Eric Doneil Cooper

US Patent:

6767427, Jul 27, 2004

Filed:

Jun 7, 2001

Appl. No.:

09/876451

Inventors:

Joseph W. Walters - Orlando FL
Emil Kneer - Orlando FL
Eric Cooper - Orlando FL
Richard Grizzard - Casselberry FL

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 700

US Classification:

15634512, 451 66, 451443

Abstract:

A method and apparatus for conditioning a polishing pad used in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a non-rotatable conditioning member configured to engage the polishing pad. The conditioning member includes a primary edge opposed to a secondary edge. The method includes providing a non-rotatable conditioning member configured to engage the polishing pad. The conditioning member includes a primary edge opposed to a secondary edge, wherein the primary edge and the secondary edge are both in contact with the polishing pad, and wherein the primary edge is generally parallel to the secondary edge. The method also includes moving the polishing pad in a forward direction, and pressing the conditioning member against the polishing pad.

Address:

1200 Destiny Jo Ct, Pleasant Garden, NC 27313

VIN:

1GNFC130X7R282292

Make:

CHEV

Model:

TAHO

Year:

2007