Elizabeth M Foster

US Patent:

6528218, Mar 4, 2003

Filed:

Mar 14, 2001

Appl. No.:

09/808334

Inventors:

Elizabeth Foster - Friendsville PA
Gary A. Johansson - Hockessin DE
Heike Marcello - Brackney PA
David J. Russell - Apalachin NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G03F 711

US Classification:

430 14, 430315, 4302801, 430 16, 430 18

Abstract:

A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110Â C. A photoimageable dielectric film is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier; from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20Â C. ) comprising: from about 85% to about 99. 9% epoxy resins; and from about 0. 1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0 to about 5% solvent; applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.

US Patent:

6706464, Mar 16, 2004

Filed:

Jan 16, 2003

Appl. No.:

10/345561

Inventors:

Elizabeth Foster - Friendsville PA
Gary A. Johansson - Hockessin DE
Heike Marcello - Brackney PA
David J. Russell - Apalachin NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G03F 740

US Classification:

430315, 4302721

Abstract:

A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110Â C. A photoimageable dielectric film, is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier, from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20Â C. comprising: from about 85% to about 99. 9% epoxy resins; and from about 0. 1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0 to about 5% solvent, applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.

US Patent:

6835533, Dec 28, 2004

Filed:

Feb 18, 2004

Appl. No.:

10/781073

Inventors:

Elizabeth Foster - Friendsville PA
Gary A. Johansson - Hockessin DE
Heike Marcello - Brackney PA
David J. Russell - Apalachin NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G03F 7038

US Classification:

4302801, 430260, 522146, 522166

Abstract:

A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110Â C. A photoimageable dielectric film is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier; from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20Â C. ) comprising: from about 85% to about 99. 9% epoxy resins; and from about 0. 1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0% to about 5% solvent; applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.

US Patent:

7063762, Jun 20, 2006

Filed:

Aug 20, 2003

Appl. No.:

10/643909

Inventors:

Elizabeth Foster - Friendsville PA, US
Gregory Kevern - Endwell NY, US
Anita Sargent - Endwell NY, US

Assignee:

Endicott Interconnect Technologies, Inc. - Endicott NY

International Classification:

H05K 3/38

US Classification:

156150, 156151, 427 961, 427 984, 427 985, 427 991, 427 995, 427123, 427304, 427305, 4274431

Abstract:

A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e. g. , Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating. The resulting product is thus able to provide extremely narrow conductive circuitry for subsequent connections, e. g. , to a semiconductor chip. Electroless plating is the preferred plating method with the dielectric immersed in a solution of conductive monomers, e. g. , pyrrole monomer, the solution also possibly containing a seed material such as palladium-tin.

US Patent:

7332212, Feb 19, 2008

Filed:

Oct 5, 2005

Appl. No.:

11/242841

Inventors:

Elizabeth Foster - Friendsville PA, US
Gregory Kevern - Endwell NY, US
Anita Sargent - Endwell NY, US

Assignee:

Endicott Interconnect Technologies, Inc. - Endicott NY

International Classification:

B32B 3/00
H05K 1/02

US Classification:

428209, 428901, 174258, 174259, 252510, 252511, 252514

Abstract:

A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e. g. , Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating. The resulting product is thus able to provide extremely narrow conductive circuitry for subsequent connections, e. g. , to a semiconductor chip. Electroless plating is the preferred plating method with the dielectric immersed in a solution of conductive monomers, e. g. , pyrrole monomer, the solution also possibly containing a seed material such as palladium-tin.

US Patent:

58241574, Oct 20, 1998

Filed:

Sep 6, 1995

Appl. No.:

8/523881

Inventors:

Elizabeth F. Foster - Friendsville PA
Jeffrey C. Hedrick - Park Ridge NJ
Robert M. Japp - Vestal NY
Konstantinos Papathomas - Endicott NY
Stephen L. Tisdale - Enowell NY
Alfred Viehbeck - Fishkill NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05C 312

US Classification:

118419

Abstract:

The invention involves a fluid treatment device to solution or melt impregnate a resin or polymer or any combination thereof into a reinforcement which can be utilized to fabricate composite materials for laminates, circuit boards, structural/aerospace materials, automotive components, etc. The invention offers significant advantages and benefits over existing methods and equipment and allows the impregnation process to be performed at lower cost and higher efficiency with increased environmental safety.

US Patent:

58633324, Jan 26, 1999

Filed:

Dec 19, 1996

Appl. No.:

8/770058

Inventors:

Elizabeth Foster - Friendsville PA
Jeffrey Curtis Hedrick - Park Ridge NJ
Robert Maynard Japp - Vestal NY
Kostas Papathomas - Endicott NY
Stephen Leo Tisdale - Endwell NY
Alfred Viehbeck - Austin TX

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05C 504

US Classification:

118314

Abstract:

The invention involves a fluid treatment device and fluid treatment method to solution or melt coat or impregnate a resin or polymer to a predetermined, metered thickness into a substrate. The invention is effective in impregnating or coating various substrates in both a continuous or batch process on one side, two sides, or in the case of a porous substrate, penetration and complete saturation is possible. The invention offers significant advantages and benefits over existing methods and equipment and allows the coating or impregnation process to be performed at lower cost and higher efficiency with increased environmental safety.

US Patent:

57256683, Mar 10, 1998

Filed:

Dec 19, 1996

Appl. No.:

8/770067

Inventors:

Elizabeth F. Foster - Friendsville PA
Jeffrey C. Hedrick - Park Ridge NJ
Stephen L. Tisdale - Endwell NY
Alfred Viehbeck - Fishkill NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05C 104

US Classification:

118411

Abstract:

An apparatus for applying a fluid to an outer surface of an elongated work piece having a longitudinal axis and a cross sectional shape, perpendicular to the longitudinal axis. The apparatus has a head member having an interior wall cross sectional shape adapted for receiving the cross sectional shape of the elongated work piece. The interior cross sectional shape defines an interior wall of the head member. The head member has an input end and an output end. The interior wall has means for applying the fluid to a surface of said elongated member. The head member has preferable a first part and a second part which are joined by an expandable member. The means for applying said fluid comprises a plurality of jets for directing said fluid on said surface and a plurality of output parts for recovering said fluid for applying a fluid to an outer surface, said elongated work piece having a longitudinal axis and a cross sectional shape, perpendicular to said longitudinal axis, comprising: a head member having an interior wall cross sectional shape adapted for receiving said cross sectional shape of said elongated work piece; said interior cross sectional shape defining an interior wall of said head member; said head member has an input end and an output end; said interior wall has means for applying said fluid to a surface of said elongated member.