Elizabeth L Hoang

US Patent:

20130136858, May 30, 2013

Filed:

Nov 29, 2011

Appl. No.:

13/305936

Inventors:

Gyanendra DUTT - Garden Grove CA, US
Dung PHAN - Long Beach CA, US
YounSang KIM - Irvine CA, US
Elizabeth HOANG - Orange CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

B05D 5/10
B05C 11/08
B05C 11/04
B05D 1/40

US Classification:

4272071, 118 52

Abstract:

A spin coating apparatus for applying adhesive to a substrate includes: a rotatable chuck configured to receive and hold a substrate thereon; a nozzle positioned above the rotatable chuck and configured to dispense the adhesive onto a surface of the substrate; a containment pan surrounding the rotatable chuck and configured to contain excess adhesive; a collection container in fluid communication with the containment pan; and a removal device positioned within the containment pan configured to direct the excess adhesive into the collection container.

US Patent:

20190096822, Mar 28, 2019

Filed:

Nov 13, 2018

Appl. No.:

16/188492

Inventors:

- Duesseldorf, DE
Xinpei Cao - Irvine CA, US
Derek Wyatt - Mission Viejo CA, US
Qizhuo Zhuo - Irvine CA, US
Elizabeth Hoang - Orange CA, US

International Classification:

H01L 23/552
H01L 21/3205
H01L 21/56
H01B 1/22
C09D 163/00
C09D 5/24
C09D 5/32
C09D 7/40

Abstract:

Provided herein are conductive formulations which are useful for applying conductive material to a suitable substrate; the resulting coated articles have improved EMI shielding performance relative to articles coated with prior art formulations employing prior art methods. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. Specifically, invention methods utilize capillary flow to substantially fill any gaps in the coating on the surface of an electronic package. Effective EMI shielding has been demonstrated with very thin coating thickness.

US Patent:

20140225283, Aug 14, 2014

Filed:

Mar 15, 2013

Appl. No.:

13/833634

Inventors:

- Rocky Hill CT, US
Qizhuo Zhuo - Irvine CA, US
Elizabeth Hoang - Orange CA, US
Stephen Ruatta - South Pasadena CA, US

Assignee:

HENKEL CORPORATION - Rocky Hill CT

International Classification:

H01L 23/488

US Classification:

257783, 438118

Abstract:

A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.