Eric A Browne

US Patent:

20210134703, May 6, 2021

Filed:

Dec 21, 2020

Appl. No.:

17/128731

Inventors:

- Cambridge MA, US
James Paul Smith - Chelmsford MA, US
Eric A. Browne - Westford MA, US

International Classification:

H01L 23/473
F28D 1/02
F28F 3/12
F28F 13/06
H01L 21/48
H05K 7/20

Abstract:

The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.

US Patent:

20200312746, Oct 1, 2020

Filed:

Apr 9, 2020

Appl. No.:

16/844446

Inventors:

- Cambridge MA, US
Eric A. Browne - Westford MA, US

International Classification:

H01L 23/473

Abstract:

The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.

US Patent:

20200168526, May 28, 2020

Filed:

Dec 12, 2019

Appl. No.:

16/712316

Inventors:

- Cambridge MA, US
James Paul Smith - Chelmsford MA, US
Eric A. Browne - Westford MA, US

International Classification:

H01L 23/473
H05K 7/20
H01L 21/48
F28F 13/06
F28F 3/12
F28D 1/02

Abstract:

The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.

US Patent:

20200027819, Jan 23, 2020

Filed:

Jul 19, 2018

Appl. No.:

16/039492

Inventors:

- Cambridge MA, US
Eric A. Browne - Westford MA, US

International Classification:

H01L 23/473

Abstract:

The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.

US Patent:

20190029105, Jan 24, 2019

Filed:

Jul 17, 2018

Appl. No.:

16/037082

Inventors:

- Cambridge MA, US
Eric A. Browne - Westford MA, US
Kenneth L. Smith - Littleton MA, US

International Classification:

H05K 1/02
H05K 7/20
H01L 23/473

Abstract:

The present invention generally relates to an array backframe with integral manifolding for high performance fluid cooling of devices. The integral manifolding of the array backframe is designed to perform three functions. First, the array backframe parallelizes the fluid paths to provide uniform, cool supply fluid to every device in the array. Second, the array backframe minimizes the parasitic heat losses between supply and exhaust by use of an isolation cavity. Third, the array backframe collapses hundreds of fluid lines into a single internal manifold to enhance modularity while also serving as a structural support member.

US Patent:

20190013258, Jan 10, 2019

Filed:

Oct 30, 2017

Appl. No.:

15/797784

Inventors:

- Cambridge MA, US
James Paul Smith - Chelmsford MA, US
Eric A. Browne - Westford MA, US

International Classification:

H01L 23/473
F28F 3/12
F28F 13/06
F28D 1/02
H01L 21/48
H05K 7/20

Abstract:

The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.

US Patent:

20150216080, Jul 30, 2015

Filed:

Jan 30, 2014

Appl. No.:

14/168206

Inventors:

- Schenectady NY, US
Stefan Schroeder - Munich, DE
Piniwan Thiwanka Bandara Wijekoon - Munich, DE
Eric Ayres Browne - Latham NY, US

Assignee:

General Electric Company - Schenectady NY

International Classification:

H05K 7/20
F28D 15/02

Abstract:

A subsea power module includes an outer pressure compensated vessel defining an interior chamber and one or more heat generating electrical components disposed within the interior chamber. The outer pressure compensated vessel is configured to maintain a pressure within the interior chamber substantially the same as an ambient pressure outside the outer pressure compensated vessel. Each of the electrical components may be disposed within an inner chamber of a pressure vessel disposed within the interior chamber of the outer pressure compensated vessel. Each of the one or more heat generating electrical components is configured to transfer heat generated within the interior chamber of the outer pressure compensated vessel through the wall defining the interior chamber to a fluid, such as seawater, surrounding the outer pressure compensated vessel.

US Patent:

20140160677, Jun 12, 2014

Filed:

Dec 10, 2012

Appl. No.:

13/709469

Inventors:

- Schenectady NY, US
Raj Bahadur - Schenectady NY, US
Eric Ayres Browne - Watervliet NY, US
Gary Dwayne Mandrusiak - Latham NY, US

Assignee:

GENERAL ELECTRIC COMPANY - Schenectady NY

International Classification:

F28F 13/18
H01L 23/46
H05K 7/20
H01L 21/50

US Classification:

361689, 438122, 165133, 16510421, 16510433

Abstract:

An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.