Eric A Browne

US Patent:

20210134703, May 6, 2021

Filed:

Dec 21, 2020

Appl. No.:

17/128731

Inventors:

- Cambridge MA, US
James Paul Smith - Chelmsford MA, US
Eric A. Browne - Westford MA, US

International Classification:

H01L 23/473
F28D 1/02
F28F 3/12
F28F 13/06
H01L 21/48
H05K 7/20

Abstract:

The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.

US Patent:

20200168526, May 28, 2020

Filed:

Dec 12, 2019

Appl. No.:

16/712316

Inventors:

- Cambridge MA, US
James Paul Smith - Chelmsford MA, US
Eric A. Browne - Westford MA, US

International Classification:

H01L 23/473
H05K 7/20
H01L 21/48
F28F 13/06
F28F 3/12
F28D 1/02

Abstract:

The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.

US Patent:

20190013258, Jan 10, 2019

Filed:

Oct 30, 2017

Appl. No.:

15/797784

Inventors:

- Cambridge MA, US
James Paul Smith - Chelmsford MA, US
Eric A. Browne - Westford MA, US

International Classification:

H01L 23/473
F28F 3/12
F28F 13/06
F28D 1/02
H01L 21/48
H05K 7/20

Abstract:

The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.