Classification:

H01S 3/04

US Classification:

372035000

Abstract:

A laser diode assembly has a laser diode. The laser diode has an emitting surface and a reflective surface opposing the emitting surface. The laser diode has first and second side surfaces between the emitting and reflective surfaces. A first electrically-insulating heat sink is attached to the first side surface of the laser diode via a first solder bond, and the first heat sink has a first cooling channel. A second electrically-insulating heat sink is attached to the second side surface of the laser diode via a second solder bond, and the second electrically-insulating heat sink has a second cooling channel. A substrate has a top side and a bottom side, and the top side being in communication with a first bottom side of the first electrically-insulating heat sink and a second bottom side of the second electrically-insulating heat sink. The substrate has a flow channel system for passing a coolant to the first cooling channel and the second cooling channel. A metallization layer is attached to the first electrically-insulating heat sink and the second electrically-insulating heat sink. The metallization layer is electrically coupled to the laser diode and conducts electrical current to the laser diode. The metallization layer is isolated from the coolant.